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| dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Data Sheet High-Performance, 16-bit Digital Signal Controllers (c) 2011 Microchip Technology Inc. DS70283H Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-836-8 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70283H-page 2 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 High-Performance, 16-bit Digital Signal Controllers Operating Range: * Up to 40 MIPS operation (@ 3.0-3.6V): - Industrial temperature range (-40C to +85C) - Extended temperature range (-40C to +125C) * Up to 20 MIPS operation (@ 3.0-3.6V) - High temperature range (-40C to +150C) Interrupt Controller: * * * * * 5-cycle latency Up to 26 available interrupt sources Up to three external interrupts Seven programmable priority levels Four processor exceptions High-Performance DSC CPU: * * * * * * * * * Modified Harvard architecture C compiler optimized instruction set 16-bit wide data path 24-bit wide instructions Linear program memory addressing up to 4M instruction words Linear data memory addressing up to 64 Kbytes 83 base instructions: mostly 1 word/1 cycle Two 40-bit accumulators with rounding and saturation options Flexible and powerful addressing modes: - Indirect - Modulo - Bit-reversed Software stack 16 x 16 fractional/integer multiply operations 32/16 and 16/16 divide operations Single-cycle multiply and accumulate: - Accumulator write back for DSP operations - Dual data fetch Up to 16-bit shifts for up to 40-bit data Digital I/O: Peripheral pin Select functionality Up to 35 programmable digital I/O pins Wake-up/Interrupt-on-Change for up to 31 pins Output pins can drive from 3.0V to 3.6V Up to 5.5V output with open drain configuration on 5V tolerant pins with external pull-up * 4 mA sink on all I/O pins * * * * * On-Chip Flash and SRAM: * Flash program memory (up to 32 Kbytes) * Data SRAM (2 Kbytes) * Boot and General Security for program Flash System Management: * Flexible clock options: - External, crystal, resonator, internal RC - Fully integrated Phase-Locked Loop (PLL) - Extremely low jitter PLL * Power-up Timer * Oscillator Start-up Timer/Stabilizer * Watchdog Timer with its own RC oscillator * Fail-Safe Clock Monitor * Reset by multiple sources * * * * * Timers/Capture/Compare/PWM: * Timer/Counters, up to three 16-bit timers - Can pair up to make one 32-bit timer - One timer runs as Real-Time Clock with external 32.768 kHz oscillator - Programmable prescaler * Input Capture (up to four channels): - Capture on up, down or both edges - 16-bit capture input functions - 4-deep FIFO on each capture * Output Compare (up to two channels): - Single or Dual 16-Bit Compare mode - 16-bit Glitchless PWM mode Power Management: * On-chip 2.5V voltage regulator * Switch between clock sources in real time * Idle, Sleep and Doze modes with fast wake-up (c) 2011 Microchip Technology Inc. DS70283H-page 3 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Motor Control Peripherals: * 6-channel 16-bit Motor Control PWM: - Three duty cycle generators - Independent or Complementary mode - Programmable dead time and output polarity - Edge-aligned or center-aligned - Manual output override control - One Fault input - Trigger for ADC conversions - PWM frequency for 16-bit resolution (@ 40 MIPS) = 1220 Hz for Edge-Aligned mode, 610 Hz for Center-Aligned mode - PWM frequency for 11-bit resolution (@ 40 MIPS) = 39.1 kHz for Edge-Aligned mode, 19.55 kHz for Center-Aligned mode * 2-channel 16-bit Motor Control PWM: - One duty cycle generator - Independent or Complementary mode - Programmable dead time and output polarity - Edge-aligned or center-aligned - Manual output override control - One Fault input - Trigger for ADC conversions - PWM frequency for 16-bit resolution (@ 40 MIPS) = 1220 Hz for Edge-Aligned mode, 610 Hz for Center-Aligned mode - PWM frequency for 11-bit resolution (@ 40 MIPS) = 39.1 kHz for Edge-Aligned mode, 19.55 kHz for Center-Aligned mode * Quadrature Encoder Interface module: - Phase A, Phase B and index pulse input - 16-bit up/down position counter - Count direction status - Position Measurement (x2 and x4) mode - Programmable digital noise filters on inputs - Alternate 16-bit Timer/Counter mode - Interrupt on position counter rollover/underflow CMOS Flash Technology: * * * * * Low-power, high-speed Flash technology Fully static design 3.3V (10%) operating voltage Industrial and Extended temperature Low power consumption Communication Modules: * 4-wire SPI: - Framing supports I/O interface to simple codecs - Supports 8-bit and 16-bit data - Supports all serial clock formats and sampling modes * I2CTM: - Full Multi-Master Slave mode support - 7-bit and 10-bit addressing - Bus collision detection and arbitration - Integrated signal conditioning - Slave address masking * UART: - Interrupt on address bit detect - Interrupt on UART error - Wake-up on Start bit from Sleep mode - 4-character TX and RX FIFO buffers - LIN bus support - IrDA(R) encoding and decoding in hardware - High-Speed Baud mode - Hardware Flow Control with CTS and RTS Packaging: * 28-pin SDIP/SOIC/QFN-S * 44-pin QFN/TQFP Note: See Table 1 for the exact peripheral features per device. Analog-to-Digital Converters (ADCs): * 10-bit, 1.1 Msps or 12-bit, 500 ksps conversion: - Two and four simultaneous samples (10-bit ADC) - Up to nine input channels with auto-scanning - Conversion start can be manual or synchronized with one of four trigger sources - Conversion possible in Sleep mode - 2 LSb max integral nonlinearity - 1 LSb max differential nonlinearity DS70283H-page 4 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Product Families The device names, pin counts, memory sizes and peripheral availability of each device are listed below. The following pages show their pinout diagrams. TABLE 1: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CONTROLLER FAMILIES Program Flash Memory (Kbyte) Remappable Peripherals Quadrature Encoder Interface External Interrupts(3) 10-Bit/12-Bit ADC Motor Control PWM Remappable Pins RAM (Kbyte) Output Compare Standard PWM Input Capture 16-bit Timer dsPIC33FJ32MC202 28 32 2 16 3(1) 4 2 6ch(2) 2ch(2) 6ch(2) 2ch(2) 6ch(2) 2ch(2) SPI Device Pins UART 1 1 3 1 1ADC, 6 ch 1ADC, 9 ch 1ADC, 9 ch 1 21 SDIP SOIC SSOP QFN-S QFN TQFP QFN TQFP dsPIC33FJ32MC204 dsPIC33FJ16MC304 Note 1: 2: 3: 44 44 32 16 2 2 26 26 3(1) 3(1) 4 4 2 2 1 1 1 1 3 3 1 1 1 1 35 35 Only two out of three timers are remappable. Only PWM fault inputs are remappable. Only two out of three interrupts are remappable. (c) 2011 Microchip Technology Inc. DS70283H-page 5 Packages I/O Pins I2CTM dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Pin Diagrams 28-PIN SDIP, SOIC, SSOP = Pins are up to 5V tolerant MCLR AN0/VREF+/CN2/RA0 AN1/VREF-/CN3/RA1 PGED1/AN2/C2IN-/RP0(1)/CN4/RB0 PGEC1/AN3/C2IN+/RP1(1)/CN5/RB1 AN4/RP2(1)/CN6/RB2 AN5/RP3(1)/CN7/RB3 VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 SOSCI/RP4(1)/CN1/RB4 SOSCO/T1CK/CN0/RA4 VDD PGED3/ASDA1/RP5(1)/CN27/RB5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS PWM1L1/RP15(1)/CN11/RB15 PWM1H1/RP14(1)/CN12/RB14 PWM1L2/RP13(1)/CN13/RB13 PWM1H2/RP12(1)/CN14/RB12 PGEC2/TMS/PWM1L3/RP11(1)/CN15/RB11 PGED2/TDI/PWM1H3/RP10(1)/CN16/RB10 VCAP VSS TDO/PWM2L1/SDA1/RP9(1)/CN21/RB9 TCK/PWM2H1/SCL1/RP8(1)/CN22/RB8 INT0/RP7/CN23/RB7 PGEC3/ASCL1/RP6(1)/CN24/RB6 dsPIC33FJ32MC202 28-Pin QFN-S(2) AVSS PWM1L1/RP15(1)/CN11/RB15 PWM1H1/RP14(1)/CN12/RB14 = Pins are up to 5V tolerant AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR PGED1/EMUD1/AN2/C2IN-/RP0(1)/CN4/RB0 PGEC1/EMUC1/AN3/C2IN+/RP1(1)/CN5/RB1 AN4/RP2(1)/CN6/RB2 AN5/RP3(1)/CN7/RB3 VSS 28 27 26 25 24 23 22 1 2 3 4 21 20 19 PWM1L2/RP13(1)/CN13/RB13 PWM1H2/RP12(1)/CN14/RB12 PGEC2/EMUC2/TMS/PWM1L3/RP11(1)/CN15/RB11 PGED2/EMUD2/TDI/PWM1H3/RP10(1)/CN16/RB10 VCAP VSS TDO/PWM2L1/SDA1/RP9(1)/CN21/RB9 dsPIC33FJ32MC202 18 17 16 15 8 SOSCI/RP4/CN1/RB4 9 10 11 12 13 14 PGED3/EMUD3/ASDA1/RP5(1)/CN27/RB5 PGEC3/EMUC3/ASCL1/RP6(1)/CN24/RB6 INT0/RP7(1)/CN23/RB7 TCK/PWM2H1/SCL1/RP8(1)/CN22/RB8 SOSCO/T1CK/CN0/RA4 VDD 5 OSC1/CLKI/CN30/RA2 6 OSC2/CLKO/CN29/RA3 7 Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals. 2: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally. AVDD DS70283H-page 6 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Pin Diagrams (Continued) 44-Pin QFN(2) = Pins are up to 5V tolerant PGEC1/EMUC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/EMUD1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 PWM1L1/RP15(1)/CN11/RB15 AN0/VREF+/CN2/RA0 PWM1H1/RP14(1)/CN12/RB14 22 21 20 19 18 17 16 15 14 13 12 AN4/RP2(1)/CN6/RB2 AN5/RP3(1)/CN7/RB3 AN6/RP16(1)/CN8/RC0 AN7/RP17 /CN9/RC1 AN8/RP18(1)/CN10/RC2 VDD VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 TDO/RA8 SOSCI/RP4(1)/CN1/RB4 (1) TMS/RA10 MCLR AVDD AVSS TCK/RA7 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 PGED3/EMUD3/ASDA1/RP5(1)/CN27/RB5 PGEC3/EMUC3/ASCL1/RP6(1)/CN24/RB6 INT0/RP7/CN23/RB7 TDI/RA9 SOSCO/T1CK/CN0/RA4 SCL1/RP8(1)/CN22/RB8 RP19(1)/CN28/RC3 RP20(1)/CN25/RC4 RP21(1)/CN26/RC5 VDD VSS 11 10 9 8 7 6 5 4 3 2 1 PWM1L2/RP13(1)/CN13/RB13 PWM1H2/RP12(1)/CN14/RB12 PGEC2/EMUC2/PWM1L3/RP11(1)/CN15/RB11 PGED2/EMUD2/PWM1H3/RP10(1)/CN16/RB10 VCAP VSS RP25/CN19/RC9 RP24/CN20/RC8 PWM2L1/RP23(1)/CN17/RC7 PWM2H1/RP22(1)/CN18/RC6 SDA1/RP9(1)/CN21/RB9 dsPIC33FJ32MC204 dsPIC33FJ16MC304 Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals. 2: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally. (c) 2011 Microchip Technology Inc. DS70283H-page 7 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Pin Diagrams (Continued) 44-Pin TQFP = Pins are up to 5V tolerant PGEC1/EMUC1/AN3/C2IN+/RP1(1)/CN5/RB1 PGED1/EMUD1/AN2/C2IN-/RP0(1)/CN4/RB0 AN1/VREF-/CN3/RA1 AN0/VREF+/CN2/RA0 MCLR AVDD AVSS PWM1L1/RP15(1)/CN11/RB15 PWM1H1/RP14(1)/CN12/RB14 TCK/RA7 TMS/RA10 12 13 14 15 16 17 18 19 20 21 22 Note 1: The RPn pins can be used by any remappable peripheral. See Table 1 for the list of available peripherals. SOSCO/T1CK/CN0/RA4 TDI/RA9 RP19/(1)CN28/RC3 RP20(1)/CN25/RC4 RP21(1)/CN26/RC5 VSS VDD PGED3/EMUD3/ASDA1/RP5(1)/CN27/RB5 PGEC3/EMUC3/ASCL1/RP6(1)/CN24/RB6 INT0/RP7(1)/CN23/RB7 SCL1/RP8(1)/CN22/RB8 34 35 36 37 38 39 40 41 42 43 44 AN4/RP2(1)/CN6/RB2 AN5/RP3(1)/CN7/RB3 AN6/RP16(1)/CN8/RC0 AN7/RP17(1)/CN9/RC1 AN8/RP18(1)/CN10/RC2 VDD VSS OSC1/CLKI/CN30/RA2 OSC2/CLKO/CN29/RA3 TDO/RA8 SOSCI/RP4(1)/CN1/RB4 23 24 25 26 27 28 29 30 31 32 33 dsPIC33FJ32MC204 dsPIC33FJ16MC304 11 10 9 8 7 6 5 4 3 2 1 PWM1L2/RP13(1)/CN13/RB13 PWM1H2/RP12(1)/CN14/RB12 PGEC2/EMUC2/PWM1L3/RP11(1)/CN15/RB11 PGED2/EMUD2/PWM1H3/RP10(1)/CN16/RB10 VCAP VSS RP25(1)/CN19/RC9 RP24(1)/CN20/RC8 PWM2L1/RP23(1)/CN17/RC7 PWM2H1/RP22(1)/CN18/RC6 SDA1/RP9(1)/CN21/RB9 DS70283H-page 8 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Table of Contents dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Product Families.................................................................................................. 5 1.0 Device Overview ........................................................................................................................................................................ 11 2.0 Guidelines for Getting Started with 16-bit Digital Signal Controllers .......................................................................................... 15 3.0 CPU............................................................................................................................................................................................ 19 4.0 Memory Organization ................................................................................................................................................................. 31 5.0 Flash Program Memory.............................................................................................................................................................. 57 6.0 Resets ....................................................................................................................................................................................... 63 7.0 Interrupt Controller ..................................................................................................................................................................... 71 8.0 Oscillator Configuration ............................................................................................................................................................ 103 9.0 Power-Saving Features............................................................................................................................................................ 113 10.0 I/O Ports ................................................................................................................................................................................... 119 11.0 Timer1 ...................................................................................................................................................................................... 145 12.0 Timer2/3 feature ...................................................................................................................................................................... 147 13.0 Input Capture............................................................................................................................................................................ 153 14.0 Output Compare....................................................................................................................................................................... 155 15.0 Motor Control PWM Module ..................................................................................................................................................... 159 16.0 Quadrature Encoder Interface (QEI) Module ........................................................................................................................... 173 17.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 179 18.0 Inter-Integrated CircuitTM (I2CTM).............................................................................................................................................. 185 19.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 193 20.0 10-bit/12-bit Analog-to-Digital Converter (ADC) ....................................................................................................................... 199 21.0 Special Features ...................................................................................................................................................................... 211 22.0 Instruction Set Summary .......................................................................................................................................................... 219 23.0 Development Support............................................................................................................................................................... 227 24.0 Electrical Characteristics .......................................................................................................................................................... 231 25.0 High Temperature Electrical Characteristics ............................................................................................................................ 279 26.0 Packaging Information.............................................................................................................................................................. 289 Appendix A: Revision History............................................................................................................................................................. 303 Index ................................................................................................................................................................................................. 313 The Microchip Web Site ..................................................................................................................................................................... 317 Customer Change Notification Service .............................................................................................................................................. 317 Customer Support .............................................................................................................................................................................. 317 Reader Response .............................................................................................................................................................................. 318 Product Identification System ............................................................................................................................................................ 319 (c) 2011 Microchip Technology Inc. DS70283H-page 9 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products DS70283H-page 10 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 1.0 DEVICE OVERVIEW Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. This document contains device-specific information for the following Digital Signal Controller (DSC) devices: * dsPIC33FJ32MC202 * dsPIC33FJ32MC204 * dsPIC33FJ16MC304 The dsPIC33F devices contain extensive Digital Signal Processor (DSP) functionality with a high performance 16-bit microcontroller (MCU) architecture. Figure 1-1 shows a general block diagram of the core and peripheral modules in the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. Table 1-1 lists the functions of the various pins shown in the pinout diagrams. (c) 2011 Microchip Technology Inc. DS70283H-page 11 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 1-1: PSV and Table Data Access Control Block Interrupt Controller 8 16 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 BLOCK DIAGRAM Y Data Bus X Data Bus PORTA 16 16 16 Data Latch Data Latch Y RAM Address Latch 16 PORTB 23 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic X RAM Address Latch 23 16 16 PORTC Address Latch Address Generator Units Program Memory EA MUX Data Latch 24 ROM Latch 16 Literal Data Remappable Pins 16 Instruction Decode and Control Control Signals to Various Blocks Timing Generation FRC/LPRC Oscillators Precision Band Gap Reference Voltage Regulator Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer Brown-out Reset Instruction Reg 16 DSP Engine 16 x 16 W Register Array 16 OSC2/CLKO OSC1/CLKI Divide Support 16-bit ALU 16 VCAP VDD, VSS MCLR Timers 1-3 UART1 SPI1 ADC1 OC/ PWM1-2 PWM 2 Ch IC1,2,7,8 CNx I2C1 QEI PWM 6 Ch Note: Not all pins or features are implemented on all device pinout configurations. See "Pin Diagrams" for the specific pins and features present on each device. DS70283H-page 12 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 1-1: Pin Name AN0-AN8 CLKI CLKO PINOUT I/O DESCRIPTIONS Pin Type I I O Buffer Type Analog ST/CMOS -- PPS No No No Analog input channels. External clock source input. Always associated with OSC1 pin function. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. 32.768 kHz low-power oscillator crystal input; CMOS otherwise. 32.768 kHz low-power oscillator crystal output. Change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. Capture inputs 1/2. Capture inputs 7/8. Compare Fault A input (for Compare Channels 1 and 2). Compare outputs 1 through 2. External interrupt 0. External interrupt 1. External interrupt 2. PORTA is a bidirectional I/O port. PORTB is a bidirectional I/O port. PORTC is a bidirectional I/O port. Timer1 external clock input. Timer2 external clock input. Timer3 external clock input. UART1 clear to send. UART1 ready to send. UART1 receive. UART1 transmit. Synchronous serial clock input/output for SPI1. SPI1 data in. SPI1 data out. SPI1 slave synchronization or frame pulse I/O. Synchronous serial clock input/output for I2C1. Synchronous serial data input/output for I2C1. Alternate synchronous serial clock input/output for I2C1. Alternate synchronous serial data input/output for I2C1. JTAG Test mode select pin. JTAG test clock input pin. JTAG test data input pin. JTAG test data output pin. Analog = Analog input; O = Output; P = Power I = Input Description OSC1 OSC2 SOSCI SOSCO CN0-CN30 IC1-IC2 IC7-IC8 OCFA OC1-OC2 INT0 INT1 INT2 RA0-RA4 RA7-RA10 RB0-RB15 RC0-RC9 T1CK T2CK T3CK U1CTS U1RTS U1RX U1TX SCK1 SDI1 SDO1 SS1 SCL1 SDA1 ASCL1 ASDA1 TMS TCK TDI TDO I I/O I O I I I I O I I I I/O I/O I/O I I I I O I O I/O I O I/O I/O I/O I/O I/O I I I O ST/CMOS -- ST/CMOS -- ST ST ST ST -- ST ST ST ST ST ST ST ST ST ST -- ST -- ST ST -- ST ST ST ST ST ST ST ST -- No No No No No Yes Yes Yes Yes No Yes Yes No No No No No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No No No No No No No No Legend: CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; PPS = Peripheral Pin Select (c) 2011 Microchip Technology Inc. DS70283H-page 13 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 1-1: Pin Name INDX QEA QEB UPDN FLTA1 PWM1L1 PWM1H1 PWM1L2 PWM1H2 PWM1L3 PWM1H3 FLTA2 PWM2L1 PWM2H1 PGED1 PGEC1 PGED2 PGEC2 PGED3 PGEC3 MCLR AVDD AVSS VDD VCAP VSS VREF+ VREF- PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type I I I O I O O O O O O I O O I/O I I/O I I/O I I/P P P P P P I I Buffer Type ST ST ST CMOS ST -- -- -- -- -- -- ST -- -- ST ST ST ST ST ST ST P P -- -- -- Analog Analog PPS Yes Yes Yes Yes Yes No No No No No No Yes No No No No No No No No No No No No No No No No Description Quadrature Encoder Index Pulse input. Quadrature Encoder Phase A input in QEI mode. Auxiliary Timer External Clock/Gate input in Timer mode. Quadrature Encoder Phase A input in QEI mode. Auxiliary Timer External Clock/Gate input in Timer mode. Position Up/Down Counter Direction State. PWM1 Fault A input. PWM1 Low output 1. PWM1 High output 1. PWM1 Low output 2. PWM1 High output 2. PWM1 Low output 3. PWM1 High output 3. PWM2 Fault A input. PWM2 Low output 1. PWM2 High output 1. Data I/O pin for programming/debugging communication channel 1. Clock input pin for programming/debugging communication channel 1. Data I/O pin for programming/debugging communication channel 2. Clock input pin for programming/debugging communication channel 2. Data I/O pin for programming/debugging communication channel 3. Clock input pin for programming/debugging communication channel 3. Master Clear (Reset) input. This pin is an active-low Reset to the device. Positive supply for analog modules. This pin must be connected at all times. Ground reference for analog modules. Positive supply for peripheral logic and I/O pins. CPU logic filter capacitor connection. Ground reference for logic and I/O pins. Analog voltage reference (high) input. Analog voltage reference (low) input. Analog = Analog input; O = Output; P = Power I = Input Legend: CMOS = CMOS compatible input or output; ST = Schmitt Trigger input with CMOS levels; PPS = Peripheral Pin Select DS70283H-page 14 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 2.0 GUIDELINES FOR GETTING STARTED WITH 16-BIT DIGITAL SIGNAL CONTROLLERS 2.2 Decoupling Capacitors The use of decoupling capacitors on every pair of power supply pins, such as VDD, VSS, AVDD and AVSS is required. Consider the following criteria when using decoupling capacitors: * Value and type of capacitor: Recommendation of 0.1 F (100 nF), 10-20V. This capacitor should be a low-ESR and have a resonance frequency in the range of 20 MHz and higher. It is recommended that ceramic capacitors be used. * Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended to place the capacitors on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace length from the pin to the capacitor is within one-quarter inch (6 mm) in length. * Handling high frequency noise: If the board is experiencing high frequency noise, upward of tens of MHz, add a second ceramic-type capacitor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 F to 0.001 F. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible. For example, 0.1 F in parallel with 0.001 F. * Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum thereby reducing PCB track inductance. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. 2.1 Basic Connection Requirements Getting started with the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of 16-bit Digital Signal Controllers (DSCs) requires attention to a minimal set of device pin connections before proceeding with development. The following is a list of pin names, which must always be connected: * All VDD and VSS pins (see Section 2.2 "Decoupling Capacitors") * All AVDD and AVSS pins (even if the ADC module is not used) (see Section 2.2 "Decoupling Capacitors") * VCAP (see Section 2.3 "CPU Logic Filter Capacitor Connection (Vcap)") * MCLR pin (see Section 2.4 "Master Clear (MCLR) Pin") * PGECx/PGEDx pins used for In-Circuit Serial ProgrammingTM (ICSPTM) and debugging purposes (see Section 2.5 "ICSP Pins") * OSC1 and OSC2 pins when external oscillator source is used (see Section 2.6 "External Oscillator Pins") Additionally, the following pins may be required: * VREF+/VREF- pins used when external voltage reference for ADC module is implemented Note: The AVDD and AVSS pins must be connected independent of the ADC voltage reference source. (c) 2011 Microchip Technology Inc. DS70283H-page 15 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 2-1: RECOMMENDED MINIMUM CONNECTION 0.1 F Ceramic 2.4 Master Clear (MCLR) Pin The MCLR pin provides for two specific device functions: * Device Reset * Device programming and debugging During device programming and debugging, the resistance and capacitance that can be added to the pin must be considered. Device programmers and debuggers drive the MCLR pin. Consequently, specific voltage levels (VIH and VIL) and fast signal transitions must not be adversely affected. Therefore, specific values of R and C will need to be adjusted based on the application and PCB requirements. VDD R R1 10 F VCAP VDD VSS MCLR C dsPIC33F VSS VDD VDD VSS AVDD AVSS VDD VSS 0.1 F Ceramic 0.1 F Ceramic 10 0.1 F Ceramic 0.1 F Ceramic For example, as shown in Figure 2-2, it is recommended that capacitor C is isolated from the MCLR pin during programming and debugging operations. Place the components shown in Figure 2-2 within one-quarter inch (6 mm) from the MCLR pin. 2.2.1 TANK CAPACITORS FIGURE 2-2: On boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor for integrated circuits including DSCs to supply a local power source. The value of the tank capacitor should be determined based on the trace resistance that connects the power supply source to the device, and the maximum current drawn by the device in the application. In other words, select the tank capacitor so that it meets the acceptable voltage sag at the device. Typical values range from 4.7 F to 47 F. EXAMPLE OF MCLR PIN CONNECTIONS VDD R R1 MCLR JP C dsPIC33F 2.3 CPU Logic Filter Capacitor Connection (VCAP) Note 1: A low-ESR (<5 Ohms) capacitor is required on the VCAP pin, which is used to stabilize the voltage regulator output voltage. The VCAP pin must not be connected to VDD, and must have a capacitor between 4.7 F and 10 F, 16V connected to ground. The type can be ceramic or tantalum. Refer to Section 24.0 "Electrical Characteristics" for additional information. The placement of this capacitor should be close to the VCAP. It is recommended that the trace length not exceed one-quarter inch (6 mm). Refer to Section 21.2 "On-Chip Voltage Regulator" for details. R 10 k is recommended. A suggested starting value is 10 k. Ensure that the MCLR pin VIH and VIL specifications are met. R1 470W will limit any current flowing into MCLR from the external capacitor C, in the event of MCLR pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin VIH and VIL specifications are met. 2: DS70283H-page 16 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 2.5 ICSP Pins 2.6 External Oscillator Pins The PGECx and PGEDx pins are used for In-Circuit Serial Programming (ICSP) and debugging purposes. It is recommended to keep the trace length between the ICSP connector and the ICSP pins on the device as short as possible. If the ICSP connector is expected to experience an ESD event, a series resistor is recommended, with the value in the range of a few tens of Ohms, not to exceed 100 Ohms. Pull-up resistors, series diodes and capacitors on the PGECx and PGEDx pins are not recommended as they will interfere with the programmer/debugger communications to the device. If such discrete components are an application requirement, they should be removed from the circuit during programming and debugging. Alternatively, refer to the AC/DC characteristics and timing requirements information in the respective device Flash programming specification for information on capacitive loading limits and pin input voltage high (VIH) and input low (VIL) requirements. Ensure that the "Communication Channel Select" (i.e., PGECx/PGEDx pins) programmed into the device matches the physical connections for the ICSP to MPLAB(R) ICD 2, MPLAB ICD 3 or MPLAB REAL ICETM in-circuit emulator. For more information on MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL ICETM in-circuit emulator connection requirements, refer to the following documents that are available on the Microchip website. * "MPLAB ICD 2 In-Circuit Debugger User's Guide" DS51331 * "Using MPLAB(R) ICD 2" (poster) DS51265 * "MPLAB(R) ICD 2 Design Advisory" DS51566 * "Using MPLAB(R) ICD 3" (poster) DS51765 * "MPLAB(R) ICD 3 Design Advisory" DS51764 * "MPLAB(R) REAL ICETM In-Circuit Emulator User's Guide" DS51616 * "Using MPLAB(R) REAL ICETM In-Circuit Emulator" (poster) DS51749 (R) Many DSCs have options for at least two oscillators: a high-frequency primary oscillator and a low-frequency secondary oscillator (refer to Section 8.0 "Oscillator Configuration" for details). The oscillator circuit should be placed on the same side of the board as the device. Also, place the oscillator circuit close to the respective oscillator pins, not exceeding one-half inch (12 mm) distance between them. The load capacitors should be placed next to the oscillator itself, on the same side of the board. Use a grounded copper pour around the oscillator circuit to isolate them from surrounding circuits. The grounded copper pour should be routed directly to the MCU ground. Do not run any signal traces or power traces inside the ground pour. Also, if using a two-sided board, avoid any traces on the other side of the board where the crystal is placed. A suggested layout is shown in Figure 2-3. FIGURE 2-3: SUGGESTED PLACEMENT OF THE OSCILLATOR CIRCUIT Main Oscillator 13 Guard Ring 14 15 Guard Trace Secondary Oscillator 16 17 18 19 20 (c) 2011 Microchip Technology Inc. DS70283H-page 17 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 2.7 Oscillator Value Conditions on Device Start-up If the PLL of the target device is enabled and configured for the device start-up oscillator, the maximum oscillator source frequency must be limited to 8 MHz for start-up with PLL enabled. This means that if the external oscillator frequency is outside this range, the application must start-up in FRC mode first. The default PLL settings after a POR with an oscillator frequency outside this range will violate the device operating speed. Once the device powers up, the application firmware can initialize the PLL SFRs, CLKDIV and PLLDBF to a suitable value, and then perform a clock switch to the Oscillator + PLL clock source. Note that clock switching must be enabled in the device Configuration word. 2.8 Configuration of Analog and Digital Pins During ICSP Operations If MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL ICETM in-circuit emulator is selected as a debugger, it automatically initializes all of the A/D input pins (ANx) as "digital" pins, by setting all bits in the AD1PCFGL register. The bits in the registers that correspond to the A/D pins that are initialized by MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL ICETM in-circuit emulator, must not be cleared by the user application firmware; otherwise, communication errors will result between the debugger and the device. If your application needs to use certain A/D pins as analog input pins during the debug session, the user application must clear the corresponding bits in the AD1PCFGL register during initialization of the ADC module. When MPLAB ICD 2, MPLAB ICD 3 or MPLAB REAL ICETM in-circuit emulator is used as a programmer, the user application firmware must correctly configure the AD1PCFGL register. Automatic initialization of this register is only done during debugger operation. Failure to correctly configure the register(s) will result in all A/D pins being recognized as analog input pins, resulting in the port value being read as a logic `0', which may affect user application functionality. 2.9 Unused I/Os Unused I/O pins should be configured as outputs and driven to a logic-low state. Alternatively, connect a 1k to 10k resistor between VSS and the unused pins. DS70283H-page 18 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 3.0 CPU 3.1 Data Addressing Overview Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 2. "CPU" (DS70204) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CPU module has a 16-bit (data) modified Harvard architecture with an enhanced instruction set, including significant support for DSP. The CPU has a 24-bit instruction word with a variable length opcode field. The Program Counter (PC) is 23 bits wide and addresses up to 4M x 24 bits of user program memory space. The actual amount of program memory implemented varies by device. A single-cycle instruction prefetch mechanism is used to help maintain throughput and provides predictable execution. All instructions execute in a single cycle, with the exception of instructions that change the program flow, the double-word move (MOV.D) instruction and the table instructions. Overhead-free program loop constructs are supported using the DO and REPEAT instructions, both of which are interruptible at any point. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices have sixteen, 16-bit working registers in the programmer's model. Each of the working registers can serve as a data, address or address offset register. The 16th working register (W15) operates as a software Stack Pointer (SP) for interrupts and calls. There are two classes of instruction in the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices: MCU and DSP. These two instruction classes are seamlessly integrated into a single CPU. The instruction set includes many addressing modes and is designed for optimum C compiler efficiency. For most instructions, the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, three parameter instructions can be supported, allowing A + B = C operations to be executed in a single cycle. A block diagram of the CPU is shown in Figure 3-1, and the programmer's model for the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 is shown in Figure 3-2. The data space can be addressed as 32K words or 64 Kbytes and is split into two blocks, referred to as X and Y data memory. Each memory block has its own independent Address Generation Unit (AGU). The MCU class of instructions operates solely through the X memory AGU, which accesses the entire memory map as one linear data space. Certain DSP instructions operate through the X and Y AGUs to support dual operand reads, which splits the data address space into two parts. The X and Y data space boundary is device-specific. Overhead-free circular buffers (Modulo Addressing mode) are supported in both X and Y address spaces. The Modulo Addressing removes the software boundary checking overhead for DSP algorithms. Furthermore, the X AGU circular addressing can be used with any of the MCU class of instructions. The X AGU also supports Bit-Reversed Addressing to greatly simplify input or output data reordering for radix-2 FFT algorithms. The upper 32 Kbytes of the data space memory map can optionally be mapped into program space at any 16K program word boundary defined by the 8-bit Program Space Visibility Page register (PSVPAG). The program-to-data-space mapping feature lets any instruction access program space as if it were data space. 3.2 DSP Engine Overview The DSP engine features a high-speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. The barrel shifter is capable of shifting a 40-bit value up to 16 bits right or left, in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC instruction and other associated instructions can concurrently fetch two data operands from memory while multiplying two W registers and accumulating and optionally saturating the result in the same cycle. This instruction functionality requires that the RAM data space be split for these instructions and linear for all others. Data space partitioning is achieved in a transparent and flexible manner through dedicating certain working registers to each address space. (c) 2011 Microchip Technology Inc. DS70283H-page 19 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 3.3 Special MCU Features The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 features a 17-bit by 17-bit single-cycle multiplier that is shared by both the MCU ALU and DSP engine. The multiplier can perform signed, unsigned and mixed-sign multiplication. Using a 17-bit by 17-bit multiplier for 16-bit by 16-bit multiplication not only allows you to perform mixed-sign multiplication, it also achieves accurate results for special operations, such as (-1.0) x (-1.0). The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 supports 16/16 and 32/16 divide operations, both fractional and integer. All divide instructions are iterative operations. They must be executed within a REPEAT loop, resulting in a total execution time of 19 instruction cycles. The divide operation can be interrupted during any of those 19 cycles without loss of data. A 40-bit barrel shifter is used to perform up to a 16-bit left or right shift in a single cycle. The barrel shifter can be used by both MCU and DSP instructions. FIGURE 3-1: PSV and Table Data Access Control Block dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CPU CORE BLOCK DIAGRAM Y Data Bus Interrupt Controller 8 16 X Data Bus 16 16 16 Data Latch 16 Data Latch Y RAM Address Latch 16 23 23 PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic X RAM Address Latch 23 16 Address Latch 16 16 Address Generator Units 16 Program Memory 16 EA MUX Data Latch 24 ROM Latch 16 Literal Data 24 Instruction Decode and Control 16 Instruction Reg Control Signals to Various Blocks 16 DSP Engine 16 x 16 W Register Array 16 16 16 Divide Support 16-bit ALU 16 To Peripheral Modules DS70283H-page 20 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 3-2: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 PROGRAMMER'S MODEL D15 W0/WREG W1 W2 W3 W4 DSP Operand Registers W5 W6 W7 W8 DSP Address Registers W9 W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer Working Registers D0 PUSH.S Shadow DO Shadow Legend SPLIM AD39 DSP Accumulators PC22 ACCA ACCB PC0 0 7 TBLPAG 7 PSVPAG 0 Program Space Visibility Page Address 15 RCOUNT 15 DCOUNT 22 DOSTART 22 DOEND 15 CORCON 0 0 0 0 0 Data Table Page Address AD31 Stack Pointer Limit Register AD15 AD0 Program Counter REPEAT Loop Counter DO Loop Counter DO Loop Start Address DO Loop End Address Core Configuration Register OA OB SA SB OAB SAB DA SRH DC IPL2 IPL1 IPL0 RA SRL N OV Z C STATUS Register (c) 2011 Microchip Technology Inc. DS70283H-page 21 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 3.4 CPU Control Registers SR: CPU STATUS REGISTER R-0 OB R/C-0 SA(1) R/C-0 SB(1) R-0 OAB R/C-0 SAB R -0 DA R/W-0 DC bit 8 R/W-0(3) IPL<2:0>(2) bit 7 Legend: C = Clear only bit S = Set only bit `1' = Bit is set bit 15 R = Readable bit W = Writable bit `0' = Bit is cleared OA: Accumulator A Overflow Status bit 1 = Accumulator A overflowed 0 = Accumulator A has not overflowed OB: Accumulator B Overflow Status bit 1 = Accumulator B overflowed 0 = Accumulator B has not overflowed SA: Accumulator A Saturation `Sticky' Status bit(1) 1 = Accumulator A is saturated or has been saturated at some time 0 = Accumulator A is not saturated SB: Accumulator B Saturation `Sticky' Status bit(1) 1 = Accumulator B is saturated or has been saturated at some time 0 = Accumulator B is not saturated OAB: OA || OB Combined Accumulator Overflow Status bit 1 = Accumulators A or B have overflowed 0 = Neither Accumulators A or B have overflowed SAB: SA || SB Combined Accumulator `Sticky' Status bit 1 = Accumulators A or B are saturated or have been saturated at some time in the past 0 = Neither Accumulator A or B are saturated Note: bit 9 This bit may be read or cleared (not set). Clearing this bit will clear SA and SB. DA: DO Loop Active bit 1 = DO loop in progress 0 = DO loop not in progress DC: MCU ALU Half Carry/Borrow bit 1 = A carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data) of the result occurred 0 = No carry-out from the 4th low-order bit (for byte-sized data) or 8th low-order bit (for word-sized data) of the result occurred This bit can be read or cleared (not set). The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>). U = Unimplemented bit, read as `0' -n = Value at POR x = Bit is unknown R/W-0(3) R-0 RA R/W-0 N R/W-0 OV R/W-0 Z R/W-0 C bit 0 REGISTER 3-1: R-0 OA bit 15 R/W-0(3) bit 14 bit 13 bit 12 bit 11 bit 10 bit 8 Note 1: 2: 3: DS70283H-page 22 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 3-1: bit 7-5 SR: CPU STATUS REGISTER (CONTINUED) IPL<2:0>: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) RA: REPEAT Loop Active bit 1 = REPEAT loop in progress 0 = REPEAT loop not in progress N: MCU ALU Negative bit 1 = Result was negative 0 = Result was non-negative (zero or positive) OV: MCU ALU Overflow bit This bit is used for signed arithmetic (2's complement). It indicates an overflow of a magnitude that causes the sign bit to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred Z: MCU ALU Zero bit 1 = An operation that affects the Z bit has set it at some time in the past 0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result) C: MCU ALU Carry/Borrow bit 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred This bit can be read or cleared (not set). The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read-only when NSTDIS = 1 (INTCON1<15>). bit 4 bit 3 bit 2 bit 1 bit 0 Note 1: 2: 3: (c) 2011 Microchip Technology Inc. DS70283H-page 23 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 3-2: U-0 -- bit 15 R/W-0 SATA bit 7 Legend: R = Readable bit 0' = Bit is cleared bit 15-13 bit 12 CORCON: CORE CONTROL REGISTER U-0 -- U-0 -- R/W-0 US R/W-0 EDT(1) R-0 R-0 DL<2:0> R-0 bit 8 R/W-0 SATB R/W-1 SATDW R/W-0 ACCSAT R/C-0 IPL3(2) R/W-0 PSV R/W-0 RND R/W-0 IF bit 0 C = Clear only bit W = Writable bit `x = Bit is unknown -n = Value at POR `1' = Bit is set U = Unimplemented bit, read as `0' bit 11 bit 10-8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 Unimplemented: Read as `0' US: DSP Multiply Unsigned/Signed Control bit 1 = DSP engine multiplies are unsigned 0 = DSP engine multiplies are signed EDT: Early DO Loop Termination Control bit(1) 1 = Terminate executing DO loop at end of current loop iteration 0 = No effect DL<2:0>: DO Loop Nesting Level Status bits 111 = 7 DO loops active * * * 001 = 1 DO loop active 000 = 0 DO loops active SATA: ACCA Saturation Enable bit 1 = Accumulator A saturation enabled 0 = Accumulator A saturation disabled SATB: ACCB Saturation Enable bit 1 = Accumulator B saturation enabled 0 = Accumulator B saturation disabled SATDW: Data Space Write from DSP Engine Saturation Enable bit 1 = Data space write saturation enabled 0 = Data space write saturation disabled ACCSAT: Accumulator Saturation Mode Select bit 1 = 9.31 saturation (super saturation) 0 = 1.31 saturation (normal saturation) IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less PSV: Program Space Visibility in Data Space Enable bit 1 = Program space visible in data space 0 = Program space not visible in data space RND: Rounding Mode Select bit 1 = Biased (conventional) rounding enabled 0 = Unbiased (convergent) rounding enabled IF: Integer or Fractional Multiplier Mode Select bit 1 = Integer mode enabled for DSP multiply ops 0 = Fractional mode enabled for DSP multiply ops This bit will always read as `0'. The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU interrupt priority level. Note 1: 2: DS70283H-page 24 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 3.5 Arithmetic Logic Unit (ALU) 3.6 DSP Engine The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 ALU is 16 bits wide and is capable of addition, subtraction, bit shifts and logic operations. Unless otherwise mentioned, arithmetic operations are 2's complement in nature. Depending on the operation, the ALU can affect the values of the Carry (C), Zero (Z), Negative (N), Overflow (OV) and Digit Carry (DC) Status bits in the SR register. The C and DC Status bits operate as Borrow and Digit Borrow bits, respectively, for subtraction operations. The ALU can perform 8-bit or 16-bit operations, depending on the mode of the instruction that is used. Data for the ALU operation can come from the W register array or data memory, depending on the addressing mode of the instruction. Likewise, output data from the ALU can be written to the W register array or a data memory location. Refer to the "16-bit MCU and DSC Programmer's Reference Manual" (DS70157) for information on the SR bits affected by each instruction. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CPU incorporates hardware support for both multiplication and division. This includes a dedicated hardware multiplier and support hardware for 16-bit-divisor division. The DSP engine consists of a high-speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/subtracter (with two target accumulators, round and saturation logic). The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 is a single-cycle instruction flow architecture; therefore, concurrent operation of the DSP engine with MCU instruction flow is not possible. However, some MCU ALU and DSP engine resources can be used concurrently by the same instruction (e.g., ED, EDAC). The DSP engine can also perform inherent accumulator-to-accumulator operations that require no additional data. These instructions are ADD, SUB and NEG. The DSP engine has options selected through bits in the CPU Core Control register (CORCON), as listed below: Fractional or integer DSP multiply (IF) Signed or unsigned DSP multiply (US) Conventional or convergent rounding (RND) Automatic saturation on/off for ACCA (SATA) Automatic saturation on/off for ACCB (SATB) Automatic saturation on/off for writes to data memory (SATDW) * Accumulator Saturation mode selection (ACCSAT) A block diagram of the DSP engine is shown in Figure 3-3. * * * * * * 3.5.1 MULTIPLIER Using the high-speed 17-bit x 17-bit multiplier of the DSP engine, the ALU supports unsigned, signed or mixed-sign operation in several MCU multiplication modes: * * * * * * * 16-bit x 16-bit signed 16-bit x 16-bit unsigned 16-bit signed x 5-bit (literal) unsigned 16-bit unsigned x 16-bit unsigned 16-bit unsigned x 5-bit (literal) unsigned 16-bit unsigned x 16-bit signed 8-bit unsigned x 8-bit unsigned TABLE 3-1: Instruction CLR ED EDAC MAC MAC MOVSAC MPY MPY MPY.N MSC DSP INSTRUCTIONS SUMMARY Algebraic Operation A=0 A = (x - y)2 A = A + (x - y)2 A = A + (x * y) A = A + x2 No change in A A=x* y A = x2 A=-x*y A=A-x*y ACC Write Back Yes No No Yes No Yes No No No Yes 3.5.2 DIVIDER The divide block supports 32-bit/16-bit and 16-bit/16-bit signed and unsigned integer divide operations with the following data sizes: 1. 2. 3. 4. 32-bit signed/16-bit signed divide 32-bit unsigned/16-bit unsigned divide 16-bit signed/16-bit signed divide 16-bit unsigned/16-bit unsigned divide The quotient for all divide instructions ends up in W0 and the remainder in W1. 16-bit signed and unsigned DIV instructions can specify any W register for both the 16-bit divisor (Wn) and any W register (aligned) pair (W(m + 1):Wm) for the 32-bit dividend. The divide algorithm takes one cycle per bit of divisor, so both 32-bit/16-bit and 16-bit/16-bit instructions take the same number of cycles to execute. (c) 2011 Microchip Technology Inc. DS70283H-page 25 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 3-3: DSP ENGINE BLOCK DIAGRAM 40 Carry/Borrow Out 40-bit Accumulator A 40-bit Accumulator B Saturate Carry/Borrow In Adder Negate S a 40 Round t 16 u Logic r a t e 40 40 40 Barrel Shifter 16 40 Sign-Extend Y Data Bus 32 Zero Backfill 33 32 16 17-bit Multiplier/Scaler 16 16 To/From W Array DS70283H-page 26 (c) 2011 Microchip Technology Inc. X Data Bus dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 3.6.1 MULTIPLIER 3.6.2.1 The 17-bit x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17-bit x 17-bit multiplier/scaler is a 33-bit value that is sign-extended to 40 bits. Integer data is inherently represented as a signed 2's complement value, where the Most Significant bit (MSb) is defined as a sign bit. The range of an N-bit 2's complement integer is -2N-1 to 2N-1 - 1. * For a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF) including 0. * For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,647 (0x7FFF FFFF). When the multiplier is configured for fractional multiplication, the data is represented as a 2's complement fraction, where the MSb is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit 2's complement fraction with this implied radix point is -1.0 to (1 - 21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF) including 0 and has a precision of 3.01518x10-5. In Fractional mode, the 16 x 16 multiply operation generates a 1.31 product that has a precision of 4.65661 x 10-10. The same multiplier is used to support the MCU multiply instructions, which include integer 16-bit signed, unsigned and mixed sign multiply operations. The MUL instruction can be directed to use byte or word-sized operands. Byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the W array. Adder/Subtracter, Overflow and Saturation The adder/subtracter is a 40-bit adder with an optional zero input into one side, and either true or complement data into the other input. * In the case of addition, the Carry/Borrow input is active-high and the other input is true data (not complemented). * In the case of subtraction, the Carry/Borrow input is active-low and the other input is complemented. The adder/subtracter generates Overflow Status bits, SA/SB and OA/OB, which are latched and reflected in the STATUS register: * Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. * Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits are not identical to each other. The adder has an additional saturation block that controls accumulator data saturation, if selected. It uses the result of the adder, the Overflow Status bits described previously and the SAT 3.6.2 DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its pre-accumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled using the barrel shifter prior to accumulation. (c) 2011 Microchip Technology Inc. DS70283H-page 27 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 The SA and SB bits are modified each time data passes through the adder/subtracter, but can only be cleared by the user application. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate an arithmetic warning trap when saturation is disabled. The Overflow and Saturation Status bits can optionally be viewed in the STATUS Register (SR) as the logical OR of OA and OB (in bit OAB) and the logical OR of SA and SB (in bit SAB). Programmers can check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This is useful for complex number arithmetic, which typically uses both accumulators. The device supports three Saturation and Overflow modes: * Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF) or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. This condition is referred to as `super saturation' and provides protection against erroneous data or unexpected algorithm problems (such as gain calculations). * Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user application. When this Saturation mode is in effect, the guard bits are not used, so the OA, OB or OAB bits are never set. * Bit 39 Catastrophic Overflow: The bit 39 Overflow Status bit from the adder is used to set the SA or SB bit, which remains set until cleared by the user application. No saturation operation is performed, and the accumulator is allowed to overflow, destroying its sign. If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. into data space memory. The write is performed across the X bus into combined X and Y address space. The following addressing modes are supported: * W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. * [W13] + = 2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). 3.6.3.1 Round Logic The round logic is a combinational block that performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16-bit, 1.15 data value that is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least significant word (lsw) is simply discarded. Conventional rounding zero-extends bit 15 of the accumulator and adds it to the ACCxH word (bits 16 through 31 of the accumulator). * If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. * If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value tends to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. In this case, the Least Significant bit (bit 16 of the accumulator) of ACCxH is examined: * If it is `1', ACCxH is incremented. * If it is `0', ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme removes any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC), or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus, subject to data saturation (see Section 3.6.3.2 "Data Space Write Saturation"). For the MAC class of instructions, the accumulator write-back operation functions in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. 3.6.3 ACCUMULATOR `WRITE BACK' The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction DS70283H-page 28 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 3.6.3.2 Data Space Write Saturation 3.6.4 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data space can also be saturated, but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These inputs are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly: * For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. * For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. The Most Significant bit of the source (bit 39) is used to determine the sign of the operand being tested. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. The barrel shifter can perform up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators or the X bus (to support multi-bit shifts of register or memory data). The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value shifts the operand right. A negative value shifts the operand left. A value of `0' does not modify the operand. The barrel shifter is 40 bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 and 31 for right shifts, and between bit positions 0 and 16 for left shifts. (c) 2011 Microchip Technology Inc. DS70283H-page 29 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 30 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.0 Note: MEMORY ORGANIZATION This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 4. "Program Memory" (DS70202) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 4.1 Program Address Space The program address memory space of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices is 4M instructions. The space is addressable by a 24-bit value derived either from the 23-bit Program Counter (PC) during program execution, or from table operation or data space remapping as described in Section 4.6 "Interfacing Program and Data Memory Spaces". User application access to the program memory space is restricted to the lower half of the address range (0x000000 to 0x7FFFFF). The exception is the use of TBLRD/TBLWT operations, which use TBLPAG<7> to permit access to the Configuration bits and Device ID sections of the configuration memory space. The memory maps for the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices are shown in Figure 4-1. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 architecture features separate program and data memory spaces and buses. This architecture also allows the direct access of program memory from the data space during code execution. FIGURE 4-1: PROGRAM MEMORY MAPS FOR dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 DEVICES 0x000000 0x000002 0x000004 0x0000FE 0x000100 0x000104 0x0001FE 0x000200 dsPIC33FJ32MC202/204 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table User Memory Space dsPIC33FJ16MC304 GOTO Instruction Reset Address Interrupt Vector Table Reserved Alternate Vector Table User Memory Space 0x000000 0x000002 0x000004 0x0000FE 0x000100 0x000104 0x0001FE 0x000200 User Program Flash Memory (11264 instructions) 0x0057FE 0x005800 User Program Flash Memory (5632 instructions) 0x002BFE 0x002C00 Unimplemented (Read `0's) Unimplemented (Read `0's) 0x7FFFFE 0x800000 0x7FFFFE 0x800000 Reserved Configuration Memory Space Configuration Memory Space Reserved Device Configuration Registers 0xF7FFFE 0xF80000 0xF80017 0xF80018 Device Configuration Registers 0xF7FFFE 0xF80000 0xF80017 0xF80018 Reserved Reserved DEVID (2) 0xFEFFFE 0xFF0000 0xFFFFFE DEVID (2) 0xFEFFFE 0xFF0000 0xFFFFFE (c) 2011 Microchip Technology Inc. DS70283H-page 31 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.1.1 PROGRAM MEMORY ORGANIZATION 4.1.2 INTERRUPT AND TRAP VECTORS All dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices reserve the addresses between 0x00000 and 0x000200 for hard-coded program execution vectors. A hardware Reset vector is provided to redirect code execution from the default value of the PC on device Reset to the actual start of code. A GOTO instruction is programmed by the user application at 0x000000, with the actual address for the start of code at 0x000002. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices also have two interrupt vector tables, located from 0x000004 to 0x0000FF and 0x000100 to 0x0001FF. These vector tables allow each of the device interrupt sources to be handled by separate Interrupt Service Routines (ISRs). A more detailed discussion of the interrupt vector tables is provided in Section 7.1 "Interrupt Vector Table". The program memory space is organized in word-addressable blocks. Although it is treated as 24 bits wide, it is more appropriate to think of each address of the program memory as a lower and upper word, with the upper byte of the upper word being unimplemented. The lower word always has an even address, while the upper word has an odd address (Figure 4-2). Program memory addresses are always word-aligned on the lower word, and addresses are incremented or decremented by two during code execution. This arrangement provides compatibility with data memory space addressing and makes data in the program memory space accessible. FIGURE 4-2: msw Address 0x000001 0x000003 0x000005 0x000007 PROGRAM MEMORY ORGANIZATION most significant word 23 00000000 00000000 00000000 00000000 Program Memory `Phantom' Byte (read as `0') Instruction Width 16 least significant word 8 0 0x000000 0x000002 0x000004 0x000006 PC Address (lsw Address) DS70283H-page 32 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.2 Data Address Space The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CPU has a separate 16-bit-wide data memory space. The data space is accessed using separate Address Generation Units (AGUs) for read and write operations. The data memory maps is shown in Figure 4-3. All Effective Addresses (EAs) in the data memory space are 16 bits wide and point to bytes within the data space. This arrangement gives a data space address range of 64 Kbytes or 32K words. The lower half of the data memory space (that is, when EA<15> = 0) is used for implemented memory addresses, while the upper half (EA<15> = 1) is reserved for the Program Space Visibility area (see Section 4.6.3 "Reading Data from Program Memory Using Program Space Visibility"). dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices implement up to 2 Kbytes of data memory. Should an EA point to a location outside of this area, an all-zero word or byte will be returned. All word accesses must be aligned to an even address. Misaligned word data fetches are not supported, so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. If a misaligned read or write is attempted, an address error trap is generated. If the error occurred on a read, the instruction underway is completed. If the error occurred on a write, the instruction is executed but the write does not occur. In either case, a trap is then executed, allowing the system and/or user application to examine the machine state prior to execution of the address Fault. All byte loads into any W register are loaded into the Least Significant Byte. The Most Significant Byte is not modified. A sign-extend instruction (SE) is provided to allow user applications to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, user applications can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. 4.2.1 DATA SPACE WIDTH The data memory space is organized in byte addressable, 16-bit wide blocks. Data is aligned in data memory and registers as 16-bit words, but all data space EAs resolve to bytes. The Least Significant Bytes (LSBs) of each word have even addresses, while the Most Significant Bytes (MSBs) have odd addresses. 4.2.3 SFR SPACE The first 2 Kbytes of the Near Data Space, from 0x0000 to 0x07FF, is primarily occupied by Special Function Registers (SFRs). These are used by the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 core and peripheral modules for controlling the operation of the device. SFRs are distributed among the modules that they control, and are generally grouped together by module. Much of the SFR space contains unused addresses; these are read as `0'. Note: The actual set of peripheral features and interrupts varies by the device. Refer to the corresponding device tables and pinout diagrams for device-specific information. 4.2.2 DATA MEMORY ORGANIZATION AND ALIGNMENT To maintain backward compatibility with PIC(R) MCU devices and improve data space memory usage efficiency, the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 instruction set supports both word and byte operations. As a consequence of byte accessibility, all effective address calculations are internally scaled to step through word-aligned memory. For example, the core recognizes that Post-Modified Register Indirect Addressing mode [Ws++] will result in a value of Ws + 1 for byte operations and Ws + 2 for word operations. Data byte reads will read the complete word that contains the byte, using the LSB of any EA to determine which byte to select. The selected byte is placed onto the LSB of the data path. That is, data memory and registers are organized as two parallel byte-wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register that matches the byte address. 4.2.4 NEAR DATA SPACE The 8 Kbyte area between 0x0000 and 0x1FFF is referred to as the near data space. Locations in this space are directly addressable via a 13-bit absolute address field within all memory direct instructions. Additionally, the whole data space is addressable using MOV instructions, which support Memory Direct Addressing mode with a 16-bit address field, or by using Indirect Addressing mode using a working register as an address pointer. (c) 2011 Microchip Technology Inc. DS70283H-page 33 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 4-3: DATA MEMORY MAP FOR dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 DEVICES WITH 2 KB RAM MSB Address MSb 2 Kbyte SFR Space 0x0001 SFR Space 0x07FF 0x0801 0x0BFF 0x0001 0x0FFF 0x1001 0x1FFF 0x2001 0x07FE 0x0800 X Data RAM (X) Y Data RAM (Y) 0x0BFE 0x0C00 0x0FFE 0x1000 0x1FFE 0x2000 8 Kbyte Near Data Space LSB Address LSb 0x0000 16 bits 2 Kbyte SRAM Space 0x8001 0x8000 Optionally Mapped into Program Memory X Data Unimplemented (X) 0xFFFF 0xFFFE DS70283H-page 34 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.2.5 X AND Y DATA SPACES The core has two data spaces, X and Y. These data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. This feature allows certain instructions to concurrently fetch two words from RAM, thereby enabling efficient execution of DSP algorithms such as Finite Impulse Response (FIR) filtering and Fast Fourier Transform (FFT). The X data space is used by all instructions and supports all addressing modes. X data space has separate read and write data buses. The X read data bus is the read data path for all instructions that view data space as combined X and Y address space. It is also the X data prefetch path for the dual operand DSP instructions (MAC class). The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. Both the X and Y data spaces support Modulo Addressing mode for all instructions, subject to addressing mode restrictions. Bit-Reversed Addressing mode is only supported for writes to X data space. All data memory writes, including in DSP instructions, view data space as combined X and Y address space. The boundary between the X and Y data spaces is device-dependent and is not user-programmable. All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes, or 32K words, though the implemented memory locations vary by device. (c) 2011 Microchip Technology Inc. DS70283H-page 35 DS70283H-page 36 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 4-1: SFR Name WREG0 WREG1 WREG2 WREG3 WREG4 WREG5 WREG6 WREG7 WREG8 WREG9 WREG10 WREG11 WREG12 WREG13 WREG14 WREG15 SPLIM ACCAL ACCAH ACCAU ACCBL ACCBH ACCBU PCL PCH TBLPAG PSVPAG RCOUNT DCOUNT DOSTARTL DOSTARTH DOENDL DOENDH SR CORCON MODCON Legend: SFR Addr 0000 0002 0004 0006 0008 000A 000C 000E 0010 0012 0014 0016 0018 001A 001C 001E 0020 0022 0024 0026 0028 002A 002C 002E 0030 0032 0034 0036 0038 003A 003C 003E 0040 0042 0044 0046 CPU CORE REGISTERS MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0800 xxxx 0000 0000 0000 0000 0000 0000 0000 Program Counter High Byte Register Table Page Address Pointer Register Program Memory Visibility Page Address Pointer Register 0000 0000 0000 xxxx xxxx 0 -- -- IPL2 SATA -- -- IPL1 SATB IPL0 SATDW RA ACCSAT DOSTARTH<5:0> 0 DOENDH N IPL3 OV PSV Z RND C IF xxxx 00xx xxxx 00xx 0000 0020 0000 Working Register 0 Working Register 1 Working Register 2 Working Register 3 Working Register 4 Working Register 5 Working Register 6 Working Register 7 Working Register 8 Working Register 9 Working Register 10 Working Register 11 Working Register 12 Working Register 13 Working Register 14 Working Register 15 Stack Pointer Limit Register Accumulator A Low Word Register Accumulator A High Word Register Accumulator A Upper Word Register Accumulator B Low Word Register Accumulator B High Word Register Accumulator B Upper Word Register Program Counter Low Word Register -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- DCOUNT<15:0> DOSTARTL<15:1> -- -- OA -- XMODEN -- -- OB -- YMODEN -- -- SA -- -- -- -- SB US -- -- -- OAB EDT -- -- SAB -- -- DA DL<2:0> BWM<3:0> -- DOENDL<15:1> -- DC Repeat Loop Counter Register YWM<3:0> XWM<3:0> x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-1: SFR Name XMODSRT XMODEND YMODSRT YMODEND XBREV DISICNT Legend: SFR Addr 0048 004A 004C 004E 0050 0052 CPU CORE REGISTERS MAP (CONTINUED) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 XS<15:1> XE<15:1> YS<15:1> YE<15:1> BREN -- -- XB<14:0> Disable Interrupts Counter Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0 1 0 1 All Resets xxxx xxxx xxxx xxxx xxxx xxxx (c) 2011 Microchip Technology Inc. DS70283H-page 37 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-2: SFR Name CNEN1 CNEN2 CNPU1 CNPU2 Legend: SFR Addr 0060 0062 0068 006A CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ32MC202 Bit 15 CN15IE -- Bit 14 CN14IE CN30IE Bit 13 CN13IE CN29IE Bit 12 CN12IE -- Bit 11 CN11IE CN27IE Bit 10 -- -- -- -- Bit 9 -- -- -- -- Bit 8 -- CN24IE -- Bit 7 CN7IE CN23IE CN7PUE Bit 6 CN6IE CN22IE CN6PUE Bit 5 CN5IE CN21IE CN5PUE Bit 4 CN4IE -- CN4PUE -- Bit 3 CN3IE -- CN3PUE -- Bit 2 CN2IE -- CN2PUE -- Bit 1 CN1IE -- CN1PUE -- Bit 0 CN0IE CN16IE CN0PUE CN16PUE All Resets 0000 0000 0000 0000 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE -- CN30PUE CN29PUE -- CN27PUE CN24PUE CN23PUE CN22PUE CN21PUE x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-3: SFR Name CNEN1 CNEN2 CNPU1 CNPU2 Legend: SFR Addr 0060 0062 0068 006A CHANGE NOTIFICATION REGISTER MAP FOR dsPIC33FJ32MC204 and dsPIC33FJ16MC304 Bit 15 CN15IE -- Bit 14 CN14IE CN30IE Bit 13 CN13IE CN29IE Bit 12 CN12IE CN28IE Bit 11 CN11IE CN27IE Bit 10 CN10IE CN26IE Bit 9 CN9IE CN25IE Bit 8 CN8IE CN24IE CN8PUE Bit 7 CN7IE CN23IE CN7PUE Bit 6 CN6IE CN22IE CN6PUE Bit 5 CN5IE CN21IE CN5PUE Bit 4 CN4IE CN20IE CN4PUE Bit 3 CN3IE CN19IE CN3PUE Bit 2 CN2IE CN18IE CN2PUE Bit 1 CN1IE CN17IE CN1PUE Bit 0 CN0IE CN16IE CN0PUE All Resets 0000 0000 0000 0000 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE -- CN30PUE CN29PUE CN28PUE CN27PUE CN26PUE CN25PUE CN24PUE CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DS70283H-page 38 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 4-4: SFR Name INTCON1 INTCON2 IFS0 IFS1 IFS3 IFS4 IEC0 IEC1 IEC3 IEC4 IPC0 IPC1 IPC2 IPC3 IPC4 IPC5 IPC7 IPC14 IPC15 IPC16 IPC18 INTTREG Legend: SFR Addr 0080 0082 0084 0086 008A 008C 0094 0096 009A 009C 00A4 00A6 00A8 00AA 00AC 00AE 00B2 00C0 00C2 00C4 00C8 00E0 INTERRUPT CONTROLLER REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 OVATE -- SPI1IF -- QEIIF Bit 9 OVBTE -- SPI1EIF -- PWM1IF Bit 8 COVTE -- T3IF -- -- -- T3IE -- -- -- Bit 7 Bit 6 Bit 5 -- -- IC2IF -- -- -- IC2IE -- -- -- IC1IP<2:0> IC2IP<2:0> SPI1EIP<2:0> AD1IP<2:0> MI2C1IP<2:0> -- -- INT2IP<2:0> PWM1IP<2:0> -- -- U1EIP<2:0> PWM2IP<2:0> -- -- Bit 4 Bit 3 Bit 2 Bit 1 OSCFAIL INT1EP IC1IF MI2C1IF -- U1EIF IC1IE Bit 0 -- INT0EP INT0IF SI2C1IF -- -- INT0IE All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 4444 -- 4440 4444 0044 4044 4404 -- -- -- -- -- 0040 0440 4000 0040 0440 0000 NSTDIS OVAERR OVBERR COVAERR COVBERR ALTIVT -- -- FLTA1IF -- -- -- FLTA1IE -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- DISI -- -- -- -- -- -- -- -- -- AD1IF INT2IF -- -- AD1IE INT2IE -- -- T1IP<2:0> T2IP<2:0> U1RXIP<2:0> -- CNIP<2:0> IC8IP<2:0> -- -- FLTA1IP<2:0> -- -- -- -- -- -- -- -- -- -- U1TXIF -- -- -- U1TXIE -- -- -- -- U1RXIF -- -- -- U1RXIE -- -- -- -- -- -- -- -- -- -- -- -- -- -- SFTACERR DIV0ERR -- T2IF IC8IF -- -- T2IE IC8IE -- -- -- -- -- -- OC2IF IC7IF -- -- OC2IE IC7IE -- -- MATHERR ADDRERR STKERR -- -- INT1IF -- -- -- INT1IE -- -- -- T1IF CNIF -- -- T1IE CNIE -- -- -- -- -- -- -- -- -- -- -- -- -- VECNUM<6:0> -- -- -- -- -- -- INT2EP OC1IF -- -- -- OC1IE -- -- -- FLTA2IF PWM2IF SPI1IE -- QEIIE SPI1EIE -- PWM1IE MI2C1IE SI2C1IE -- U1EIE INT0IP<2:0> -- T3IP<2:0> U1TXIP<2:0> SI2C1IP<2:0> INT1IP<2:0> -- -- -- -- -- -- -- FLTA2IE PWM2IE OC1IP<2:0> OC2IP<2:0> SPI1IP<2:0> -- -- -- -- IC7IP<2:0> -- -- QEIIP<2:0> -- -- -- -- FLTA2IP<2:0> ILR<3:0> -- -- -- -- -- -- -- -- -- -- -- -- -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. (c) 2011 Microchip Technology Inc. DS70283H-page 39 TABLE 4-5: SFR Name TMR1 PR1 T1CON TMR2 TMR3HLD TMR3 PR2 PR3 T2CON T3CON Legend: SFR Addr 0100 0102 0104 0106 0108 010A 010C 010E 0110 0112 TIMER REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 Timer1 Register Period Register 1 TON -- TSIDL -- -- -- -- -- -- TGATE TCKPS<1:0> -- TSYNC TCS -- dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FFFF 0000 0000 xxxx 0000 FFFF FFFF TGATE TGATE TCKPS<1:0> TCKPS<1:0> T32 -- -- -- TCS TCS -- -- 0000 0000 Timer2 Register Timer3 Holding Register (for 32-bit timer operations only) Timer3 Register Period Register 2 Period Register 3 TON TON -- -- TSIDL TSIDL -- -- -- -- -- -- -- -- -- -- -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-6: SFR Name IC1BUF IC1CON IC2BUF IC2CON IC7BUF IC7CON IC8BUF IC8CON Legend: SFR Addr 0140 0142 0144 0146 0158 015A 015C 015E INPUT CAPTURE REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx ICI<1:0> ICOV ICBNE ICM<2:0> 0000 xxxx ICI<1:0> ICOV ICBNE ICM<2:0> 0000 xxxx ICI<1:0> ICOV ICBNE ICM<2:0> 0000 xxxx ICI<1:0> ICOV ICBNE ICM<2:0> 0000 Input 1 Capture Register -- -- ICSIDL -- -- -- -- -- ICTMR Input 2 Capture Register -- -- ICSIDL -- -- -- -- -- ICTMR Input 7 Capture Register -- -- ICSIDL -- -- -- -- -- ICTMR Input 8 Capture Register -- -- ICSIDL -- -- -- -- -- ICTMR x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-7: SFR Name OC1RS OC1R OC1CON OC2RS OC2R OC2CON Legend: SFR Addr 0180 0182 0184 0186 0188 018A OUTPUT COMPARE REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx xxxx -- OCFLT OCTSEL OCM<2:0> 0000 xxxx xxxx -- OCFLT OCTSEL OCM<2:0> 0000 Output Compare 1 Secondary Register Output Compare 1 Register -- -- OCSIDL -- -- -- -- -- -- -- Output Compare 2 Secondary Register Output Compare 2 Register -- -- OCSIDL -- -- -- -- -- -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DS70283H-page 40 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 4-8: SFR Name P1TCON P1TMR P1TPER P1SECMP Addr. 01C0 01C2 01C4 6-OUTPUT PWM1 REGISTER MAP Bit 15 PTEN PTDIR -- Bit 14 -- Bit 13 PTSIDL Bit 12 -- Bit 11 -- Bit 10 -- Bit 9 -- Bit 8 -- Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> PWM Timer Count Value Register PWM Time Base Period Register PWM Special Event Compare Register -- -- -- -- -- -- -- PMOD3 PMOD2 PMOD1 -- -- PEN3H -- PEN2H -- PEN1H -- -- -- PEN3L IUE PEN2L OSYNC PEN1L UDIS 01C6 SEVTDIR -- -- PWM1CON1 01C8 PWM1CON2 01CA P1DTCON1 P1DTCON2 01CC 01CE 0000 0000 1111 1111 0000 0000 0000 0000 0000 0000 0000 0000 SEVOPS<3:0> DTB<5:0> DTBPS<1:0> -- -- -- -- -- -- -- -- DTAPS<1:0> -- -- -- FLTAM -- -- -- -- DTS3A -- DTS3I -- DTA<5:0> DTS2A -- DTS2I FAEN3 DTS1A FAEN2 DTS1I FAEN1 -- -- 0000 0000 0000 0000 0000 0000 0000 0000 P1FLTACON 01D0 P1OVDCON 01D4 P1DC1 P1DC2 P1DC3 Legend: 01D6 01D8 01DA FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 PWM Duty Cycle #1 Register PWM Duty Cycle #2 Register PWM Duty Cycle #3 Register u = uninitialized bit, -- = unimplemented, read as `0' TABLE 4-9: SFR Name P2TCON P2TMR P2TPER P2SECMP Addr. 05C0 05C2 05C4 05C6 2-OUTPUT PWM2 REGISTER MAP Bit 15 PTEN PTDIR -- SEVTDIR -- -- -- -- -- -- -- -- -- -- Bit 14 -- Bit 13 PTSIDL Bit 12 -- Bit 11 -- Bit 10 -- Bit 9 -- Bit 8 -- Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 -- -- PEN1H -- -- -- -- IUE -- OSYNC PEN1L UDIS 0000 0000 1111 1111 0000 0000 0000 0000 0000 0000 0000 0000 DTS1A -- DTS1I FAEN1 0000 0000 0000 0000 0000 0000 0000 0000 PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> PWM Timer Count Value Register PWM Time Base Period Register PWM Special Event Compare Register -- PMOD1 -- -- -- -- PWM2CON1 05C8 PWM2CON2 05CA P2DTCON1 P2DTCON2 P2FLTACON P2OVDCON P2DC1 Legend: 05CC 05CE 05D0 05D4 05D6 SEVOPS<3:0> DTB<5:0> DTBPS<1:0> -- -- -- -- -- -- -- -- -- -- -- -- DTAPS<1:0> -- -- -- FLTAM -- -- -- -- -- -- -- -- -- -- DTA<5:0> -- -- -- -- -- -- -- -- -- -- -- -- FAOV1H FAOV1L POVD1H POVD1L POUT1H POUT1L 1111 1111 0000 0000 0000 0000 0000 0000 PWM Duty Cycle #1 Register u = uninitialized bit, -- = unimplemented, read as `0' (c) 2011 Microchip Technology Inc. DS70283H-page 41 TABLE 4-10: SFR Name QEI1CON DFLT1CON POS1CNT MAX1CNT Legend: Addr. 01E0 01E2 01E4 01E6 QEI1 REGISTER MAP Bit 15 CNTERR -- Bit 14 -- -- Bit 13 QEISIDL -- Bit 12 INDEX -- Bit 11 UPDN -- Bit 10 Bit 9 Bit 8 Bit 7 SWPAB QEOUT Bit 6 PCDOUT Bit 5 TQGATE QECK<2:0> Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 0000 0000 0000 QEIM<2:0> IMV<1:0> CEID TQCKPS<1:0> -- POSRES TQCS UPDN_SRC -- -- -- dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 1111 1111 Position Counter<15:0> Maximum Count<15:0> u = uninitialized bit, -- = unimplemented, read as `0' TABLE 4-11: SFR Name I2C1RCV I2C1TRN I2C1BRG I2C1CON I2C1STAT I2C1ADD I2C1MSK Legend: SFR Addr 0200 0202 0204 0206 0208 020A 020C I2C1 REGISTER MAP Bit 15 -- -- -- I2CEN ACKSTAT -- -- Bit 14 -- -- -- -- TRSTAT -- -- Bit 13 -- -- -- I2CSIDL -- -- -- Bit 12 -- -- -- SCLREL -- -- -- Bit 11 -- -- -- IPMIEN -- -- -- Bit 10 -- -- -- A10M BCL -- -- Bit 9 -- -- -- DISSLW GCSTAT SMEN ADD10 GCEN IWCOL STREN I2COV Bit 8 -- -- Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000 00FF 0000 PEN R_W RSEN RBF SEN TBF 1000 0000 0000 0000 Receive Register Transmit Register Baud Rate Generator Register ACKDT D_A ACKEN P RCEN S Address Register Address Mask Register x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-12: SFR Name U1MODE U1STA U1TXREG U1RXREG U1BRG Legend: SFR Addr 0220 0222 0224 0226 0228 UART1 REGISTER MAP Bit 15 UARTEN UTXISEL1 -- -- Bit 14 -- UTXINV -- -- Bit 13 USIDL UTXISEL0 -- -- Bit 12 IREN -- -- -- Bit 11 RTSMD UTXBRK -- -- Bit 10 -- UTXEN -- -- Bit 9 UEN1 UTXBF -- -- Baud Rate Generator Prescaler Bit 8 UEN0 TRMT Bit 7 WAKE Bit 6 LPBACK Bit 5 ABAUD ADDEN Bit 4 URXINV RIDLE Bit 3 BRGH PERR Bit 2 Bit 1 Bit 0 STSEL URXDA All Resets 0000 0110 xxxx 0000 0000 PDSEL<1:0> FERR OERR URXISEL<1:0> UART Transmit Register UART Receive Register x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-13: SFR Name SPI1STAT SPI1CON1 SPI1CON2 SPI1BUF Legend: SFR Addr 0240 0242 0244 0248 SPI1 REGISTER MAP Bit 15 SPIEN -- FRMEN Bit 14 -- -- SPIFSD Bit 13 SPISIDL -- FRMPOL Bit 12 -- DISSCK -- Bit 11 -- DISSDO -- Bit 10 -- MODE16 -- Bit 9 -- SMP -- Bit 8 -- CKE -- Bit 7 -- SSEN -- Bit 6 SPIROV CKP -- Bit 5 -- MSTEN -- -- Bit 4 -- Bit 3 -- SPRE<2:0> -- -- Bit 2 -- Bit 1 SPITBF Bit 0 SPIRBF All Resets 0000 0000 0000 0000 PPRE<1:0> FRMDLY -- SPI1 Transmit and Receive Buffer Register x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DS70283H-page 42 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 4-14: File Name ADC1BUF0 ADC1BUF1 ADC1BUF2 ADC1BUF3 ADC1BUF4 ADC1BUF5 ADC1BUF6 ADC1BUF7 ADC1BUF8 ADC1BUF9 ADC1BUFA ADC1BUFB ADC1BUFC ADC1BUFD ADC1BUFE ADC1BUFF AD1CON1 AD1CON2 AD1CON3 AD1CHS123 AD1CHS0 AD1PCFGL AD1CSSL Legend: Addr 0300 0302 0304 0306 0308 030A 030C 030E 0310 0312 0314 0316 0318 031A 031C 031E 0320 0322 0324 0326 0328 032C 0330 ADC1 REGISTER MAP FOR dsPIC33FJ32MC202 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Reset s xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx SSRC<2:0> BUFS -- -- SIMSAM ASAM SAMP BUFM DONE ALTS 0000 0000 0000 CH123NA<1:0> CH0SA<4:0> PCFG4 CSS4 PCFG3 CSS3 PCFG2 CSS2 PCFG1 CSS1 PCFG0 CSS0 CH123SA 0000 0000 0000 0000 ADC Data Buffer 0 ADC Data Buffer 1 ADC Data Buffer 2 ADC Data Buffer 3 ADC Data Buffer 4 ADC Data Buffer 5 ADC Data Buffer 6 ADC Data Buffer 7 ADC Data Buffer 8 ADC Data Buffer 9 ADC Data Buffer 10 ADC Data Buffer 11 ADC Data Buffer 12 ADC Data Buffer 13 ADC Data Buffer 14 ADC Data Buffer 15 ADON -- VCFG<2:0> ADRC -- CH0NB -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- ADSIDL -- -- -- -- AD12B CSCNA SAMC<4:0> CH123NB<1:0> CH0SB<4:0> -- -- -- -- -- -- CH123SB -- CH0NA -- -- -- -- -- -- -- -- PCFG5 CSS5 FORM<1:0> CHPS<1:0> SMPI<3:0> ADCS<7:0> -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. (c) 2011 Microchip Technology Inc. DS70283H-page 43 TABLE 4-15: File Name ADC1BUF0 ADC1BUF1 ADC1BUF2 ADC1BUF3 ADC1BUF4 ADC1BUF5 ADC1BUF6 ADC1BUF7 ADC1BUF8 ADC1BUF9 ADC1BUFA ADC1BUFB ADC1BUFC ADC1BUFD ADC1BUFE ADC1BUFF AD1CON1 AD1CON2 AD1CON3 AD1CHS123 AD1CHS0 AD1PCFGL AD1CSSL Legend: Addr 0300 0302 0304 0306 0308 030A 030C 030E 0310 0312 0314 0316 0318 031A 031C 031E 0320 0322 0324 0326 0328 032C 0330 ADC1 REGISTER MAP FOR dsPIC33FJ32MC204 AND dsPIC33FJ16MC304 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets xxxx ADC Data Buffer 0 ADC Data Buffer 1 ADC Data Buffer 2 ADC Data Buffer 3 ADC Data Buffer 4 ADC Data Buffer 5 ADC Data Buffer 6 ADC Data Buffer 7 ADC Data Buffer 8 ADC Data Buffer 9 ADC Data Buffer 10 ADC Data Buffer 11 ADC Data Buffer 12 ADC Data Buffer 13 ADC Data Buffer 14 ADC Data Buffer 15 ADON -- VCFG<2:0> ADRC -- CH0NB -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- ADSIDL -- -- -- -- AD12B CSCNA SAMC<4:0> CH123NB<1:0> CH0SB<4:0> -- -- -- -- PCFG8 CSS8 CH123SB -- CH0NA PCFG7 CSS7 -- -- PCFG6 CSS6 -- -- PCFG5 CSS5 PCFG4 CSS4 PCFG3 CSS3 FORM<1:0> CHPS<1:0> BUFS SSRC<2:0> -- -- SIMSAM ASAM SAMP BUFM DONE ALTS dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx 0000 0000 0000 CH123NA<1:0> CH0SA<4:0> PCFG2 CSS2 PCFG1 CSS1 PCFG0 CSS0 CH123SA 0000 0000 0000 0000 SMPI<3:0> ADCS<7:0> -- -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DS70283H-page 44 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 4-16: File Name RPINR0 RPINR1 RPINR3 RPINR7 RPINR10 RPINR11 RPINR12 RPINR13 RPINR14 RPINR15 RPINR18 RPINR20 RPINR21 Legend: Addr 0680 0682 0686 068E 0694 0696 0698 069A 069C 069E 06A4 06A8 06AA PERIPHERAL PIN SELECT INPUT REGISTER MAP Bit 15 Bit 14 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 13 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 12 Bit 11 Bit 10 INT1R<4:0> -- T3CKR<4:0> IC2R<4:0> IC8R<4:0> -- -- -- QEB1R<4:0> -- U1CTSR<4:0> SCK1R<4:0> -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 9 Bit 8 Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 4 -- Bit 3 -- Bit 2 -- INT2R<4:0> T2CKR<4:0> IC1R<4:0> IC7R<4:0> OCFAR<4:0> FLTA1R<4:0> FLTA2R<4:0> QEA1R<4:0> INDX1R<4:0> U1RXR<4:0> SDI1R<4:0> SS1R<4:0> Bit 1 -- Bit 0 -- All Resets 1F00 001F 1F1F 1F1F 1F1F 001F 001F 001F 1F1F 001F 1F1F 1F1F 001F x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-17: File Name RPOR0 RPOR1 RPOR2 RPOR3 RPOR4 RPOR5 RPOR6 RPOR7 Legend: Addr 06C0 06C2 06C4 06C6 06C8 06CA 06CC PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ32MC202 Bit 15 -- -- -- -- -- -- -- Bit 14 -- -- -- -- -- -- -- Bit 13 -- -- -- -- -- -- -- Bit 12 Bit 11 Bit 10 RP1R<4:0> RP3R<4:0> RP5R<4:0> RP7R<4:0> RP9R<4:0> RP11R<4:0> RP13R<4:0> Bit 9 Bit 8 Bit 7 -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- Bit 4 Bit 3 Bit 2 RP0R<4:0> RP2R<4:0> RP4R<4:0> RP6R<4:0> RP8R<4:0> RP10R<4:0> RP12R<4:0> RP14R<4:0> Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 06CE -- -- -- RP15R<4:0> -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-18: File Name RPOR0 RPOR1 RPOR2 RPOR3 RPOR4 RPOR5 RPOR6 RPOR7 RPOR8 RPOR9 RPOR10 RPOR11 RPOR12 Legend: Addr 06C0 06C2 06C4 06C6 06C8 06CA 06CC 06CE 06D0 06D2 06D4 06D6 PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33FJ32MC204 AND dsPIC33FJ16MC304 Bit 15 -- -- -- -- -- -- -- -- -- -- -- -- Bit 14 -- -- -- -- -- -- -- -- -- -- -- -- Bit 13 -- -- -- -- -- -- -- -- -- -- -- -- Bit 12 Bit 11 Bit 10 RP1R<4:0> RP3R<4:0> RP5R<4:0> RP7R<4:0> RP9R<4:0> RP11R<4:0> RP13R<4:0> RP15R<4:0> RP17R<4:0> RP19R<4:0> RP21R<4:0> RP23R<4:0> Bit 9 Bit 8 Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 4 Bit 3 Bit 2 RP0R<4:0> RP2R<4:0> RP4R<4:0> RP6R<4:0> RP8R<4:0> RP10R<4:0> RP12R<4:0> RP14R<4:0> RP16R<4:0> RP18R<4:0> RP20R<4:0> RP22R<4:0> RP24R<4:0> Bit 1 Bit 0 All Resets 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 (c) 2011 Microchip Technology Inc. DS70283H-page 45 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 06D8 -- -- -- RP25R<4:0> -- x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-19: File Name TRISA PORTA LATA ODCA Legend: Addr 02C0 02C2 02C4 02C6 PORTA REGISTER MAP FOR dsPIC33FJ32MC202 Bit 15 -- -- -- -- Bit 14 -- -- -- -- Bit 13 -- -- -- -- Bit 12 -- -- -- -- Bit 11 -- -- -- -- Bit 10 -- -- -- -- Bit 9 -- -- -- -- Bit 8 -- -- -- -- Bit 7 -- -- -- -- Bit 6 -- -- -- -- Bit 5 -- -- -- -- Bit 4 TRISA4 RA4 LATA4 ODCA4 Bit 3 TRISA3 RA3 LATA3 ODCA3 Bit 2 TRISA2 RA2 LATA2 ODCA2 Bit 1 TRISA1 RA1 LATA1 ODCA1 Bit 0 TRISA0 RA0 LATA0 ODCA0 All Resets 001F xxxx xxxx 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-20: File Name TRISA PORTA LATA ODCA Legend: Addr 02C0 02C2 02C4 02C6 PORTA REGISTER MAP FOR dsPIC33FJ32MC204 AND dsPIC33FJ16MC304 Bit 15 -- -- -- -- Bit 14 -- -- -- -- Bit 13 -- -- -- -- Bit 12 -- -- -- -- Bit 11 -- -- -- -- Bit 10 TRISA10 RA10 LAT10 ODCA10 Bit 9 TRISA9 RA9 LAT8 ODCA9 Bit 8 TRISA8 RA8 LAT8 ODCA8 Bit 7 TRISA7 RA7 LAT7 ODCA7 Bit 6 -- -- -- -- Bit 5 -- -- -- -- Bit 4 TRISA4 RA4 LATA4 ODCA4 Bit 3 TRISA3 RA3 LATA3 ODCA3 Bit 2 TRISA2 RA2 LATA2 ODCA2 Bit 1 TRISA1 RA1 LATA1 ODCA1 Bit 0 TRISA0 RA0 LATA0 ODCA0 All Resets 079F xxxx xxxx 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. DS70283H-page 46 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 4-21: File Name TRISB PORTB LATB ODCB Legend: Addr 02C8 02CA 02CC 02CE PORTB REGISTER MAP Bit 15 TRISB15 RB15 LATB15 ODCB15 Bit 14 TRISB14 RB14 LATB14 ODCB14 Bit 13 TRISB13 RB13 LATB13 ODCB13 Bit 12 TRISB12 RB12 LATB12 ODCB12 Bit 11 TRISB11 RB11 LATB11 ODCB11 Bit 10 TRISB10 RB10 LATB10 ODCB10 Bit 9 TRISB9 RB9 LATB9 ODCB9 Bit 8 TRISB8 RB8 LATB8 ODCB8 Bit 7 TRISB7 RB7 LATB7 ODCB7 Bit 6 TRISB6 RB6 LATB6 ODCB6 Bit 5 TRISB5 RB5 LATB5 ODCB5 Bit 4 TRISB4 RB4 LATB4 ODCB4 Bit 3 TRISB6 RB6 LATB6 ODCB6 Bit 2 TRISB5 RB5 LATB5 ODCB5 Bit 1 TRISB1 RB1 LATB1 ODCB1 Bit 0 TRISB0 RB0 LATB0 ODCB0 All Resets FFFF xxxx xxxx 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal for 100-pin devices. TABLE 4-22: File Name TRISC PORTC LATC ODCC Legend: Addr 02D0 02D2 02D4 02D6 PORTC REGISTER MAP FOR dsPIC33FJ32MC204 AND dsPIC33FJ16MC304 Bit 15 -- -- -- -- Bit 14 -- -- -- -- Bit 13 -- -- -- -- Bit 12 -- -- -- -- Bit 11 -- -- -- -- Bit 10 -- -- -- -- Bit 9 TRISC9 RC9 LATC9 ODCC9 Bit 8 TRISC8 RC8 LATC8 ODCC8 Bit 7 TRISC7 RC7 LATC7 ODCC7 Bit 6 TRISC6 RC6 LATC6 ODCC6 Bit 5 TRISC5 RC5 LATC5 ODCC5 Bit 4 TRISC4 RC4 LATC4 ODCC4 Bit 3 TRISC6 RC6 LATC6 ODCC6 Bit 2 TRISC5 RC5 LATC5 ODCC5 Bit 1 TRISC1 RC1 LATC1 ODCC1 Bit 0 TRISC0 RC0 LATC0 ODCC0 All Resets 03FF xxxx xxxx 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. TABLE 4-23: File Name RCON OSCCON CLKDIV PLLFBD OSCTUN Legend: Note 1: 2: Addr 0740 0742 0744 0746 0748 SYSTEM CONTROL REGISTER MAP Bit 15 TRAPR -- ROI -- -- -- -- Bit 14 IOPUWR Bit 13 -- COSC<2:0> DOZE<2:0> -- -- -- -- Bit 12 -- Bit 11 -- -- DOZEN -- -- -- -- Bit 10 -- Bit 9 CM NOSC<2:0> FRCDIV<2:0> -- -- -- -- -- Bit 8 VREGS Bit 7 EXTR Bit 6 SWR Bit 5 SWDTEN LOCK -- PLLDIV<8:0> TUN<5:0> Bit 4 WDTO -- Bit 3 SLEEP CF Bit 2 IDLE -- Bit 1 BOR LPOSCEN Bit 0 POR OSWEN All Resets xxxx(1) 0300(2) 3040 0030 0000 CLKLOCK IOLOCK PLLPOST<1:0> PLLPRE<4:0> x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. RCON register Reset values dependent on type of Reset. OSCCON register Reset values dependent on the FOSC Configuration bits and by type of Reset. (c) 2011 Microchip Technology Inc. DS70283H-page 47 TABLE 4-24: File Name NVMCON NVMKEY Legend: Note 1: Addr 0760 0766 NVM REGISTER MAP Bit 15 WR -- Bit 14 WREN -- Bit 13 WRERR -- Bit 12 -- -- Bit 11 -- -- Bit 10 -- -- Bit 9 -- -- Bit 8 -- -- Bit 7 -- Bit 6 ERASE Bit 5 -- Bit 4 -- NVMKEY<7:0> Bit 3 Bit 2 Bit 1 Bit 0 All Resets 0000(1) NVMOP<3:0> dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. Reset value shown is for POR only. Value on other Reset states is dependent on the state of memory write or erase operations at the time of Reset. TABLE 4-25: File Name PMD1 PMD2 PMD3 Legend: Addr 0770 0772 0774 PMD REGISTER MAP Bit 15 -- IC8MD -- Bit 14 -- IC7MD -- Bit 13 T3MD -- -- Bit 12 T2MD -- -- Bit 11 T1MD -- -- Bit 10 QEIMD -- -- Bit 9 PWM1MD IC2MD -- Bit 8 -- IC1MD -- Bit 7 I2C1MD -- -- Bit 6 -- -- -- Bit 5 U1MD -- -- Bit 4 -- -- PWM2MD Bit 3 SPI1MD -- -- Bit 2 -- -- -- Bit 1 -- OC2MD -- Bit 0 AD1MD OC1MD -- All Resets 0000 0000 0000 x = unknown value on Reset, -- = unimplemented, read as `0'. Reset values are shown in hexadecimal. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.2.6 SOFTWARE STACK 4.2.7 DATA RAM PROTECTION FEATURE In addition to its use as a working register, the W15 register in the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices is also used as a software Stack Pointer. The Stack Pointer always points to the first available free word and grows from lower to higher addresses. It predecrements for stack pops and post-increments for stack pushes, as shown in Figure 4-4. For a PC push during any CALL instruction, the MSb of the PC is zero-extended before the push, ensuring that the MSb is always clear. Note: A PC push during exception processing concatenates the SRL register to the MSb of the PC prior to the push. The dsPIC33F product family supports Data RAM protection features that enable segments of RAM to be protected when used in conjunction with Boot and Secure Code Segment Security. BSRAM (Secure RAM segment for BS) is accessible only from the Boot Segment Flash code when enabled. SSRAM (Secure RAM segment for RAM) is accessible only from the Secure Segment Flash code when enabled. See Table 4-1 for an overview of the BSRAM and SSRAM SFRs. 4.3 Instruction Addressing Modes The Stack Pointer Limit register (SPLIM) associated with the Stack Pointer sets an upper address boundary for the stack. SPLIM is uninitialized at Reset. As is the case for the Stack Pointer, SPLIM<0> is forced to `0' because all stack operations must be word-aligned. Whenever an EA is generated using W15 as a source or destination pointer, the resulting address is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a stack error trap will not occur. The stack error trap will occur on a subsequent push operation. For example, to cause a stack error trap when the stack grows beyond address 0x1000 in RAM, initialize the SPLIM with the value 0x0FFE. Similarly, a Stack Pointer underflow (stack error) trap is generated when the Stack Pointer address is found to be less than 0x0800. This prevents the stack from interfering with the Special Function Register (SFR) space. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. The addressing modes shown in Table 4-26 form the basis of the addressing modes optimized to support the specific features of individual instructions. The addressing modes provided in the MAC class of instructions differ from those in the other instruction types. 4.3.1 FILE REGISTER INSTRUCTIONS Most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). Most file register instructions employ a working register, W0, which is denoted as WREG in these instructions. The destination is typically either the same file register or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction allows additional flexibility and can access the entire data space. 4.3.2 MCU INSTRUCTIONS The three-operand MCU instructions are of the form: Operand 3 = Operand 1 FIGURE 4-4: 0x0000 15 CALL STACK FRAME 0 Stack Grows Toward Higher Address PC<15:0> 000000000 PC<22:16> W15 (before CALL) W15 (after CALL) POP : [--W15] PUSH : [W15++] DS70283H-page 48 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 4-26: FUNDAMENTAL ADDRESSING MODES SUPPORTED Description The address of the file register is specified explicitly. The contents of a register are accessed directly. The contents of Wn forms the Effective Address (EA). The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Addressing Mode File Register Direct Register Direct Register Indirect Register Indirect Post-Modified Register Indirect Pre-Modified Register Indirect with Register Offset The sum of Wn and Wb forms the EA. (Register Indexed) Register Indirect with Literal Offset The sum of Wn and a literal forms the EA. 4.3.3 MOVE AND ACCUMULATOR INSTRUCTIONS 4.3.4 MAC INSTRUCTIONS Move instructions and the DSP accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the addressing modes supported by most MCU instructions, move and accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (Register Offset) field is shared by both source and destination (but typically only used by one). The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, use a simplified set of addressing modes to allow the user application to effectively manipulate the data pointers through register indirect tables. The two-source operand prefetch registers must be members of the set {W8, W9, W10, W11}. For data reads, W8 and W9 are always directed to the X RAGU, and W10 and W11 are always directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Note: Register Indirect with Register Offset Addressing mode is available only for W9 (in X space) and W11 (in Y space). In summary, the following addressing modes are supported by move and accumulator instructions: * * * * * * * * Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: Not all instructions support all the addressing modes given above. Individual instructions may support different subsets of these addressing modes. In summary, the following addressing modes are supported by the MAC class of instructions: * * * * * Register Indirect Register Indirect Post-Modified by 2 Register Indirect Post-Modified by 4 Register Indirect Post-Modified by 6 Register Indirect with Register Offset (Indexed) 4.3.5 OTHER INSTRUCTIONS Besides the addressing modes outlined previously, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. (c) 2011 Microchip Technology Inc. DS70283H-page 49 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.4 Modulo Addressing Note: Modulo Addressing mode is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo Addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo Addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for Modulo Addressing since these two registers are used as the Stack Frame Pointer and Stack Pointer, respectively. In general, any particular circular buffer can be configured to operate in only one direction as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing buffers), based upon the direction of the buffer. The only exception to the usage restrictions is for buffers that have a power-of-two length. As these buffers satisfy the start and end address criteria, they can operate in a bidirectional mode (that is, address boundary checks are performed on both the lower and upper address boundaries). Y space Modulo Addressing EA calculations assume word-sized data (LSb of every EA is always clear). The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). 4.4.2 W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register, MODCON<15:0>, contains enable flags as well as a W register field to specify the W Address registers. The XWM and YWM fields select the registers that will operate with Modulo Addressing: * If XWM = 15, X RAGU and X WAGU Modulo Addressing is disabled. * If YWM = 15, Y AGU Modulo Addressing is disabled. The X Address Space Pointer W register (XWM), to which Modulo Addressing is to be applied, is stored in MODCON<3:0> (see Table 4-1). Modulo Addressing is enabled for X data space when XWM is set to any value other than `15' and the XMODEN bit is set at MODCON<15>. The Y Address Space Pointer W register (YWM) to which Modulo Addressing is to be applied is stored in MODCON<7:4>. Modulo Addressing is enabled for Y data space when YWM is set to any value other than `15' and the YMODEN bit is set at MODCON<14>. 4.4.1 START AND END ADDRESS The Modulo Addressing scheme requires that a starting and ending address be specified and loaded into the 16-bit Modulo Buffer Address registers: XMODSRT, XMODEND, YMODSRT and YMODEND (see Table 4-1). FIGURE 4-5: Byte Address 0x1100 MODULO ADDRESSING OPERATION EXAMPLE MOV MOV MOV MOV MOV MOV MOV MOV #0x1100, W0 W0, XMODSRT #0x1163, W0 W0, MODEND #0x8001, W0 W0, MODCON #0x0000, W0 #0x1110, W1 ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;W0 holds buffer fill value ;point W1 to buffer ;fill the 50 buffer locations ;fill the next location ;increment the fill value 0x1163 DO AGAIN, #0x31 MOV W0, [W1++] AGAIN: INC W0, W0 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words DS70283H-page 50 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.4.3 MODULO ADDRESSING APPLICABILITY If the length of a bit-reversed buffer is M = 2N bytes, the last `N' bits of the data buffer start address must be zeros. XB<14:0> is the Bit-Reversed Address modifier, or `pivot point', which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: All bit-reversed EA calculations assume word-sized data (LSb of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. Modulo Addressing can be applied to the Effective Address (EA) calculation associated with any W register. Address boundaries check for addresses equal to: * The upper boundary addresses for incrementing buffers * The lower boundary addresses for decrementing buffers It is important to realize that the address boundaries check for addresses less than or greater than the upper (for incrementing buffers) and lower (for decrementing buffers) boundary addresses (not just equal to). Address changes can, therefore, jump beyond boundaries and still be adjusted correctly. Note: The modulo corrected effective address is written back to the register only when Pre-Modify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (such as [W7 + W2]) is used, Modulo Address correction is performed but the contents of the register remain unchanged. When enabled, Bit-Reversed Addressing is executed only for Register Indirect with Pre-Increment or Post-Increment Addressing and word-sized data writes. It will not function for any other addressing mode or for byte-sized data, and normal addresses are generated instead. When Bit-Reversed Addressing is active, the W Address Pointer is always added to the address modifier (XB), and the offset associated with the Register Indirect Addressing mode is ignored. In addition, as word-sized data is a requirement, the LSb of the EA is ignored (and always clear). Note: Modulo Addressing and Bit-Reversed Addressing should not be enabled together. If an application attempts to do so, Bit-Reversed Addressing will assume priority when active for the X WAGU and X WAGU, Modulo Addressing will be disabled. However, Modulo Addressing will continue to function in the X RAGU. 4.5 Bit-Reversed Addressing Bit-Reversed Addressing mode is intended to simplify data re-ordering for radix-2 FFT algorithms. It is supported by the X AGU for data writes only. The modifier, which can be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. 4.5.1 BIT-REVERSED ADDRESSING IMPLEMENTATION If Bit-Reversed Addressing has already been enabled by setting the BREN bit (XBREV<15>), a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. Bit-Reversed Addressing mode is enabled in any of these situations: * BWM bits (W register selection) in the MODCON register are any value other than `15' (the stack cannot be accessed using Bit-Reversed Addressing) * The BREN bit is set in the XBREV register * The addressing mode used is Register Indirect with Pre-Increment or Post-Increment (c) 2011 Microchip Technology Inc. DS70283H-page 51 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 4-6: BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-Word Bit-Reversed Buffer TABLE 4-27: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address Bit-Reversed Address Decimal 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 A3 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 A2 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Decimal 0 8 4 12 2 10 6 14 1 9 5 13 3 11 7 15 A3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 A2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 DS70283H-page 52 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.6 Interfacing Program and Data Memory Spaces 4.6.1 ADDRESSING PROGRAM SPACE Since the address ranges for the data and program spaces are 16 and 24 bits, respectively, a method is needed to create a 23-bit or 24-bit program address from 16-bit data registers. The solution depends on the interface method to be used. For table operations, the 8-bit Table Page register (TBLPAG) is used to define a 32K word region within the program space. This is concatenated with a 16-bit EA to arrive at a full 24-bit program space address. In this format, the Most Significant bit of TBLPAG is used to determine if the operation occurs in the user memory (TBLPAG<7> = 0) or the configuration memory (TBLPAG<7> = 1). For remapping operations, the 8-bit Program Space Visibility register (PSVPAG) is used to define a 16K word page in the program space. When the Most Significant bit of the EA is `1', PSVPAG is concatenated with the lower 15 bits of the EA to form a 23-bit program space address. Unlike table operations, this limits remapping operations strictly to the user memory area. Table 4-28 and Figure 4-7 show how the program EA is created for table operations and remapping accesses from the data EA. Here, P<23:0> refers to a program space word, and D<15:0> refers to a data space word. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 architecture uses a 24-bit-wide program space and a 16-bit-wide data space. The architecture is also a modified Harvard scheme, meaning that data can also be present in the program space. To use this data successfully, it must be accessed in a way that preserves the alignment of information in both spaces. Aside from normal execution, the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 architecture provides two methods by which program space can be accessed during operation: * Using table instructions to access individual bytes or words anywhere in the program space * Remapping a portion of the program space into the data space (Program Space Visibility) Table instructions allow an application to read or write to small areas of the program memory. This capability makes the method ideal for accessing data tables that need to be updated periodically. It also allows access to all bytes of the program word. The remapping method allows an application to access a large block of data on a read-only basis, which is ideal for look-ups from a large table of static data. The application can only access the least significant word of the program word. TABLE 4-28: PROGRAM SPACE ADDRESS CONSTRUCTION Access Space User User Configuration Program Space Address <23> 0 0xx xxxx TBLPAG<7:0> 0xxx xxxx TBLPAG<7:0> 1xxx xxxx 0 0 PSVPAG<7:0> xxxx xxxx <22:16> <15> PC<22:1> xxxx xxxx xxxx xxx0 Data EA<15:0> xxxx xxxx xxxx xxxx Data EA<15:0> xxxx xxxx xxxx xxxx Data EA<14:0>(1) xxx xxxx xxxx xxxx <14:1> <0> 0 Access Type Instruction Access (Code Execution) TBLRD/TBLWT (Byte/Word Read/Write) Program Space Visibility (Block Remap/Read) Note 1: User Data EA<15> is always `1' in this case, but is not used in calculating the program space address. Bit 15 of the address is PSVPAG<0>. (c) 2011 Microchip Technology Inc. DS70283H-page 53 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 4-7: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION Program Counter(1) 0 Program Counter 23 bits 0 EA Table Operations(2) 1/0 TBLPAG 8 bits 24 bits 16 bits 1/0 Select Program Space Visibility(1) (Remapping) 0 PSVPAG 8 bits 1 EA 0 15 bits 23 bits User/Configuration Space Select Byte Select Note 1: The Least Significant bit (LSb) of program space addresses is always fixed as `0' to maintain word alignment of data in the program and data spaces. 2: Table operations are not required to be word-aligned. Table read operations are permitted in the configuration memory space. DS70283H-page 54 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.6.2 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS - In Byte mode, either the upper or lower byte of the lower program word is mapped to the lower byte of a data address. The upper byte is selected when Byte Select is `1'; the lower byte is selected when it is `0'. * TBLRDH (Table Read High): - In Word mode, this instruction maps the entire upper word of a program address (P<23:16>) to a data address. Note that D<15:8>, the `phantom byte', will always be `0'. - In Byte mode, this instruction maps the upper or lower byte of the program word to D<7:0> of the data address, in the TBLRDL instruction. The data is always `0' when the upper `phantom' byte is selected (Byte Select = 1). In a similar fashion, two table instructions, TBLWTH and TBLWTL, are used to write individual bytes or words to a program space address. The details of their operation are explained in Section 5.0 "Flash Program Memory". For all table operations, the area of program memory space to be accessed is determined by the Table Page register (TBLPAG). TBLPAG covers the entire program memory space of the device, including user and configuration spaces. When TBLPAG<7> = 0, the table page is located in the user memory space. When TBLPAG<7> = 1, the page is located in configuration space. The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lower word of any address within the program space without going through data space. The TBLRDH and TBLWTH instructions are the only method to read or write the upper 8 bits of a program space word as data. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit-wide word address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space that contains the least significant data word. TBLRDH and TBLWTH access the space that contains the upper data byte. Two table instructions are provided to move byte or word-sized (16-bit) data to and from program space. Both function as either byte or word operations. * TBLRDL (Table Read Low): - In Word mode, this instruction maps the lower word of the program space location (P<15:0>) to a data address (D<15:0>). FIGURE 4-8: TBLPAG ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS Program Space 02 23 15 0 0x000000 00000000 00000000 23 16 8 0 0x020000 0x030000 00000000 00000000 `Phantom' Byte TBLRDH.B (Wn<0> = 0) TBLRDL.B (Wn<0> = 1) TBLRDL.B (Wn<0> = 0) TBLRDL.W The address for the table operation is determined by the data EA within the page defined by the TBLPAG register. Only read operations are shown; write operations are also valid in the user memory area. 0x800000 (c) 2011 Microchip Technology Inc. DS70283H-page 55 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 4.6.3 READING DATA FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY 24-bit program word are used to contain the data. The upper 8 bits of any program space location used as data should be programmed with `1111 1111' or `0000 0000' to force a NOP. This prevents possible issues should the area of code ever be accidentally executed. Note: PSV access is temporarily disabled during table reads/writes. The upper 32 Kbytes of data space may optionally be mapped into any 16K word page of the program space. This option provides transparent access to stored constant data from the data space without the need to use special instructions (such as TBLRDL/H). Program space access through the data space occurs if the Most Significant bit of the data space EA is `1' and program space visibility is enabled by setting the PSV bit in the Core Control register (CORCON<2>). The location of the program memory space to be mapped into the data space is determined by the Program Space Visibility Page register (PSVPAG). This 8-bit register defines any one of 256 possible pages of 16K words in program space. In effect, PSVPAG functions as the upper 8 bits of the program memory address, with the 15 bits of the EA functioning as the lower bits. By incrementing the PC by 2 for each program memory word, the lower 15 bits of data space addresses directly map to the lower 15 bits in the corresponding program space addresses. Data reads to this area add a cycle to the instruction being executed, since two program memory fetches are required. Although each data space address 8000h and higher maps directly into a corresponding program memory address (see Figure 4-9), only the lower 16 bits of the For operations that use PSV and are executed outside a REPEAT loop, the MOV and MOV.D instructions require one instruction cycle in addition to the specified execution time. All other instructions require two instruction cycles in addition to the specified execution time. For operations that use PSV, and are executed inside a REPEAT loop, these instances require two instruction cycles in addition to the specified execution time of the instruction: * Execution in the first iteration * Execution in the last iteration * Execution prior to exiting the loop due to an interrupt * Execution upon re-entering the loop after an interrupt is serviced Any other iteration of the REPEAT loop will allow the instruction using PSV to access data, to execute in a single cycle. FIGURE 4-9: PROGRAM SPACE VISIBILITY OPERATION When CORCON<2> = 1 and EA<15> = 1: Program Space PSVPAG 02 23 15 0 0x000000 0x010000 0x018000 The data in the page designated by PSVPAG is mapped into the upper half of the data memory space... Data Space 0x0000 Data EA<14:0> 0x8000 PSV Area ...while the lower 15 bits of the EA specify an exact address within 0xFFFF the PSV area. This corresponds exactly to the same lower 15 bits of the actual program space address. 0x800000 DS70283H-page 56 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 5.0 FLASH PROGRAM MEMORY Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 5. "Flash Programming" (DS70191) of the "dsPIC33F/PIC24H Family Reference Manual" which is available from the Microchip web site (www.microchip.com) 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices contain internal Flash program memory for storing and executing application code. The memory is readable, writable and erasable during normal operation over the entire VDD range. Flash memory can be programmed in two ways: * In-Circuit Serial ProgrammingTM (ICSPTM) programming capability * Run-Time Self-Programming (RTSP) ICSP allows a dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 device to be serially programmed while in the end application circuit. This is done with two lines for programming clock and programming data (one of the alternate programming pin pairs: PGECx/PGEDx), and three other lines for power (VDD), ground (VSS) and Master Clear (MCLR). This allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user application can write program memory data either in blocks or `rows' of 64 instructions (192 bytes) at a time or a single program memory word, and erase program memory in blocks or `pages' of 512 instructions (1536 bytes) at a time. 5.1 Table Instructions and Flash Programming Regardless of the method used, all programming of Flash memory is done with the table read and table write instructions. These allow direct read and write access to the program memory space from the data memory while the device is in normal operating mode. The 24-bit target address in the program memory is formed using bits <7:0> of the TBLPAG register and the Effective Address (EA) from a W register specified in the table instruction, as shown in Figure 5-1. The TBLRDL and the TBLWTL instructions are used to read or write to bits <15:0> of program memory. TBLRDL and TBLWTL can access program memory in both Word and Byte modes. The TBLRDH and TBLWTH instructions are used to read or write to bits <23:16> of program memory. TBLRDH and TBLWTH can also access program memory in Word or Byte mode. FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS 24 bits Using Program Counter 0 Program Counter 0 Working Reg EA Using Table Instruction 1/0 TBLPAG Reg 8 bits 16 bits User/Configuration Space Select 24-bit EA Byte Select (c) 2011 Microchip Technology Inc. DS70283H-page 57 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 5.2 RTSP Operation The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Flash program memory array is organized into rows of 64 instructions or 192 bytes. RTSP allows the user application to erase a page of memory, which consists of eight rows (512 instructions) at a time, and to program one row or one word at a time. Table 24-12 shows typical erase and programming times. The 8-row erase pages and single row write rows are edge-aligned from the beginning of program memory, on boundaries of 1536 bytes and 192 bytes, respectively. The program memory implements holding buffers that can contain 64 instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the buffers sequentially. The instruction words loaded must always be from a group of 64 boundary. The basic sequence for RTSP programming is to set up a Table Pointer, then do a series of TBLWT instructions to load the buffers. Programming is performed by setting the control bits in the NVMCON register. A total of 64 TBLWTL and TBLWTH instructions are required to load the instructions. All of the table write operations are single-word writes (two instruction cycles) because only the buffers are written. A programming cycle is required for programming each row. For example, if the device is operating at +125 C, the FRC accuracy will be 5%. If the TUN<5:0> bits (see Register 8-4) are set to `b111111,the minimum row write time is equal to Equation 5-2. EQUATION 5-2: MINIMUM ROW WRITE TIME 11064 Cycles T RW = ----------------------------------------------------------------------------------------------- = 1.435ms 7.37 MHz x ( 1 + 0.05 ) x ( 1 - 0.00375 ) The maximum row write time is equal to Equation 5-3. EQUATION 5-3: MAXIMUM ROW WRITE TIME 11064 Cycles T RW = ----------------------------------------------------------------------------------------------- = 1.586ms 7.37 MHz x ( 1 - 0.05 ) x ( 1 - 0.00375 ) Setting the WR bit (NVMCON<15>) starts the operation, and the WR bit is automatically cleared when the operation is finished. 5.4 Control Registers Two SFRs are used to read and write the program Flash memory: NVMCON and NVMKEY. The NVMCON register (Register 5-1) controls which blocks are to be erased, which memory type is to be programmed and the start of the programming cycle. NVMKEY is a write-only register that is used for write protection. To start a programming or erase sequence, the user application must consecutively write 0x55 and 0xAA to the NVMKEY register. Refer to Section 5.3 "Programming Operations" for further details. 5.3 Programming Operations A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. The processor stalls (waits) until the programming operation is finished. The programming time depends on the FRC accuracy (see Table 24-18, "AC Characteristics: Internal RC Accuracy") and the value of the FRC Oscillator Tuning register (see Register 8-4). Use the following formula to calculate the minimum and maximum values for the Row Write Time, Page Erase Time, and Word Write Cycle Time parameters (see Table 24-12, "DC Characteristics: Program Memory"). EQUATION 5-1: PROGRAMMING TIME T --------------------------------------------------------------------------------------------------------------------------7.37 MHz x ( FRC Accuracy )% x ( FRC Tuning )% DS70283H-page 58 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 5-1: R/SO-0(1) WR bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 SO = Settable Only bit W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0(1) ERASE U-0 -- U-0 -- R/W-0(1) R/W-0(1) R/W-0(1) NVMCON: FLASH MEMORY CONTROL REGISTER R/W-0(1) WREN R/W-0(1) WRERR U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0(1) bit 0 NVMOP<3:0>(2) WR: Write Control bit 1 = Initiates a Flash memory program or erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete 0 = Program or erase operation is complete and inactive WREN: Write Enable bit 1 = Enable Flash program/erase operations 0 = Inhibit Flash program/erase operations WRERR: Write Sequence Error Flag bit 1 = An improper program or erase sequence attempt or termination has occurred (bit is set automatically on any set attempt of the WR bit) 0 = The program or erase operation completed normally Unimplemented: Read as `0' ERASE: Erase/Program Enable bit 1 = Perform the erase operation specified by NVMOP<3:0> on the next WR command 0 = Perform the program operation specified by NVMOP<3:0> on the next WR command Unimplemented: Read as `0' NVMOP<3:0>: NVM Operation Select bits(2) If ERASE = 1: 1111 = Memory bulk erase operation 1101 = Erase General Segment 1100 = Erase Secure Segment 0011 = No operation 0010 = Memory page erase operation 0001 = No operation 0000 = Erase a single Configuration register byte If ERASE = 0: 1111 = No operation 1101 = No operation 1100 = No operation 0011 = Memory word program operation 0010 = No operation 0001 = Memory row program operation 0000 = Program a single Configuration register byte bit 14 bit 13 bit 12-7 bit 6 bit 5-4 bit 3-0 Note 1: 2: These bits can only be Reset on a POR. All other combinations of NVMOP<3:0> are unimplemented. (c) 2011 Microchip Technology Inc. DS70283H-page 59 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 5-2: U-0 -- bit 15 W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-8 bit 7-0 SO = Settable Only bit W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown W-0 W-0 W-0 W-0 W-0 W-0 W-0 bit 0 NVMKEY: NONVOLATILE MEMORY KEY REGISTER U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 NVMKEY<7:0> Unimplemented: Read as `0' NVMKEY<7:0>: Key Register (write-only) bits DS70283H-page 60 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 5.4.1 PROGRAMMING ALGORITHM FOR FLASH PROGRAM MEMORY 4. 5. Write the first 64 instructions from data RAM into the program memory buffers (see Example 5-2). Write the program block to Flash memory: a) Set the NVMOP bits to `0001' to configure for row programming. Clear the ERASE bit and set the WREN bit. b) Write 0x55 to NVMKEY. c) Write 0xAA to NVMKEY. d) Set the WR bit. The programming cycle begins and the CPU stalls for the duration of the write cycle. When the write to Flash memory is done, the WR bit is cleared automatically. Repeat steps 4 and 5, using the next available 64 instructions from the block in data RAM by incrementing the value in TBLPAG, until all 512 instructions are written back to Flash memory. Programmers can program one row of program Flash memory at a time. To do this, it is necessary to erase the 8-row erase page that contains the desired row. The general process is: 1. 2. 3. Read eight rows of program memory (512 instructions) and store in data RAM. Update the program data in RAM with the desired new data. Erase the block (see Example 5-1): a) Set the NVMOP bits (NVMCON<3:0>) to `0010' to configure for block erase. Set the ERASE (NVMCON<6>) and WREN (NVMCON<14>) bits. b) Write the starting address of the page to be erased into the TBLPAG and W registers. c) Write 0x55 to NVMKEY. d) Write 0xAA to NVMKEY. e) Set the WR bit (NVMCON<15>). The erase cycle begins and the CPU stalls for the duration of the erase cycle. When the erase is done, the WR bit is cleared automatically. 6. For protection against accidental operations, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user application must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs, as shown in Example 5-3. EXAMPLE 5-1: ERASING A PROGRAM MEMORY PAGE ; ; Initialize NVMCON ; ; ; ; ; ; ; ; ; ; ; ; ; Set up NVMCON for block erase operation MOV #0x4042, W0 MOV W0, NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR), W0 MOV W0, TBLPAG MOV #tbloffset(PROG_ADDR), W0 TBLWTL W0, [W0] DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR Initialize PM Page Boundary SFR Initialize in-page EA[15:0] pointer Set base address of erase block Block all interrupts with priority <7 for next 5 instructions Write the 55 key Write the AA key Start the erase sequence Insert two NOPs after the erase command is asserted (c) 2011 Microchip Technology Inc. DS70283H-page 61 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 EXAMPLE 5-2: LOADING THE WRITE BUFFERS ; Set up NVMCON for row programming operations MOV #0x4001, W0 ; MOV W0, NVMCON ; Initialize NVMCON ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000, W0 ; MOV W0, TBLPAG ; Initialize PM Page Boundary SFR MOV #0x6000, W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0, W2 ; MOV #HIGH_BYTE_0, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 1st_program_word MOV #LOW_WORD_1, W2 ; MOV #HIGH_BYTE_1, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2, W2 ; MOV #HIGH_BYTE_2, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch * * * ; 63rd_program_word MOV #LOW_WORD_31, W2 ; MOV #HIGH_BYTE_31, W3 ; TBLWTL W2, [W0] ; Write PM low word into program latch TBLWTH W3, [W0++] ; Write PM high byte into program latch EXAMPLE 5-3: DISI MOV MOV MOV MOV BSET NOP NOP #5 INITIATING A PROGRAMMING SEQUENCE ; Block all interrupts with priority <7 ; for next 5 instructions ; ; ; ; ; ; Write the 55 key Write the AA key Start the erase sequence Insert two NOPs after the erase command is asserted #0x55, W0 W0, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR DS70283H-page 62 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 6.0 RESETS A simplified block diagram of the Reset module is shown in Figure 6-1. Any active source of reset will make the SYSRST signal active. On system Reset, some of the registers associated with the CPU and peripherals are forced to a known Reset state and some are unaffected. Note: Refer to the specific peripheral section or Section 3.0 "CPU" of this manual for register Reset states. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 8. "Reset" (DS70192) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The Reset module combines all reset sources and controls the device Master Reset Signal, SYSRST. The following is a list of device Reset sources: * * * * * * * * POR: Power-on Reset BOR: Brown-out Reset MCLR: Master Clear Pin Reset SWR: RESET Instruction WDTO: Watchdog Timer Reset CM: Configuration Mismatch Reset TRAPR: Trap Conflict Reset IOPUWR: Illegal Condition Device Reset - Illegal Opcode Reset - Uninitialized W Register Reset - Security Reset All types of device Reset sets a corresponding status bit in the RCON register to indicate the type of Reset (see Register 6-1). A POR clears all the bits, except for the POR bit (RCON<0>), that are set. The user application can set or clear any bit at any time during code execution. The RCON bits only serve as status bits. Setting a particular Reset status bit in software does not cause a device Reset to occur. The RCON register also has other bits associated with the Watchdog Timer and device power-saving states. The function of these bits is discussed in other sections of this manual. Note: The status bits in the RCON register should be cleared after they are read so that the next RCON register value after a device Reset is meaningful. FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM RESET Instruction Glitch Filter MCLR WDT Module Sleep or Idle BOR SYSRST POR Internal Regulator VDD VDD Rise Detect Trap Conflict Illegal Opcode Uninitialized W Register Configuration Mismatch (c) 2011 Microchip Technology Inc. DS70283H-page 63 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 6-1: R/W-0 TRAPR bit 15 R/W-0 EXTR bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 SWR R/W-0 SWDTEN(2) R/W-0 WDTO R/W-0 SLEEP R/W-0 IDLE R/W-1 BOR RCON: RESET CONTROL REGISTER(1) R/W-0 IOPUWR U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 CM R/W-0 VREGS bit 8 R/W-1 POR bit 0 TRAPR: Trap Reset Flag bit 1 = A Trap Conflict Reset has occurred 0 = A Trap Conflict Reset has not occurred IOPUWR: Illegal Opcode or Uninitialized W Access Reset Flag bit 1 = An illegal opcode detection, an illegal address mode or uninitialized W register used as an Address Pointer caused a Reset 0 = An illegal opcode or uninitialized W Reset has not occurred Unimplemented: Read as `0' CM: Configuration Mismatch Flag bit 1 = A configuration mismatch Reset has occurred 0 = A configuration mismatch Reset has NOT occurred VREGS: Voltage Regulator Standby During Sleep bit 1 = Voltage regulator is active during Sleep 0 = Voltage regulator goes into Standby mode during Sleep EXTR: External Reset (MCLR) Pin bit 1 = A Master Clear (pin) Reset has occurred 0 = A Master Clear (pin) Reset has not occurred SWR: Software Reset (Instruction) Flag bit 1 = A RESET instruction has been executed 0 = A RESET instruction has not been executed SWDTEN: Software Enable/Disable of WDT bit(2) 1 = WDT is enabled 0 = WDT is disabled WDTO: Watchdog Timer Time-out Flag bit 1 = WDT time-out has occurred 0 = WDT time-out has not occurred SLEEP: Wake-up from Sleep Flag bit 1 = Device has been in Sleep mode 0 = Device has not been in Sleep mode IDLE: Wake-up from Idle Flag bit 1 = Device was in Idle mode 0 = Device was not in Idle mode All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not cause a device Reset. If the FWDTEN Configuration bit is `1' (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. bit 14 bit 13-10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 Note 1: 2: DS70283H-page 64 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 6-1: bit 1 RCON: RESET CONTROL REGISTER(1) (CONTINUED) BOR: Brown-out Reset Flag bit 1 = A Brown-out Reset has occurred 0 = A Brown-out Reset has not occurred POR: Power-on Reset Flag bit 1 = A Power-on Reset has occurred 0 = A Power-on Reset has not occurred All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not cause a device Reset. If the FWDTEN Configuration bit is `1' (unprogrammed), the WDT is always enabled, regardless of the SWDTEN bit setting. bit 0 Note 1: 2: (c) 2011 Microchip Technology Inc. DS70283H-page 65 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 6.1 System Reset 2. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices have two types of Reset: * Cold Reset * Warm Reset A cold Reset is the result of a Power-on Reset (POR) or a Brown-out Reset (BOR). On a cold Reset, the FNOSC configuration bits in the FOSC device configuration register selects the device clock source. A warm Reset is the result of all other reset sources, including the RESET instruction. On warm Reset, the device will continue to operate from the current clock source as indicated by the Current Oscillator Selection bits (COSC<2:0>) in the Oscillator Control register (OSCCON<14:12>). The device is kept in a Reset state until the system power supplies have stabilized at appropriate levels and the oscillator clock is ready. The sequence in which this occurs is detailed below and is shown in Figure 6-2. 1. POR: A POR circuit holds the device in Reset when the power supply is turned on. The POR circuit is active until VDD crosses the VPOR threshold and the delay TPOR has elapsed. 3. BOR: The on-chip voltage regulator has a BOR circuit that keeps the device in Reset until VDD crosses the VBOR threshold and the delay TBOR has elapsed. The delay TBOR ensures that the voltage regulator output becomes stable. PWRT Timer: The programmable power-up timer continues to hold the processor in Reset for a specific period of time (TPWRT) after a BOR. The delay TPWRT ensures that the system power supplies have stabilized at the appropriate level for full-speed operation. After the delay TPWRT has elapsed, the SYSRST becomes inactive, which in turn enables the selected oscillator to start generating clock cycles. Oscillator Delay: The total delay for the clock to be ready for various clock source selections is given in Table 6-1. Refer to Section 8.0 "Oscillator Configuration" for more information. When the oscillator clock is ready, the processor begins execution from location 0x000000. The user application programs a GOTO instruction at the reset address, which redirects program execution to the appropriate start-up routine. The Fail-Safe Clock Monitor (FSCM), if enabled, begins to monitor the system clock when the system clock is ready and the delay TFSCM elapsed. 4. 5. 6. TABLE 6-1: OSCILLATOR DELAY Oscillator Start-up Delay TOSCD TOSCD TOSCD TOSCD -- TOSCD TOSCD -- TOSCD TOSCD Oscillator Start-up Timer -- -- TOST TOST -- TOST TOST -- TOST -- PLL Lock Time -- TLOCK -- -- -- TLOCK TLOCK TLOCK -- -- Total Delay TOSCD TOSCD + TLOCK TOSCD + TOST TOSCD + TOST -- TOSCD + TOST + TLOCK TOSCD + TOST + TLOCK TLOCK TOSCD + TOST TOSCD Oscillator Mode FRC, FRCDIV16, FRCDIVN FRCPLL XT HS EC XTPLL HSPLL ECPLL SOSC LPRC Note 1: 2: 3: TOSCD = Oscillator Start-up Delay (1.1 s max for FRC, 70 s max for LPRC). Crystal Oscillator start-up times vary with crystal characteristics, load capacitance, etc. TOST = Oscillator Start-up Timer Delay (1024 oscillator clock period). For example, TOST = 102.4 s for a 10 MHz crystal and TOST = 32 ms for a 32 kHz crystal. TLOCK = PLL lock time (1.5 ms nominal), if PLL is enabled. DS70283H-page 66 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 6-2: SYSTEM RESET TIMING VBOR Vbor VPOR VDD TPOR 1 POR 2 BOR 3 TPWRT SYSRST 4 TBOR Oscillator Clock TOSCD TOST TLOCK 6 FSCM 5 Device Status Reset Run TFSCM Time Note 1: 2: POR: A POR circuit holds the device in Reset when the power supply is turned on. The POR circuit is active until VDD crosses the VPOR threshold and the delay TPOR has elapsed. BOR: The on-chip voltage regulator has a BOR circuit that keeps the device in Reset until VDD crosses the VBOR threshold and the delay TBOR has elapsed. The delay TBOR ensures the voltage regulator output becomes stable. PWRT Timer: The programmable power-up timer continues to hold the processor in Reset for a specific period of time (TPWRT) after a BOR. The delay TPWRT ensures that the system power supplies have stabilized at the appropriate level for full-speed operation. After the delay TPWRT has elapsed, the SYSRST becomes inactive, which in turn enables the selected oscillator to start generating clock cycles. Oscillator Delay: The total delay for the clock to be ready for various clock source selections are given in Table 6-1. Refer to Section 8.0 "Oscillator Configuration" for more information. When the oscillator clock is ready, the processor begins execution from location 0x000000. The user application programs a GOTO instruction at the reset address, which redirects program execution to the appropriate start-up routine. The Fail-Safe Clock Monitor (FSCM), if enabled, begins to monitor the system clock when the system clock is ready and the delay TFSCM elapsed. 3: 4: 5: 6: (c) 2011 Microchip Technology Inc. DS70283H-page 67 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 6-2: VPOR TPOR VBOR TBOR TPWRT TFSCM Note: OSCILLATOR DELAY Symbol Parameter POR threshold POR extension time BOR threshold BOR extension time Programmable power-up time delay Fail-Safe Clock Monitor Delay 1.8V nominal 30 s maximum 2.5V nominal 100 s maximum 0-128 ms nominal 900 s maximum Value When the device exits the Reset condition (begins normal operation), the device operating parameters (voltage, frequency, temperature, etc.) must be within their operating ranges, otherwise the device may not function correctly. The user application must ensure that the delay between the time power is first applied, and the time SYSRST becomes inactive, is long enough to get all operating parameters within specification. 6.2.1 Brown-out Reset (BOR) and Power-up timer (PWRT) The on-chip regulator has a Brown-out Reset (BOR) circuit that resets the device when the VDD is too low (VDD < VBOR) for proper device operation. The BOR circuit keeps the device in Reset until VDD crosses VBOR threshold and the delay TBOR has elapsed. The delay TBOR ensures the voltage regulator output becomes stable. The BOR status bit (BOR) in the Reset Control register (RCON<1>) is set to indicate the Brown-out Reset. The device will not run at full speed after a BOR as the VDD should rise to acceptable levels for full-speed operation. The PWRT provides power-up time delay (TPWRT) to ensure that the system power supplies have stabilized at the appropriate levels for full-speed operation before the SYSRST is released. The power-up timer delay (TPWRT) is programmed by the Power-on Reset Timer Value Select bits (FPWRT<2:0>) in the POR Configuration register (FPOR<2:0>), which provides eight settings (from 0 ms to 128 ms). Refer to Section 21.0 "Special Features" for further details. Figure 6-3 shows the typical brown-out scenarios. The reset delay (TBOR + TPWRT) is initiated each time VDD rises above the VBOR trip point 6.2 Power-on Reset (POR) A Power-on Reset (POR) circuit ensures the device is reset from power-on. The POR circuit is active until VDD crosses the VPOR threshold and the delay TPOR has elapsed. The delay TPOR ensures the internal device bias circuits become stable. The device supply voltage characteristics must meet the specified starting voltage and rise rate requirements to generate the POR. Refer to Section 24.0 "Electrical Characteristics" for details. The POR status bit (POR) in the Reset Control register (RCON<0>) is set to indicate the Power-on Reset. DS70283H-page 68 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 6-3: VDD VBOR TBOR + TPWRT SYSRST BROWN-OUT SITUATIONS VDD VBOR TBOR + TPWRT SYSRST VDD dips before PWRT expires VDD VBOR TBOR + TPWRT SYSRST 6.3 External Reset (EXTR) The external Reset is generated by driving the MCLR pin low. The MCLR pin is a Schmitt trigger input with an additional glitch filter. Reset pulses that are longer than the minimum pulse-width will generate a Reset. Refer to Section 24.0 "Electrical Characteristics" for minimum pulse-width specifications. The External Reset (MCLR) Pin (EXTR) bit in the Reset Control register (RCON) is set to indicate the MCLR Reset. The Software Reset (Instruction) Flag (SWR) bit in the Reset Control register (RCON<6>) is set to indicate the software Reset. 6.5 Watchdog Time-out Reset (WDTO) 6.3.1 EXTERNAL SUPERVISORY CIRCUIT Whenever a Watchdog time-out occurs, the device will asynchronously assert SYSRST. The clock source will remain unchanged. A WDT time-out during Sleep or Idle mode will wake-up the processor, but will not reset the processor. The Watchdog Timer Time-out Flag bit (WDTO) in the Reset Control register (RCON<4>) is set to indicate the Watchdog Reset. Refer to Section 21.4 "Watchdog Timer (WDT)" for more information on Watchdog Reset. Many systems have external supervisory circuits that generate reset signals to Reset multiple devices in the system. This external Reset signal can be directly connected to the MCLR pin to Reset the device when the rest of system is Reset. 6.3.2 INTERNAL SUPERVISORY CIRCUIT 6.6 Trap Conflict Reset When using the internal power supervisory circuit to Reset the device, the external reset pin (MCLR) should be tied directly or resistively to VDD. In this case, the MCLR pin will not be used to generate a Reset. The external reset pin (MCLR) does not have an internal pull-up and must not be left unconnected. If a lower-priority hard trap occurs while a higher-priority trap is being processed, a hard trap conflict Reset occurs. The hard traps include exceptions of priority level 13 through level 15, inclusive. The address error (level 13) and oscillator error (level 14) traps fall into this category. The Trap Reset Flag bit (TRAPR) in the Reset Control register (RCON<15>) is set to indicate the Trap Conflict Reset. Refer to Section 7.0 "Interrupt Controller" for more information on trap conflict Resets. 6.4 Software RESET Instruction (SWR) Whenever the RESET instruction is executed, the device will assert SYSRST, placing the device in a special Reset state. This Reset state will not re-initialize the clock. The clock source in effect prior to the RESET instruction will remain. SYSRST is released at the next instruction cycle, and the reset vector fetch will commence. (c) 2011 Microchip Technology Inc. DS70283H-page 69 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 6.7 Configuration Mismatch Reset To maintain the integrity of the peripheral pin select control registers, they are constantly monitored with shadow registers in hardware. If an unexpected change in any of the registers occur (such as cell disturbances caused by ESD or other external events), a configuration mismatch Reset occurs. The Configuration Mismatch Flag bit (CM) in the Reset Control register (RCON<9>) is set to indicate the configuration mismatch Reset. Refer to Section 10.0 "I/O Ports" for more information on the configuration mismatch Reset. Note: The configuration mismatch feature and associated reset flag is not available on all devices. each program memory section to store the data values. The upper 8 bits should be programmed with 3Fh, which is an illegal opcode value. 6.8.2 UNINITIALIZED W REGISTER RESET Any attempts to use the uninitialized W register as an address pointer will Reset the device. The W register array (with the exception of W15) is cleared during all resets and is considered uninitialized until written to. 6.8.3 SECURITY RESET If a Program Flow Change (PFC) or Vector Flow Change (VFC) targets a restricted location in a protected segment (Boot and Secure Segment), that operation will cause a security Reset. The PFC occurs when the Program Counter is reloaded as a result of a Call, Jump, Computed Jump, Return, Return from Subroutine, or other form of branch instruction. The VFC occurs when the Program Counter is reloaded with an Interrupt or Trap vector. Refer to Section 21.8 "Code Protection and CodeGuardTM Security" for more information on Security Reset. 6.8 Illegal Condition Device Reset An illegal condition device Reset occurs due to the following sources: * Illegal Opcode Reset * Uninitialized W Register Reset * Security Reset The Illegal Opcode or Uninitialized W Access Reset Flag bit (IOPUWR) in the Reset Control register (RCON<14>) is set to indicate the illegal condition device Reset. 6.9 Using the RCON Status Bits 6.8.1 ILLEGAL OPCODE RESET The user application can read the Reset Control register (RCON) after any device Reset to determine the cause of the reset. Note: The status bits in the RCON register should be cleared after they are read so that the next RCON register value after a device Reset will be meaningful. A device Reset is generated if the device attempts to execute an illegal opcode value that is fetched from program memory. The illegal opcode Reset function can prevent the device from executing program memory sections that are used to store constant data. To take advantage of the illegal opcode Reset, use only the lower 16 bits of Table 6-3 provides a summary of the reset flag bit operation. TABLE 6-3: RESET FLAG BIT OPERATION Flag Bit Set by: Trap conflict event Illegal opcode or uninitialized W register access or Security Reset Configuration Mismatch MCLR Reset RESET instruction WDT time-out PWRSAV #SLEEP instruction PWRSAV #IDLE instruction POR, BOR POR POR,BOR POR,BOR POR,BOR POR POR,BOR PWRSAV instruction, CLRWDT instruction, POR,BOR POR,BOR POR,BOR -- -- Cleared by: TRAPR (RCON<15>) IOPWR (RCON<14>) CM (RCON<9>) EXTR (RCON<7>) SWR (RCON<6>) WDTO (RCON<4>) SLEEP (RCON<3>) IDLE (RCON<2>) BOR (RCON<1>) POR (RCON<0>) Note: All Reset flag bits can be set or cleared by user software. DS70283H-page 70 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 7.0 INTERRUPT CONTROLLER 7.1.1 ALTERNATE INTERRUPT VECTOR TABLE Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 32. "Interrupts (Part III)" (DS70214) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 interrupt controller reduces the numerous peripheral interrupt request signals to a single interrupt request signal to the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CPU. It has the following features: Up to 8 processor exceptions and software traps 7 user-selectable priority levels Interrupt Vector Table (IVT) with up to 118 vectors A unique vector for each interrupt or exception source * Fixed priority within a specified user priority level * Alternate Interrupt Vector Table (AIVT) for debug support * Fixed interrupt entry and return latencies * * * * The Alternate Interrupt Vector Table (AIVT) is located after the IVT, as shown in Figure 7-1. Access to the AIVT is provided by the ALTIVT control bit (INTCON2<15>). If the ALTIVT bit is set, all interrupt and exception processes use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports debugging by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not needed, the AIVT should be programmed with the same addresses used in the IVT. 7.2 Reset Sequence A device Reset is not a true exception because the interrupt controller is not involved in the Reset process. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 device clears its registers in response to a Reset, which forces the PC to zero. The digital signal controller then begins program execution at location 0x000000. A GOTO instruction at the Reset address can redirect program execution to the appropriate start-up routine. Note: Any unimplemented or unused vector locations in the IVT and AIVT should be programmed with the address of a default interrupt handler routine that contains a RESET instruction. 7.1 Interrupt Vector Table The Interrupt Vector Table (IVT) is shown in Figure 7-1. The IVT resides in program memory, starting at location 000004h. The IVT contains 126 vectors consisting of 8 nonmaskable trap vectors plus up to 118 sources of interrupt. In general, each interrupt source has its own vector. Each interrupt vector contains a 24-bit-wide address. The value programmed into each interrupt vector location is the starting address of the associated Interrupt Service Routine (ISR). Interrupt vectors are prioritized in terms of their natural priority. This priority is linked to their position in the vector table. Lower addresses generally have a higher natural priority. For example, the interrupt associated with vector 0 will take priority over interrupts at any other vector address. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices implement up to 26 unique interrupts and 4 nonmaskable traps. These are summarized in Table 7-1 and Table 7-2. (c) 2011 Microchip Technology Inc. DS70283H-page 71 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 7-1: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 INTERRUPT VECTOR TABLE Reset - GOTO Instruction Reset - GOTO Address Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 Interrupt Vector 54 ~ ~ ~ Interrupt Vector 116 Interrupt Vector 117 Reserved Reserved Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Reserved Reserved Interrupt Vector 0 Interrupt Vector 1 ~ ~ ~ Interrupt Vector 52 Interrupt Vector 53 Interrupt Vector 54 ~ ~ ~ Interrupt Vector 116 Interrupt Vector 117 Start of Code 0x000000 0x000002 0x000004 0x000014 Decreasing Natural Order Priority 0x00007C 0x00007E 0x000080 Interrupt Vector Table (IVT)(1) 0x0000FC 0x0000FE 0x000100 0x000102 0x000114 Alternate Interrupt Vector Table (AIVT)(1) 0x00017C 0x00017E 0x000180 0x0001FE 0x000200 Note 1: See Table 7-1 for the list of implemented interrupt vectors. DS70283H-page 72 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 7-1: Vector Number 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 INTERRUPT VECTORS Interrupt Request (IRQ) Number 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 IVT Address 0x000014 0x000016 0x000018 0x00001A 0x00001C 0x00001E 0x000020 0x000022 0x000024 0x000026 0x000028 0x00002A 0x00002C 0x00002E 0x000030 0x000032 0x000034 0x000036 0x000038 0x00003A 0x00003C 0x00003E 0x000040 0x000042 0x000044 0x000046 0x000048 0x00004A 0x00004C 0x00004E 0x000050 0x000052 0x000054 0x000056 0x000058 0x00005A 0x00005C 0x00005E 0x000060 0x000062 0x000064 0x000066 0x000068 0x00006A 0x00006C 0x00006E AIVT Address 0x000114 0x000116 0x000118 0x00011A 0x00011C 0x00011E 0x000120 0x000122 0x000124 0x000126 0x000128 0x00012A 0x00012C 0x00012E 0x000130 0x000132 0x000134 0x000136 0x000138 0x00013A 0x00013C 0x00013E 0x000140 0x000142 0x000144 0x000146 0x000148 0x00014A 0x00014C 0x00014E 0x000150 0x000152 0x000154 0x000156 0x000158 0x00015A 0x00015C 0x00015E 0x000160 0x000162 0x000164 0x000166 0x000168 0x00016A 0x00016C 0x00016E Interrupt Source INT0 - External Interrupt 0 IC1 - Input Capture 1 OC1 - Output Compare 1 T1 - Timer1 Reserved IC2 - Input Capture 2 OC2 - Output Compare 2 T2 - Timer2 T3 - Timer3 SPI1E - SPI1 Error SPI1 - SPI1 Transfer Done U1RX - UART1 Receiver U1TX - UART1 Transmitter ADC1 - ADC1 Reserved Reserved SI2C1 - I2C1 Slave Events MI2C1 - I2C1 Master Events Reserved Change Notification Interrupt INT1 - External Interrupt 1 Reserved IC7 - Input Capture 7 IC8 - Input Capture 8 Reserved Reserved Reserved Reserved Reserved INT2 - External Interrupt 2 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved (c) 2011 Microchip Technology Inc. DS70283H-page 73 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 7-1: Vector Number 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83-125 INTERRUPT VECTORS (CONTINUED) Interrupt Request (IRQ) Number 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75-117 IVT Address 0x000070 0x000072 0x000074 0x000076 0x000078 0x00007A 0x00007C 0x00007E 0x000080 0x000082 0x000084 0x000086 0x000088 0x00008A 0x00008C 0x00008E 0x000090 0x000092 0x000094 0x000096 0x000098 0x00009A 0x00009C 0x00009E 0x0000A0 0x0000A2 0x0000A4 0x0000A6 0x0000A8 AIVT Address 0x000170 0x000172 0x000174 0x000176 0x000178 0x00017A 0x00017C 0x00017E 0x000180 0x000182 0x000184 0x000186 0x000188 0x00018A 0x00018C 0x00018E 0x000190 0x000192 0x000194 0x000196 0x000198 0x00019A 0x00019C 0x00019E 0x0001A0 0x0001A2 0x0001A4 0x0001A6 0x0001A8 Interrupt Source Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved PWM1 - PWM1 Period Match QEI - Position Counter Compare Reserved Reserved Reserved Reserved FLTA1 - PWM1 Fault A Reserved U1E - UART1 Error Reserved Reserved Reserved Reserved Reserved Reserved Reserved PWM2 - PWM2 Period Match FLTA2 - PWM2 Fault A 0x0000AA-0x0000FE 0x0001AA-0x0001FE Reserved TABLE 7-2: 0 1 2 3 4 5 6 7 TRAP VECTORS IVT Address 0x000004 0x000006 0x000008 0x00000A 0x00000C 0x00000E 0x000010 0x000012 AIVT Address 0x000104 0x000106 0x000108 0x00010A 0x00010C 0x00010E 0x000110 0x000112 Trap Source Reserved Oscillator Failure Address Error Stack Error Math Error Reserved Reserved Reserved Vector Number DS70283H-page 74 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 7.3 Interrupt Control and Status Registers 7.3.4 IPCx The IPC registers are used to set the interrupt priority level for each source of interrupt. Each user interrupt source can be assigned to one of eight priority levels. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices implement a total of 22 registers for the interrupt controller: * * * * * * INTCON1 INTCON2 IFSx IECx IPCx INTTREG 7.3.5 INTTREG The INTTREG register contains the associated interrupt vector number and the new CPU interrupt priority level, which are latched into vector number (VECNUM<6:0>) and Interrupt level bit (ILR<3:0>) fields in the INTTREG register. The new interrupt priority level is the priority of the pending interrupt. The interrupt sources are assigned to the IFSx, IECx and IPCx registers in the same sequence that they are listed in Table 7-1. For example, the INT0 (External Interrupt 0) is shown as having vector number 8 and a natural order priority of 0. Thus, the INT0IF bit is found in IFS0<0>, the INT0IE bit in IEC0<0>, and the INT0IP bits in the first position of IPC0 (IPC0<2:0>). 7.3.1 INTCON1 AND INTCON2 Global interrupt control functions are controlled from INTCON1 and INTCON2. INTCON1 contains the Interrupt Nesting Disable bit (NSTDIS) as well as the control and status flags for the processor trap sources. The INTCON2 register controls the external interrupt request signal behavior and the use of the Alternate Interrupt Vector Table. 7.3.6 STATUS/CONTROL REGISTERS 7.3.2 IFSx The IFS registers maintain all of the interrupt request flags. Each source of interrupt has a status bit, which is set by the respective peripherals or external signal and is cleared via software. Although they are not specifically part of the interrupt control hardware, two of the CPU Control registers contain bits that control interrupt functionality. * The CPU STATUS register, SR, contains the IPL<2:0> bits (SR<7:5>). These bits indicate the current CPU interrupt priority level. The user can change the current CPU priority level by writing to the IPL bits. * The CORCON register contains the IPL3 bit which, together with IPL<2:0>, also indicates the current CPU priority level. IPL3 is a read-only bit so that trap events cannot be masked by the user software. All Interrupt registers are described in Register 7-1 through Register 7-24 in the following pages. 7.3.3 IECx The IEC registers maintain all of the interrupt enable bits. These control bits are used to individually enable interrupts from the peripherals or external signals. (c) 2011 Microchip Technology Inc. DS70283H-page 75 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-1: R-0 OA bit 15 R/W-0(3) IPL2(2) bit 7 Legend: C = Clear only bit S = Set only bit `1' = Bit is set bit 7-5 R = Readable bit W = Writable bit `0' = Bit is cleared U = Unimplemented bit, read as `0' -n = Value at POR x = Bit is unknown R/W-0(3) IPL1(2) R/W-0(3) IPL0(2) R-0 RA R/W-0 N R/W-0 OV R/W-0 Z SR: CPU STATUS REGISTER(1) R-0 OB R/C-0 SA R/C-0 SB R-0 OAB R/C-0 SAB R -0 DA R/W-0 DC bit 8 R/W-0 C bit 0 IPL<2:0>: CPU Interrupt Priority Level Status bits(2) 111 = CPU Interrupt Priority Level is 7 (15), user interrupts disabled 110 = CPU Interrupt Priority Level is 6 (14) 101 = CPU Interrupt Priority Level is 5 (13) 100 = CPU Interrupt Priority Level is 4 (12) 011 = CPU Interrupt Priority Level is 3 (11) 010 = CPU Interrupt Priority Level is 2 (10) 001 = CPU Interrupt Priority Level is 1 (9) 000 = CPU Interrupt Priority Level is 0 (8) For complete register details, see Register 3-1: "SR: CPU STATUS Register". The IPL<2:0> bits are concatenated with the IPL<3> bit (CORCON<3>) to form the CPU Interrupt Priority Level. The value in parentheses indicates the IPL if IPL<3> = 1. User interrupts are disabled when IPL<3> = 1. The IPL<2:0> Status bits are read-only when NSTDIS (INTCON1<15>) = 1. Note 1: 2: 3: REGISTER 7-2: U-0 -- bit 15 R/W-0 SATA bit 7 Legend: R = Readable bit 0' = Bit is cleared bit 3 CORCON: CORE CONTROL REGISTER(1) U-0 -- U-0 -- R/W-0 US R/W-0 EDT R-0 R-0 DL<2:0> R-0 bit 8 R/W-0 SATB R/W-1 SATDW R/W-0 ACCSAT R/C-0 IPL3(2) R/W-0 PSV R/W-0 RND R/W-0 IF bit 0 C = Clear only bit W = Writable bit `x = Bit is unknown -n = Value at POR `1' = Bit is set U = Unimplemented bit, read as `0' IPL3: CPU Interrupt Priority Level Status bit 3(2) 1 = CPU interrupt priority level is greater than 7 0 = CPU interrupt priority level is 7 or less For complete register details, see Register 3-2: "CORCON: CORE Control Register". The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level. Note 1: 2: DS70283H-page 76 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-3: R/W-0 NSTDIS bit 15 R/W-0 SFTACERR bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 DIV0ERR U-0 -- R/W-0 MATHERR R/W-0 ADDRERR R/W-0 STKERR R/W-0 OSCFAIL U-0 -- bit 0 INTCON1: INTERRUPT CONTROL REGISTER 1 R/W-0 OVAERR R/W-0 OVBERR R/W-0 COVAERR R/W-0 COVBERR R/W-0 OVATE R/W-0 OVBTE R/W-0 COVTE bit 8 NSTDIS: Interrupt Nesting Disable bit 1 = Interrupt nesting is disabled 0 = Interrupt nesting is enabled OVAERR: Accumulator A Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator A 0 = Trap was not caused by overflow of Accumulator A OVBERR: Accumulator B Overflow Trap Flag bit 1 = Trap was caused by overflow of Accumulator B 0 = Trap was not caused by overflow of Accumulator B COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit 1 = Trap was caused by catastrophic overflow of Accumulator A 0 = Trap was not caused by catastrophic overflow of Accumulator A COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit 1 = Trap was caused by catastrophic overflow of Accumulator B 0 = Trap was not caused by catastrophic overflow of Accumulator B OVATE: Accumulator A Overflow Trap Enable bit 1 = Trap overflow of Accumulator A 0 = Trap disabled OVBTE: Accumulator B Overflow Trap Enable bit 1 = Trap overflow of Accumulator B 0 = Trap disabled COVTE: Catastrophic Overflow Trap Enable bit 1 = Trap on catastrophic overflow of Accumulator A or B enabled 0 = Trap disabled SFTACERR: Shift Accumulator Error Status bit 1 = Math error trap was caused by an invalid accumulator shift 0 = Math error trap was not caused by an invalid accumulator shift DIV0ERR: Arithmetic Error Status bit 1 = Math error trap was caused by a divide by zero 0 = Math error trap was not caused by a divide by zero Unimplemented: Read as `0' MATHERR: Arithmetic Error Status bit 1 = Math error trap has occurred 0 = Math error trap has not occurred ADDRERR: Address Error Trap Status bit 1 = Address error trap has occurred 0 = Address error trap has not occurred bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 (c) 2011 Microchip Technology Inc. DS70283H-page 77 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-3: bit 2 INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED) STKERR: Stack Error Trap Status bit 1 = Stack error trap has occurred 0 = Stack error trap has not occurred OSCFAIL: Oscillator Failure Trap Status bit 1 = Oscillator failure trap has occurred 0 = Oscillator failure trap has not occurred Unimplemented: Read as `0' bit 1 bit 0 DS70283H-page 78 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-4: R/W-0 ALTIVT bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 INT2EP R/W-0 INT1EP INTCON2: INTERRUPT CONTROL REGISTER 2 R-0 DISI U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 INT0EP bit 0 ALTIVT: Enable Alternate Interrupt Vector Table bit 1 = Use alternate vector table 0 = Use standard (default) vector table DISI: DISI Instruction Status bit 1 = DISI instruction is active 0 = DISI instruction is not active Unimplemented: Read as `0' INT2EP: External Interrupt 2 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge INT1EP: External Interrupt 1 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge INT0EP: External Interrupt 0 Edge Detect Polarity Select bit 1 = Interrupt on negative edge 0 = Interrupt on positive edge bit 14 bit 13-3 bit 2 bit 1 bit 0 (c) 2011 Microchip Technology Inc. DS70283H-page 79 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-5: U-0 -- bit 15 R/W-0 T2IF bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 OC2IF R/W-0 IC2IF U-0 -- R/W-0 T1IF R/W-0 OC1IF R/W-0 IC1IF IFS0: INTERRUPT FLAG STATUS REGISTER 0 U-0 -- R/W-0 AD1IF R/W-0 U1TXIF R/W-0 U1RXIF R/W-0 SPI1IF R/W-0 SPI1EIF R/W-0 T3IF bit 8 R/W-0 INT0IF bit 0 Unimplemented: Read as `0' AD1IF: ADC1 Conversion Complete Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred U1TXIF: UART1 Transmitter Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred U1RXIF: UART1 Receiver Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred SPI1IF: SPI1 Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred SPI1EIF: SPI1 Fault Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred T3IF: Timer3 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred T2IF: Timer2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred OC2IF: Output Compare Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred IC2IF: Input Capture Channel 2 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' T1IF: Timer1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred OC1IF: Output Compare Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 DS70283H-page 80 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-5: bit 1 IFS0: INTERRUPT FLAG STATUS REGISTER 0 (CONTINUED) IC1IF: Input Capture Channel 1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred INT0IF: External Interrupt 0 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 0 (c) 2011 Microchip Technology Inc. DS70283H-page 81 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-6: U-0 -- bit 15 R/W-0 IC8IF bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 IC7IF U-0 -- R/W-0 INT1IF R/W-0 CNIF U-0 -- R/W-0 MI2C1IF IFS1: INTERRUPT FLAG STATUS REGISTER 1 U-0 -- R/W-0 INT2IF U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 SI2C1IF bit 0 Unimplemented: Read as `0' INT2IF: External Interrupt 2 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' IC8IF: Input Capture Channel 8 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred IC7IF: Input Capture Channel 7 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' INT1IF: External Interrupt 1 Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred CNIF: Input Change Notification Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' MI2C1IF: I2C1 Master Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred SI2C1IF: I2C1 Slave Events Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred bit 12-8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 DS70283H-page 82 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-7: R/W-0 FLTA1IF bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 0 IFS3: INTERRUPT FLAG STATUS REGISTER 3 U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 QEIIF R/W-0 PWM1IF U-0 -- bit 8 FLTA1IF: PWM1 Fault A Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' QEIIF: QEI Event Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred PWM1IF: PWM1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' bit 14-11 bit 10 bit 9 bit 8-0 (c) 2011 Microchip Technology Inc. DS70283H-page 83 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-8: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 10 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 U1EIF U-0 -- bit 0 IFS4: INTERRUPT FLAG STATUS REGISTER 4 U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 FLTA2IF R/W-0 PWM2IF U-0 -- bit 8 Unimplemented: Read as `0' FLTA2IF: PWM2 Fault A Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred PWM2IF: PWM2 Error Interrupt Enable bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' U1EIF: UART1 Interrupt Flag Status bit 1 = Interrupt request has occurred 0 = Interrupt request has not occurred Unimplemented: Read as `0' bit 9 bit 8-2 bit 1 bit 0 DS70283H-page 84 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-9: U-0 -- bit 15 R/W-0 T2IE bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 OC2IE R/W-0 IC2IE U-0 -- R/W-0 T1IE R/W-0 OC1IE R/W-0 IC1IE IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 U-0 -- R/W-0 AD1IE R/W-0 U1TXIE R/W-0 U1RXIE R/W-0 SPI1IE R/W-0 SPI1EIE R/W-0 T3IE bit 8 R/W-0 INT0IE bit 0 Unimplemented: Read as `0' AD1IE: ADC1 Conversion Complete Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled U1TXIE: UART1 Transmitter Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled U1RXIE: UART1 Receiver Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled SPI1IE: SPI1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled SPI1EIE: SPI1 Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled T3IE: Timer3 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled T2IE: Timer2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled OC2IE: Output Compare Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled IC2IE: Input Capture Channel 2 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' T1IE: Timer1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled OC1IE: Output Compare Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 (c) 2011 Microchip Technology Inc. DS70283H-page 85 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-9: bit 1 IEC0: INTERRUPT ENABLE CONTROL REGISTER 0 (CONTINUED) IC1IE: Input Capture Channel 1 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled INT0IE: External Interrupt 0 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 0 DS70283H-page 86 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-10: U-0 -- bit 15 R/W-0 IC8IE bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 IC7IE U-0 -- R/W-0 INT1IE R/W-0 CNIE U-0 -- R/W-0 MI2C1IE IEC1: INTERRUPT ENABLE CONTROL REGISTER 1 U-0 -- R/W-0 INT2IE U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 SI2C1IE bit 0 Unimplemented: Read as `0' INT2IE: External Interrupt 2 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' IC8IE: Input Capture Channel 8 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled IC7IE: Input Capture Channel 7 Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' INT1IE: External Interrupt 1 Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled CNIE: Input Change Notification Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' MI2C1IE: I2C1 Master Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled SI2C1IE: I2C1 Slave Events Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled bit 12-8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (c) 2011 Microchip Technology Inc. DS70283H-page 87 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-11: R/W-0 FLTA1IE bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 0 IEC3: INTERRUPT ENABLE CONTROL REGISTER 3 U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 QEIIE R/W-0 PWM1IE U-0 -- bit 8 FLTA1IE: PWM1 Fault A Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' QEIIE: QEI Event Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled PWM1IE: PWM1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' bit 14-11 bit 10 bit 9 bit 8-0 DS70283H-page 88 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-12: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 10 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 U1EIE U-0 -- bit 0 IEC4: INTERRUPT ENABLE CONTROL REGISTER 4 U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 FLA2IE R/W-0 PWM2IE U-0 -- bit 8 Unimplemented: Read as `0' FLA2IE: PWM2 Fault A Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled PWM2IE: PWM2 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' U1EIE: UART1 Error Interrupt Enable bit 1 = Interrupt request enabled 0 = Interrupt request not enabled Unimplemented: Read as `0' bit 9 bit 8-2 bit 1 bit 0 (c) 2011 Microchip Technology Inc. DS70283H-page 89 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-13: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 IC1IP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 INT0IP<2:0> bit 0 IPC0: INTERRUPT PRIORITY CONTROL REGISTER 0 R/W-1 R/W-0 T1IP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 OC1IP<2:0> bit 8 R/W-0 R/W-0 Unimplemented: Read as `0' T1IP<2:0>: Timer1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' OC1IP<2:0>: Output Compare Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' IC1IP<2:0>: Input Capture Channel 1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' INT0IP<2:0>: External Interrupt 0 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 bit 10-8 bit 7 bit 6-4 bit 3 bit 2-0 DS70283H-page 90 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-14: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 IC2IP<2:0> R/W-0 U-0 -- U-0 -- U-0 -- U-0 -- bit 0 IPC1: INTERRUPT PRIORITY CONTROL REGISTER 1 R/W-1 R/W-0 T2IP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 OC2IP<2:0> bit 8 R/W-0 Unimplemented: Read as `0' T2IP<2:0>: Timer2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' OC2IP<2:0>: Output Compare Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' IC2IP<2:0>: Input Capture Channel 2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' bit 11 bit 10-8 bit 7 bit 6-4 bit 3-0 (c) 2011 Microchip Technology Inc. DS70283H-page 91 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-15: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 SPI1EIP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 T3IP<2:0> bit 0 IPC2: INTERRUPT PRIORITY CONTROL REGISTER 2 R/W-1 R/W-0 U1RXIP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 SPI1IP<2:0> bit 8 R/W-0 R/W-0 Unimplemented: Read as `0' U1RXIP<2:0>: UART1 Receiver Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' SPI1IP<2:0>: SPI1 Event Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' SPI1EIP<2:0>: SPI1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' T3IP<2:0>: Timer3 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 bit 10-8 bit 7 bit 6-4 bit 3 bit 2-0 DS70283H-page 92 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-16: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-7 bit 6-4 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 AD1IP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 U1TXIP<2:0> bit 0 IPC3: INTERRUPT PRIORITY CONTROL REGISTER 3 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 Unimplemented: Read as `0' AD1IP<2:0>: ADC1 Conversion Complete Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' U1TXIP<2:0>: UART1 Transmitter Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 3 bit 2-0 (c) 2011 Microchip Technology Inc. DS70283H-page 93 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-17: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 MI2C1IP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 SI2C1IP<2:0> bit 0 IPC4: INTERRUPT PRIORITY CONTROL REGISTER 4 R/W-1 R/W-0 CNIP<2:0> R/W-0 U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 Unimplemented: Read as `0' CNIP<2:0>: Change Notification Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' MI2C1IP<2:0>: I2C1 Master Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' SI2C1IP<2:0>: I2C1 Slave Events Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11-7 bit 6-4 bit 3 bit 2-0 DS70283H-page 94 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-18: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- R/W-1 R/W-0 INT1IP<2:0> bit 0 IPC5: INTERRUPT PRIORITY CONTROL REGISTER 5 R/W-1 R/W-0 IC8IP<2:0> R/W-0 U-0 -- R/W-1 R/W-0 IC7IP<2:0> bit 8 R/W-0 R/W-0 Unimplemented: Read as `0' IC8IP<2:0>: Input Capture Channel 8 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' IC7IP<2:0>: Input Capture Channel 7 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' INT1IP<2:0>: External Interrupt 1 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled bit 11 bit 10-8 bit 7-3 bit 2-0 (c) 2011 Microchip Technology Inc. DS70283H-page 95 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-19: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-7 bit 6-4 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 INT2IP<2:0> R/W-0 U-0 -- U-0 -- U-0 -- U-0 -- bit 0 IPC7: INTERRUPT PRIORITY CONTROL REGISTER 7 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 Unimplemented: Read as `0' INT2IP<2:0>: External Interrupt 2 Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' bit 3-0 DS70283H-page 96 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-20: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-12 bit 10-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 PWM1IP<2:0> R/W-0 U-0 -- U-0 -- U-0 -- U-0 -- bit 0 IPC14: INTERRUPT PRIORITY CONTROL REGISTER 14 U-0 -- U-0 -- U-0 -- U-0 -- R/W-1 R/W-0 QEIIP<2:0> bit 8 R/W-0 Unimplemented: Read as `0' QEIIP<2:0>: QEI Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' PWM1IP<2:0>: PWM1 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' bit 7 bit 6-4 bit 3-0 (c) 2011 Microchip Technology Inc. DS70283H-page 97 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-21: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 0 IPC15: INTERRUPT PRIORITY CONTROL REGISTER 15 R/W-1 R/W-0 FLTA1IP<2:0> R/W-0 U-0 -- U-0 -- U-0 -- U-0 -- bit 8 Unimplemented: Read as `0' FLTA1IP<2:0>: PWM1 Fault A Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' bit 11-0 REGISTER 7-22: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-7 bit 6-4 IPC16: INTERRUPT PRIORITY CONTROL REGISTER 16 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-1 R/W-0 U1EIP<2:0> R/W-0 U-0 -- U-0 -- U-0 -- U-0 -- bit 0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown Unimplemented: Read as `0' U1EIP<2:0>: UART1 Error Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' bit 3-0 DS70283H-page 98 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-23: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 8-10 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 R/W-0 PWM2IP<2:0> R/W-0 U-0 -- U-0 -- U-0 -- U-0 -- bit 0 IPC18: INTERRUPT PRIORITY CONTROL REGISTER 18 U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 R/W-0 FLTA2IP<2:0> bit 8 R/W-0 Unimplemented: Read as `0' FLTA2IP<2:0>: PWM2 Fault A Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' PWM2IP<2:0>: PWM2 Interrupt Priority bits 111 = Interrupt is priority 7 (highest priority interrupt) * * * 001 = Interrupt is priority 1 000 = Interrupt source is disabled Unimplemented: Read as `0' bit 7 bit 6-4 bit 3-0 (c) 2011 Microchip Technology Inc. DS70283H-page 99 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 7-24: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-12 bit 11-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R-0 R-0 R-0 R-0 VECNUM<6:0> bit 0 R-0 R-0 R-0 INTTREG: INTERRUPT CONTROL AND STATUS REGISTER U-0 -- U-0 -- U-0 -- R-0 R-0 ILR<3:0> bit 8 R-0 R-0 Unimplemented: Read as `0' ILR<3:0>: New CPU Interrupt Priority Level bits 1111 = CPU Interrupt Priority Level is 15 * * * 0001 = CPU Interrupt Priority Level is 1 0000 = CPU Interrupt Priority Level is 0 Unimplemented: Read as `0' VECNUM<6:0>: Vector Number of Pending Interrupt bits 0111111 = Interrupt Vector pending is number 135 * * * 0000001 = Interrupt Vector pending is number 9 0000000 = Interrupt Vector pending is number 8 bit 7 bit 6-0 DS70283H-page 100 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 7.4 7.4.1 1. 2. Interrupt Setup Procedures INITIALIZATION 7.4.3 TRAP SERVICE ROUTINE To configure an interrupt source at initialization: Set the NSTDIS bit (INTCON1<15>) if nested interrupts are not desired. Select the user-assigned priority level for the interrupt source by writing the control bits in the appropriate IPCx register. The priority level will depend on the specific application and type of interrupt source. If multiple priority levels are not desired, the IPCx register control bits for all enabled interrupt sources can be programmed to the same non-zero value. Note: At a device Reset, the IPCx registers are initialized such that all user interrupt sources are assigned to priority level 4. A Trap Service Routine (TSR) is coded like an ISR, except that the appropriate trap status flag in the INTCON1 register must be cleared to avoid re-entry into the TSR. 7.4.4 INTERRUPT DISABLE All user interrupts can be disabled using this procedure: 1. 2. Push the current SR value onto the software stack using the PUSH instruction. Force the CPU to priority level 7 by inclusive ORing the value OEh with SRL. To enable user interrupts, the POP instruction can be used to restore the previous SR value. Note: Only user interrupts with a priority level of 7 or lower can be disabled. Trap sources (level 8-level 15) cannot be disabled. 3. 4. Clear the interrupt flag status bit associated with the peripheral in the associated IFSx register. Enable the interrupt source by setting the interrupt enable control bit associated with the source in the appropriate IECx register. The DISI instruction provides a convenient way to disable interrupts of priority levels 1-6 for a fixed period of time. Level 7 interrupt sources are not disabled by the DISI instruction. 7.4.2 INTERRUPT SERVICE ROUTINE The method used to declare an Interrupt Service Routine (ISR) and initialize the IVT with the correct vector address depends on the programming language (C or assembler) and the language development tool suite used to develop the application. In general, the user application must clear the interrupt flag in the appropriate IFSx register for the source of interrupt that the ISR handles. Otherwise, program will re-enter the ISR immediately after exiting the routine. If the ISR is coded in assembly language, it must be terminated using a RETFIE instruction to unstack the saved PC value, SRL value and old CPU priority level. (c) 2011 Microchip Technology Inc. DS70283H-page 101 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 102 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 8.0 OSCILLATOR CONFIGURATION The oscillator system for dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices provides: * External and internal oscillator options as clock sources. * An on-chip Phase-Locked Loop (PLL) to scale the internal operating frequency to the required system clock frequency. * An internal FRC oscillator that can also be used with the PLL, thereby allowing full-speed operation without any external clock generation hardware. * Clock switching between various clock sources. * Programmable clock postscaler for system power savings. * A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures. * A Clock Control register (OSCCON). * Nonvolatile Configuration bits for main oscillator selection. A simplified diagram of the oscillator system is shown in Figure 8-1. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 7. "Oscillator" (DS70186) of the dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. FIGURE 8-1: OSC1 R(2) dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 OSCILLATOR SYSTEM DIAGRAM Primary Oscillator (POSC) XT, HS, EC DOZE<2:0> S2 DOZE FCY(3) S3 S1 OSC2 POSCMD<1:0> PLL (1) XTPLL, HSPLL, ECPLL, FRCPLL S1/S3 FP(3) FRC Oscillator FRCDIV FRCDIVN S7 /2 FOSC TUN<5:0> / 16 FRCDIV<2:0> FRCDIV16 FRC LPRC S6 S0 LPRC Oscillator Secondary Oscillator (SOSC) SOSCO LPOSCEN SOSCI S5 SOSC S4 Clock Fail Clock Switch Reset S7 NOSC<2:0> FNOSC<2:0> WDT, PWRT, FSCM Timer 1 Note 1: See Figure 8-2 for PLL details. 2: If the Oscillator is used with XT or HS modes, an external parallel resistor with the value of 1 M must be connected. 3: The term FP refers to the clock source for all of the peripherals, while FCY refers to the clock source for the CPU. Throughout this document, FCY and FP are used interchangably, except in the case of DOZE mode. FP and FCY will be different when DOZE mode is used with any ratio other than 1:1 which is the default. (c) 2011 Microchip Technology Inc. DS70283H-page 103 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 8.1 CPU Clocking System 8.1.2 SYSTEM CLOCK SELECTION The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices provide seven system clock options: * * * * * * * Fast RC (FRC) Oscillator FRC Oscillator with PLL Primary (XT, HS or EC) Oscillator Primary Oscillator with PLL Secondary (LP) Oscillator Low-Power RC (LPRC) Oscillator FRC Oscillator with postscaler The oscillator source used at a device Power-on Reset event is selected using Configuration bit settings. The oscillator Configuration bit settings are located in the Configuration registers in the program memory. (Refer to Section 21.1 "Configuration Bits" for further details.) The Initial Oscillator Selection Configuration bits, FNOSC<2:0> (FOSCSEL<2:0>), and the Primary Oscillator Mode Select Configuration bits, POSCMD<1:0> (FOSC<1:0>), select the oscillator source that is used at a Power-on Reset. The FRC primary oscillator is the default (unprogrammed) selection. The Configuration bits allow users to choose among 12 different clock modes, shown in Table 8-1. The output of the oscillator (or the output of the PLL if a PLL mode has been selected) FOSC is divided by 2 to generate the device instruction clock (FCY) and the peripheral clock time base (FP). FCY defines the operating speed of the device, and speeds up to 40 MHz are supported by the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 architecture. Instruction execution speed or device operating frequency, FCY, is given by: 8.1.1 8.1.1.1 SYSTEM CLOCK SOURCES Fast RC The Fast RC (FRC) internal oscillator runs at a nominal frequency of 7.37 MHz. User software can tune the FRC frequency. User software can optionally specify a factor (ranging from 1:2 to 1:256) by which the FRC clock frequency is divided. This factor is selected using the FRCDIV<2:0> bits (CLKDIV<10:8>). 8.1.1.2 Primary The primary oscillator can use one of the following as its clock source: * XT (Crystal): Crystals and ceramic resonators in the range of 3 MHz to 10 MHz. The crystal is connected to the OSC1 and OSC2 pins. * HS (High-Speed Crystal): Crystals in the range of 10 MHz to 40 MHz. The crystal is connected to the OSC1 and OSC2 pins. * EC (External Clock): The external clock signal is directly applied to the OSC1 pin. EQUATION 8-1: DEVICE OPERATING FREQUENCY ------------FCY = FOSC 2 8.1.3 PLL CONFIGURATION 8.1.1.3 Secondary The secondary (LP) oscillator is designed for low power and uses a 32.768 kHz crystal or ceramic resonator. The LP oscillator uses the SOSCI and SOSCO pins. The primary oscillator and internal FRC oscillator can optionally use an on-chip PLL to obtain higher speeds of operation. The PLL provides significant flexibility in selecting the device operating speed. A block diagram of the PLL is shown in Figure 8-2. The output of the primary oscillator or FRC, denoted as `FIN', is divided down by a prescale factor (N1) of 2, 3, ... or 33 before being provided to the PLL's Voltage Controlled Oscillator (VCO). The input to the VCO must be selected in the range of 0.8 MHz to 8 MHz. The prescale factor `N1' is selected using the PLLPRE<4:0> bits (CLKDIV<4:0>). The PLL Feedback Divisor, selected using the PLLDIV<8:0> bits (PLLFBD<8:0>), provides a factor `M', by which the input to the VCO is multiplied. This factor must be selected such that the resulting VCO output frequency is in the range of 100 MHz to 200 MHz. The VCO output is further divided by a postscale factor `N2.' This factor is selected using the PLLPOST<1:0> bits (CLKDIV<7:6>). `N2' can be either 2, 4 or 8, and must be selected such that the PLL output frequency (FOSC) is in the range of 12.5 MHz to 80 MHz, which generates device operating speeds of 6.25-40 MIPS. 8.1.1.4 Low-Power RC The LPRC (Low-Power RC) internal oscIllator runs at a nominal frequency of 32.768 kHz. It is also used as a reference clock by the Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). 8.1.1.5 FRC The clock signals generated by the FRC and primary oscillators can be optionally applied to an on-chip Phase Locked Loop (PLL) to provide a wide range of output frequencies for device operation. PLL configuration is described in Section 8.1.3 "PLL Configuration". The FRC frequency depends on the FRC accuracy (see Table 24-18) and the value of the FRC Oscillator Tuning register (see Register 8-4). DS70283H-page 104 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 For a primary oscillator or FRC oscillator, output `FIN', the PLL output `FOSC' is given by: * If PLLDIV<8:0> = 0x1E, then M = 32. This yields a VCO output of 5 x 32 = 160 MHz, which is within the 100-200 MHz ranged needed. * If PLLPOST<1:0> = 0, then N2 = 2. This provides a Fosc of 160/2 = 80 MHz. The resultant device operating speed is 80/2 = 40 MIPS. EQUATION 8-2: FOSC CALCULATION MFOSC = FIN --------------------- N1 N2 For example, suppose a 10 MHz crystal is being used with the selected oscillator mode of XT with PLL. * If PLLPRE<4:0> = 0, then N1 = 2. This yields a VCO input of 10/2 = 5 MHz, which is within the acceptable range of 0.8-8 MHz. EQUATION 8-3: XT WITH PLL MODE EXAMPLE 1 10000000 32 ------------FCY = FOSC = -- ------------------------------------ = 40 MIPS 2 2 2 2 FIGURE 8-2: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 PLL BLOCK DIAGRAM 0.8-8.0 MHz Here(1) FVCO 100-200 MHz Here(1) VCO PLLDIV N1 Divide by 2-33 N2 Divide by 2, 4, 8 PLLPOST 12.5-80 MHz Here(1) Source (Crystal, External Clock or Internal RC) PLLPRE X FOSC M Divide by 2-513 Note 1: This frequency range must be satisfied at all times. TABLE 8-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Source Internal Internal Internal Secondary Primary Primary Primary Primary Primary Primary Internal Internal POSCMD<1:0> xx xx xx xx 10 01 00 10 01 00 xx xx FNOSC<2:0> 111 110 101 100 011 011 011 010 010 010 001 000 See Note 1, 2 1 1 1 -- -- 1 -- -- 1 1 1 Oscillator Mode Fast RC Oscillator with Divide-by-N (FRCDIVN) Fast RC Oscillator with Divide-by-16 (FRCDIV16) Low-Power RC Oscillator (LPRC) Secondary (Timer1) Oscillator (SOSC) Primary Oscillator (HS) with PLL (HSPLL) Primary Oscillator (XT) with PLL (XTPLL) Primary Oscillator (EC) with PLL (ECPLL) Primary Oscillator (HS) Primary Oscillator (XT) Primary Oscillator (EC) Fast RC Oscillator with PLL (FRCPLL) Fast RC Oscillator (FRC) Note 1: 2: OSC2 pin function is determined by the OSCIOFNC Configuration bit. This is the default oscillator mode for an unprogrammed (erased) device. (c) 2011 Microchip Technology Inc. DS70283H-page 105 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 8-1: U-0 -- bit 15 R/W-0 CLKLOCK bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 y = Value set from Configuration bits on POR W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 IOLOCK R-0 LOCK U-0 -- R/C-0 CF U-0 -- R/W-0 LPOSCEN OSCCON: OSCILLATOR CONTROL REGISTER(1,3) R-0 R-0 COSC<2:0> R-0 U-0 -- R/W-y R/W-y NOSC<2:0>(2) bit 8 R/W-0 OSWEN bit 0 R/W-y Unimplemented: Read as `0' COSC<2:0>: Current Oscillator Selection bits (read-only) 000 = Fast RC oscillator (FRC) 001 = Fast RC oscillator (FRC) with PLL 010 = Primary oscillator (XT, HS, EC) 011 = Primary oscillator (XT, HS, EC) with PLL 100 = Secondary oscillator (SOSC) 101 = Low-Power RC oscillator (LPRC) 110 = Fast RC oscillator (FRC) with Divide-by-16 111 = Fast RC oscillator (FRC) with Divide-by-n Unimplemented: Read as `0' NOSC<2:0>: New Oscillator Selection bits(2) 000 = Fast RC oscillator (FRC) 001 = Fast RC oscillator (FRC) with PLL 010 = Primary oscillator (XT, HS, EC) 011 = Primary oscillator (XT, HS, EC) with PLL 100 = Secondary oscillator (SOSC) 101 = Low-Power RC oscillator (LPRC) 110 = Fast RC oscillator (FRC) with Divide-by-16 111 = Fast RC oscillator (FRC) with Divide-by-n CLKLOCK: Clock Lock Enable bit If clock switching is enabled and FSCM is disabled, (FOSC bit 11 bit 10-8 bit 7 bit 6 bit 5 bit 4 Note 1: 2: 3: DS70283H-page 106 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 8-1: bit 3 OSCCON: OSCILLATOR CONTROL REGISTER(1,3) (CONTINUED) CF: Clock Fail Detect bit (read/clear by application) 1 = FSCM has detected clock failure 0 = FSCM has not detected clock failure Unimplemented: Read as `0' LPOSCEN: Secondary (LP) Oscillator Enable bit 1 = Enable secondary oscillator 0 = Disable secondary oscillator OSWEN: Oscillator Switch Enable bit 1 = Request oscillator switch to selection specified by NOSC<2:0> bits 0 = Oscillator switch is complete Writes to this register require an unlock sequence. Refer to Section 7. "Oscillator" (DS70186) in the "dsPIC33F/PIC24H Family Reference Manual" for details. Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. This register is reset only on a Power-on Reset (POR). bit 2 bit 1 bit 0 Note 1: 2: 3: (c) 2011 Microchip Technology Inc. DS70283H-page 107 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 8-2: R/W-0 ROI bit 15 CLKDIV: CLOCK DIVISOR REGISTER(2) R/W-0 R/W-1 DOZE<2:0> R/W-1 R/W-0 DOZEN(1) R/W-0 R/W-0 FRCDIV<2:0> R/W-0 bit 8 U-0 -- R/W-0 R/W-0 R/W-0 PLLPRE<4:0> R/W-0 R/W-0 bit 0 y = Value set from Configuration bits on POR W = Writable bit U = Unimplemented bit, read as `0' `1' = Bit is set `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-1 PLLPOST<1:0> bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-12 bit 11 bit 10-8 bit 7-6 bit 5 bit 4-0 ROI: Recover on Interrupt bit 1 = Interrupts will clear the DOZEN bit and the processor clock/peripheral clock ratio is set to 1:1 0 = Interrupts have no effect on the DOZEN bit DOZE<2:0>: Processor Clock Reduction Select bits 000 = FCY/1 001 = FCY/2 010 = FCY/4 011 = FCY/8 (default) 100 = FCY/16 101 = FCY/32 110 = FCY/64 111 = FCY/128 DOZEN: DOZE Mode Enable bit(1) 1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks 0 = Processor clock/peripheral clock ratio forced to 1:1 FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits 000 = FRC divide by 1 (default) 001 = FRC divide by 2 010 = FRC divide by 4 011 = FRC divide by 8 100 = FRC divide by 16 101 = FRC divide by 32 110 = FRC divide by 64 111 = FRC divide by 256 PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as `N2', PLL postscaler) 00 = Output/2 01 = Output/4 (default) 10 = Reserved 11 = Output/8 Unimplemented: Read as `0' PLLPRE<4:0>: PLL Phase Detector Input Divider bits (also denoted as `N1', PLL prescaler) 00000 = Input/2 (default) 00001 = Input/3 * * * 11111 = Input/33 This bit is cleared when the ROI bit is set and an interrupt occurs. This register is reset only on a Power-on Reset (POR). Note 1: 2: DS70283H-page 108 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 8-3: U-0 -- bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-9 bit 8-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 PLLFBD: PLL FEEDBACK DIVISOR REGISTER(1) U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 PLLDIV<8> bit 8 R/W-0 bit 0 PLLDIV<7:0> Unimplemented: Read as `0' PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as `M', PLL multiplier) 000000000 = 2 000000001 = 3 000000010 = 4 * * * 000110000 = 50 (default) * * * 111111111 = 513 This register is reset only on a Power-on Reset (POR). Note 1: (c) 2011 Microchip Technology Inc. DS70283H-page 109 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 8-4: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-6 bit 5-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OSCTUN: FRC OSCILLATOR TUNING REGISTER(2) U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 bit 0 TUN<5:0>(1) Unimplemented: Read as `0' TUN<5:0>: FRC Oscillator Tuning bits(1) 011111 = Center frequency + 11.625% (8.23 MHz) 011110 = Center frequency + 11.25% (8.20 MHz) * * * 000001 = Center frequency + 0.375% (7.40 MHz) 000000 = Center frequency (7.37 MHz nominal) 111111 = Center frequency -0.375% (7.345 MHz) * * * 100001 = Center frequency -11.625% (6.52 MHz) 100000 = Center frequency -12% (6.49 MHz) OSCTUN functionality has been provided to help customers compensate for temperature effects on the FRC frequency over a wide range of temperatures. The tuning step size is an approximation and is neither characterized nor tested. This register is reset only on a Power-on Reset (POR). Note 1: 2: DS70283H-page 110 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 8.2 Clock Switching Operation 2. Applications are free to switch among any of the four clock sources (Primary, LP, FRC and LPRC) under software control at any time. To limit the possible side effects of this flexibility, dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices have a safeguard lock built into the switch process. Note: Primary Oscillator mode has three different submodes (XT, HS and EC), which are determined by the POSCMD<1:0> Configuration bits. While an application can switch to and from Primary Oscillator mode in software, it cannot switch among the different primary submodes without reprogramming the device. If a valid clock switch has been initiated, the LOCK (OSCCON<5>) and the CF (OSCCON<3>) status bits are cleared. The new oscillator is turned on by the hardware if it is not currently running. If a crystal oscillator must be turned on, the hardware waits until the Oscillator Start-up Timer (OST) expires. If the new source is using the PLL, the hardware waits until a PLL lock is detected (LOCK = 1). The hardware waits for 10 clock cycles from the new clock source and then performs the clock switch. The hardware clears the OSWEN bit to indicate a successful clock transition. In addition, the NOSC bit values are transferred to the COSC status bits. The old clock source is turned off at this time, with the exception of LPRC (if WDT or FSCM are enabled) or LP (if LPOSCEN remains set). Note 1: The processor continues to execute code throughout the clock switching sequence. Timing-sensitive code should not be executed during this time. 2: Direct clock switches between any primary oscillator mode with PLL and FRCPLL mode are not permitted. This applies to clock switches in either direction. In these instances, the application must switch to FRC mode as a transition clock source between the two PLL modes. 3: Refer to Section 7. "Oscillator" (DS70186) in the "dsPIC33F/PIC24H Family Reference Manual" for details. 3. 4. 5. 6. 8.2.1 ENABLING CLOCK SWITCHING To enable clock switching, the FCKSM1 Configuration bit in the Configuration register must be programmed to `0'. (Refer to Section 21.1 "Configuration Bits" for further details.) If the FCKSM1 Configuration bit is unprogrammed (`1'), the clock switching function and Fail-Safe Clock Monitor function are disabled. This is the default setting. The NOSC control bits (OSCCON<10:8>) do not control the clock selection when clock switching is disabled. However, the COSC bits (OSCCON<14:12>) reflect the clock source selected by the FNOSC Configuration bits. The OSWEN control bit (OSCCON<0>) has no effect when clock switching is disabled. It is held at `0' at all times. 8.2.2 Performing sequence: 1. OSCILLATOR SWITCHING SEQUENCE a clock switch requires this basic 8.3 Fail-Safe Clock Monitor (FSCM) 2. 3. 4. 5. If desired, read the COSC bits (OSCCON<14:12>) to determine the current oscillator source. Perform the unlock sequence to allow a write to the OSCCON register high byte. Write the appropriate value to the NOSC control bits (OSCCON<10:8>) for the new oscillator source. Perform the unlock sequence to allow a write to the OSCCON register low byte. Set the OSWEN bit (OSCCON<0>) to initiate the oscillator switch. The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by programming. If the FSCM function is enabled, the LPRC internal oscillator runs at all times (except during Sleep mode) and is not subject to control by the Watchdog Timer. In the event of an oscillator failure, the FSCM generates a clock failure trap event and switches the system clock over to the FRC oscillator. Then the application program can either attempt to restart the oscillator or execute a controlled shutdown. The trap can be treated as a warm Reset by simply loading the Reset address into the oscillator fail trap vector. If the PLL multiplier is used to scale the system clock, the internal FRC is also multiplied by the same factor on clock failure. Essentially, the device switches to FRC with PLL on a clock failure. Once the basic sequence is completed, the system clock hardware responds automatically as follows: 1. The clock switching hardware compares the COSC status bits with the new value of the NOSC control bits. If they are the same, the clock switch is a redundant operation. In this case, the OSWEN bit is cleared automatically and the clock switch is aborted. (c) 2011 Microchip Technology Inc. DS70283H-page 111 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 112 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 9.0 POWER-SAVING FEATURES 9.2 Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 9. "Watchdog Timer and Power Savings Modes" (DS70196) the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices provide the ability to manage power consumption by selectively managing clocking to the CPU and the peripherals. In general, a lower clock frequency and a reduction in the number of circuits being clocked constitutes lower consumed power. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices can manage power consumption in four different ways: * * * * Clock frequency Instruction-based Sleep and Idle modes Software-controlled Doze mode Selective peripheral control in software Instruction-Based Power-Saving Modes dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices have two special power-saving modes that are entered through the execution of a special PWRSAV instruction. Sleep mode stops clock operation and halts all code execution. Idle mode halts the CPU and code execution, but allows peripheral modules to continue operation. The assembler syntax of the PWRSAV instruction is shown in Example 9-1. Note: SLEEP_MODE and IDLE_MODE are constants defined in the assembler include file for the selected device. Sleep and Idle modes can be exited as a result of an enabled interrupt, WDT time-out or a device Reset. When the device exits these modes, it is said to wake-up. 9.2.1 SLEEP MODE The following occur in Sleep mode: * The system clock source is shut down. If an on-chip oscillator is used, it is turned off. * The device current consumption is reduced to a minimum, provided that no I/O pin is sourcing current. * The Fail-Safe Clock Monitor does not operate, since the system clock source is disabled. * The LPRC clock continues to run in Sleep mode if the WDT is enabled. * The WDT, if enabled, is automatically cleared prior to entering Sleep mode. * Some device features or peripherals may continue to operate. This includes items such as the input change notification on the I/O ports, or peripherals that use an external clock input. * Any peripheral that requires the system clock source for its operation is disabled. The device will wake-up from Sleep mode on any of the these events: * Any interrupt source that is individually enabled * Any form of device Reset * A WDT time-out On wake-up from Sleep mode, the processor restarts with the same clock source that was active when Sleep mode was entered. Combinations of these methods can be used to selectively tailor an application's power consumption while still maintaining critical application features, such as timing-sensitive communications. 9.1 Clock Frequency and Clock Switching dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices allow a wide range of clock frequencies to be selected under application control. If the system clock configuration is not locked, users can choose low-power or high-precision oscillators by simply changing the NOSC bits (OSCCON<10:8>). The process of changing a system clock during operation, as well as limitations to the process, are discussed in more detail in Section 8.0 "Oscillator Configuration". EXAMPLE 9-1: PWRSAV INSTRUCTION SYNTAX ; Put the device into SLEEP mode ; Put the device into IDLE mode PWRSAV #SLEEP_MODE PWRSAV #IDLE_MODE (c) 2011 Microchip Technology Inc. DS70283H-page 113 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 9.2.2 IDLE MODE The following occur in Idle mode: * The CPU stops executing instructions. * The WDT is automatically cleared. * The system clock source remains active. By default, all peripheral modules continue to operate normally from the system clock source, but can also be selectively disabled (see Section 9.4 "Peripheral Module Disable"). * If the WDT or FSCM is enabled, the LPRC also remains active. The device will wake from Idle mode on any of these events: * Any interrupt that is individually enabled * Any device Reset * A WDT time-out On wake-up from Idle mode, the clock is reapplied to the CPU and instruction execution will begin (2-4 cycles later), starting with the instruction following the PWRSAV instruction, or the first instruction in the ISR. Doze mode is enabled by setting the DOZEN bit (CLKDIV<11>). The ratio between peripheral and core clock speed is determined by the DOZE<2:0> bits (CLKDIV<14:12>). There are eight possible configurations, from 1:1 to 1:128, with 1:1 being the default setting. Programs can use Doze mode to selectively reduce power consumption in event-driven applications. This allows clock-sensitive functions, such as synchronous communications, to continue without interruption while the CPU idles, waiting for something to invoke an interrupt routine. An automatic return to full-speed CPU operation on interrupts can be enabled by setting the ROI bit (CLKDIV<15>). By default, interrupt events have no effect on Doze mode operation. For example, suppose the device is operating at 20 MIPS and the CAN module has been configured for 500 kbps based on this device operating speed. If the device is placed in Doze mode with a clock frequency ratio of 1:4, the CAN module continues to communicate at the required bit rate of 500 kbps, but the CPU now starts executing instructions at a frequency of 5 MIPS. 9.2.3 INTERRUPTS COINCIDENT WITH POWER SAVE INSTRUCTIONS 9.4 Peripheral Module Disable Any interrupt that coincides with the execution of a PWRSAV instruction is held off until entry into Sleep or Idle mode has completed. The device then wakes up from Sleep or Idle mode. 9.3 Doze Mode The preferred strategies for reducing power consumption are changing clock speed and invoking one of the power-saving modes. In some circumstances, this may not be practical. For example, it may be necessary for an application to maintain uninterrupted synchronous communication, even while it is doing nothing else. Reducing system clock speed can introduce communication errors, while using a power-saving mode can stop communications completely. Doze mode is a simple and effective alternative method to reduce power consumption while the device is still executing code. In this mode, the system clock continues to operate from the same source and at the same speed. Peripheral modules continue to be clocked at the same speed, while the CPU clock speed is reduced. Synchronization between the two clock domains is maintained, allowing the peripherals to access the SFRs while the CPU executes code at a slower rate. The Peripheral Module Disable registers (PMD) provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a peripheral is disabled using the appropriate PMD control bit, the peripheral is in a minimum power consumption state. The control and status registers associated with the peripheral are also disabled, so writes to those registers will have no effect and read values will be invalid. A peripheral module is enabled only if both the associated bit in the PMD register is cleared and the peripheral is supported by the specific dsPIC(R) DSC variant. If the peripheral is present in the device, it is enabled in the PMD register by default. Note: If a PMD bit is set, the corresponding module is disabled after a delay of one instruction cycle. Similarly, if a PMD bit is cleared, the corresponding module is enabled after a delay of one instruction cycle (assuming the module control registers are already configured to enable module operation). DS70283H-page 114 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 9-1: U-0 -- bit 15 R/W-0 I2C1MD bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-0 U1MD U-0 -- R/W-0 SPI1MD U-0 -- U-0 -- PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 U-0 -- R/W-0 T3MD R/W-0 T2MD R/W-0 T1MD R/W-0 QEIMD R/W-0 PWM1MD U-0 -- bit 8 R/W-0 AD1MD(1) bit 0 Unimplemented: Read as `0' T3MD: Timer3 Module Disable bit 1 = Timer3 module is disabled 0 = Timer3 module is enabled T2MD: Timer2 Module Disable bit 1 = Timer2 module is disabled 0 = Timer2 module is enabled T1MD: Timer1 Module Disable bit 1 = Timer1 module is disabled 0 = Timer1 module is enabled QEIMD: QEI Module Disable bit 1 = QEI module is disabled 0 = QEI module is enabled PWM1MD: PWM1 Module Disable bit 1 = PWM1 module is disabled 0 = PWM1 module is enabled Unimplemented: Read as `0' I2C1MD: I2C1 Module Disable bit 1 = I2C1 module is disabled 0 = I2C1 module is enabled Unimplemented: Read as `0' U1MD: UART1 Module Disable bit 1 = UART1 module is disabled 0 = UART1 module is enabled Unimplemented: Read as `0' SPI1MD: SPI1 Module Disable bit 1 = SPI1 module is disabled 0 = SPI1 module is enabled Unimplemented: Read as `0' AD1MD: ADC1 Module Disable bit(1) 1 = ADC1 module is disabled 0 = ADC1 module is enabled PCFGx bits have no effect if the ADC module is disabled by setting this bit. In this case, all port pins multiplexed with ANx will be in Digital mode. bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2-1 bit 0 Note 1: (c) 2011 Microchip Technology Inc. DS70283H-page 115 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 9-2: R/W-0 IC8MD bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 OC2MD PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2 R/W-0 IC7MD U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 IC2MD R/W-0 IC1MD bit 8 R/W-0 OC1MD bit 0 IC8MD: Input Capture 8 Module Disable bit 1 = Input Capture 8 module is disabled 0 = Input Capture 8 module is enabled IC7MD: Input Capture 2 Module Disable bit 1 = Input Capture 7 module is disabled 0 = Input Capture 7 module is enabled Unimplemented: Read as `0' IC2MD: Input Capture 2 Module Disable bit 1 = Input Capture 2 module is disabled 0 = Input Capture 2 module is enabled IC1MD: Input Capture 1 Module Disable bit 1 = Input Capture 1 module is disabled 0 = Input Capture 1 module is enabled Unimplemented: Read as `0' OC2MD: Output Compare 2 Module Disable bit 1 = Output Compare 2 module is disabled 0 = Output Compare 2 module is enabled OC1MD: Output Compare 1 Module Disable bit 1 = Output Compare 1 module is disabled 0 = Output Compare 1 module is enabled bit 14 bit 13-10 bit 9 bit 8 bit 7-2 bit 1 bit 0 DS70283H-page 116 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 9-3: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-5 bit 4 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 PWM2MD U-0 -- U-0 -- U-0 -- U-0 -- bit 0 PMD3: PERIPHERAL MODULE DISABLE CONTROL REGISTER 3 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 Unimplemented: Read as `0' PWM2MD: PWM2 Module Disable bit 1 = PWM2 module is disabled 0 = PWM2 module is enabled Unimplemented: Read as `0' bit 3-0 (c) 2011 Microchip Technology Inc. DS70283H-page 117 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 118 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 10.0 I/O PORTS the I/O pin. The logic also prevents "loop through", in which a port's digital output can drive the input of a peripheral that shares the same pin. Figure 10-1 shows how ports are shared with other peripherals and the associated I/O pin to which they are connected. When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin can be read, but the output driver for the parallel port bit is disabled. If a peripheral is enabled, but the peripheral is not actively driving a pin, that pin can be driven by a port. All port pins have three registers directly associated with their operation as digital I/O. The data direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a `1', then the pin is an input. All port pins are defined as inputs after a Reset. Reads from the latch (LATx) read the latch. Writes to the latch write the latch. Reads from the port (PORTx) read the port pins, while writes to the port pins write the latch. Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers and the port pin will read as zeros. When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 10. "I/O Ports" (DS70193) of the "dsPIC33F/PIC24H Family Reference Manual", which is available on Microchip web site (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. All of the device pins (except VDD, VSS, MCLR and OSC1/CLKI) are shared among the peripherals and the parallel I/O ports. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 10.1 Parallel I/O (PIO) Ports Generally a parallel I/O port that shares a pin with a peripheral is subservient to the peripheral. The peripheral's output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of FIGURE 10-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE Peripheral Module Peripheral Input Data Peripheral Module Enable Output Multiplexers I/O Peripheral Output Enable Peripheral Output Data 1 0 1 0 Output Enable PIO Module Read TRIS Output Data Data Bus WR TRIS D CK Q I/O Pin TRIS Latch D WR LAT + WR Port CK Data Latch Q Read LAT Input Data Read Port (c) 2011 Microchip Technology Inc. DS70283H-page 119 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 10.2 Open-Drain Configuration 10.4 I/O Port Write/Read Timing In addition to the PORT, LAT and TRIS registers for data control, some port pins can also be individually configured for either digital or open-drain output. This is controlled by the Open-Drain Control register, ODCx, associated with each port. Setting any of the bits configures the corresponding pin to act as an open-drain output. The open-drain feature allows the generation of outputs higher than VDD (e.g., 5V) on any desired 5V tolerant pins by using external pull-up resistors. The maximum open-drain voltage allowed is the same as the maximum VIH specification. See the "Pin Diagrams" section for the available pins and their functionality. One instruction cycle is required between a port direction change or port write operation and a read operation of the same port. Typically this instruction would be an NOP. Examples are shown in Example 10-1 and Example 10-2. This also applies to PORT bit operations, such as BSET PORTB, # RB0, which are single cycle read-modify-write. All PORT bit operations, such as MOV PORTB, W0 or BSET PORTB, # RBx, read the pin and not the latch. 10.5 Input Change Notification 10.3 Configuring Analog Port Pins The AD1PCFG and TRIS registers control the operation of the analog-to-digital (A/D) port pins. The port pins that are to function as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The AD1PCFGL register has a default value of 0x0000; therefore, all pins that share ANx functions are analog (not digital) by default. When the PORT register is read, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin defined as a digital input (including the ANx pins) can cause the input buffer to consume current that exceeds the device specifications. The input change notification function of the I/O ports allows the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices to generate interrupt requests to the processor in response to a change-of-state on selected input pins. This feature can detect input change-of-states even in Sleep mode, when the clocks are disabled. Depending on the device pin count, up to 31 external signals (CNx pin) can be selected (enabled) for generating an interrupt request on a change-of-state. Four control registers are associated with the CN module. The CNEN1 and CNEN2 registers contain the interrupt enable control bits for each of the CN input pins. Setting any of these bits enables a CN interrupt for the corresponding pins. Each CN pin also has a weak pull-up connected to it. The pull-ups act as a current source connected to the pin, and eliminate the need for external resistors when push-button or keypad devices are connected. The pull-ups are enabled separately using the CNPU1 and CNPU2 registers, which contain the control bits for each of the CN pins. Setting any of the control bits enables the weak pull-ups for the corresponding pins. Note: Pull-ups on change notification pins should always be disabled when the port pin is configured as a digital output. EXAMPLE 10-1: MOV MOV NOP btss 0xFF00, W0 W0, TRISBB PORTB, #13 PORT WRITE/READ EXAMPLE ; ; ; ; Configure PORTB<15:8> as inputs and PORTB<7:0> as outputs Delay 1 cycle Next Instruction EXAMPLE 10-2: Incorrect: PORT BIT OPERATIONS ;Set PORTB BSET BSET Correct: PORTB, #RB1 PORTB, #RB6 BSET NOP BSET NOP Preferred: PORTB, #RB1 PORTB, #RB6 ;Set PORTB BSET BSET LATB, LATB1 LATB, LATB6 ;Set PORTB DS70283H-page 120 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 10.6 Peripheral Pin Select 10.6.2.1 Input Mapping Peripheral pin select configuration enables peripheral set selection and placement on a wide range of I/O pins. By increasing the pinout options available on a particular device, programmers can better tailor the microcontroller to their entire application, rather than trimming the application to fit the device. The peripheral pin select configuration feature operates over a fixed subset of digital I/O pins. Programmers can independently map the input and/or output of most digital peripherals to any one of these I/O pins. Peripheral pin select is performed in software, and generally does not require the device to be reprogrammed. Hardware safeguards are included that prevent accidental or spurious changes to the peripheral mapping, once it has been established. The inputs of the peripheral pin select options are mapped on the basis of the peripheral. A control register associated with a peripheral dictates the pin it will be mapped to. The RPINRx registers are used to configure peripheral input mapping (see Register 10-1 through Register 10-13). Each register contains sets of 5-bit fields, with each set associated with one of the remappable peripherals. Programming a given peripheral's bit field with an appropriate 5-bit value maps the RPn pin with that value to that peripheral. For any given device, the valid range of values for any bit field corresponds to the maximum number of peripheral pin selections supported by the device. Figure 10-2 Illustrates remappable pin selection for U1RX input. Note: For input mapping only, the Peripheral Pin Select (PPS) functionality does not have priority over the TRISx settings. Therefore, when configuring the RPn pin for input, the corresponding bit in the TRISx register must also be configured for input (i.e., set to `1'). 10.6.1 AVAILABLE PINS The peripheral pin select feature is used with a range of up to 26 pins. The number of available pins depends on the particular device and its pin count. Pins that support the peripheral pin select feature include the designation "RPn" in their full pin designation, where "RP" designates a remappable peripheral and "n" is the remappable pin number. FIGURE 10-2: 10.6.2 CONTROLLING PERIPHERAL PIN SELECT REMAPPABLE MUX INPUT FOR U1RX U1RXR<4:0> Peripheral pin select features are controlled through two sets of special function registers: one to map peripheral inputs, and one to map outputs. Because they are separately controlled, a particular peripheral's input and output (if the peripheral has both) can be placed on any selectable function pin without constraint. The association of a peripheral to a peripheral selectable pin is handled in two different ways, depending on whether an input or output is being mapped. 0 RP0 1 RP1 2 RP2 U1RX input to peripheral 25 RP25 (c) 2011 Microchip Technology Inc. DS70283H-page 121 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 10-1: SELECTABLE INPUT SOURCES (MAPS INPUT TO FUNCTION)(1) Input Name External Interrupt 1 External Interrupt 2 Timer2 External Clock Timer3 External Clock Input Capture 1 Input Capture 2 Input Capture 7 Input Capture 8 Output Compare Fault A PWM1 Fault PWM2 Fault QEI1 Phase A QEI1 Phase B QEI1 Index UART1 Receive UART1 Clear To Send SPI1 Data Input SPI1 Clock Input SPI1 Slave Select Input Note 1: Function Name INT1 INT2 T2CK T3CK IC1 IC2 IC7 IC8 OCFA FLTA1 FLTA2 QEA QEB INDX U1RX U1CTS SDI1 SCK1 SS1 Register RPINR0 RPINR1 RPINR3 RPINR3 RPINR7 RPINR7 RPINR10 RPINR10 RPINR11 RPINR12 RPINR13 RPINR14 RPINR14 RPINR15 RPINR18 RPINR18 RPINR20 RPINR20 RPINR21 Configuration Bits INT1R<4:0> INT2R<4:0> T2CKR<4:0> T3CKR<4:0> IC1R<4:0> IC2R<4:0> IC7R<4:0> IC8R<4:0> OCFAR<4:0> FLTA1R<4:0> FLTA2R<4:0> QEA1R<4:0> QEB1R<4:0> INDX1R<4:0> U1RXR<4:0> U1CTSR<4:0> SDI1R<4:0> SCK1R<4:0> SS1R<4:0> Unless otherwise noted, all inputs use the Schmitt input buffers. DS70283H-page 122 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 10.6.2.2 Output Mapping FIGURE 10-3: In contrast to inputs, the outputs of the peripheral pin select options are mapped on the basis of the pin. In this case, a control register associated with a particular pin dictates the peripheral output to be mapped. The RPORx registers are used to control output mapping. Like the RPINRx registers, each register contains sets of 5-bit fields, with each set associated with one RPn pin (see Register 10-14 through Register 10-26). The value of the bit field corresponds to one of the peripherals, and that peripheral's output is mapped to the pin (see Table 10-2 and Figure 10-3). The list of peripherals for output mapping also includes a null value of 00000 because of the mapping technique. This permits any given pin to remain unconnected from the output of any of the pin selectable peripherals. MULTIPLEXING OF REMAPPABLE OUTPUT FOR RPn RPnR<4:0> Default 0 3 U1RTS Output Enable 4 Output Enable U1TX Output Enable OC2 Output Enable UPDN Output Enable 19 26 Default U1TX Output U1RTS Output 0 3 4 Output Data RPn OC2 Output UPDN Output 19 26 TABLE 10-2: NULL U1TX U1RTS SDO1 OUTPUT SELECTION FOR REMAPPABLE PIN (RPn) RPnR<4:0> 00000 00011 00100 00111 01000 01001 10010 10011 11010 Output Name RPn tied to default port pin RPn tied to UART1 Transmit RPn tied to UART1 Ready To Send RPn tied to SPI1 Data Output RPn tied to SPI1 Clock Output RPn tied to SPI1 Slave Select Output RPn tied to Output Compare 1 RPn tied to Output Compare 2 RPn tied to QEI direction (UPDN) status Function SCK1OUT SS1OUT OC1 OC2 UPDN (c) 2011 Microchip Technology Inc. DS70283H-page 123 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 10.6.3 CONTROLLING CONFIGURATION CHANGES 10.6.3.2 Continuous State Monitoring In addition to being protected from direct writes, the contents of the RPINRx and RPORx registers are constantly monitored in hardware by shadow registers. If an unexpected change in any of the registers occurs (such as cell disturbances caused by ESD or other external events), a configuration mismatch Reset will be triggered. Because peripheral remapping can be changed during run time, some restrictions on peripheral remapping are needed to prevent accidental configuration changes. dsPIC33F devices include three features to prevent alterations to the peripheral map: * Control register lock sequence * Continuous state monitoring * Configuration bit pin select lock 10.6.3.3 Configuration Bit Pin Select Lock 10.6.3.1 Control Register Lock Under normal operation, writes to the RPINRx and RPORx registers are not allowed. Attempted writes appear to execute normally, but the contents of the registers remain unchanged. To change these registers, they must be unlocked in hardware. The register lock is controlled by the IOLOCK bit (OSCCON<6>). Setting IOLOCK prevents writes to the control registers; clearing IOLOCK allows writes. To set or clear IOLOCK, a specific command sequence must be executed: 1. 2. 3. Write 0x46 to OSCCON<7:0>. Write 0x57 to OSCCON<7:0>. Clear (or set) IOLOCK as a single operation. Note: MPLAB(R) C30 provides built-in C language functions for unlocking the OSCCON register: __builtin_write_OSCCONL(value) __builtin_write_OSCCONH(value) As an additional level of safety, the device can be configured to prevent more than one write session to the RPINRx and RPORx registers. The IOL1WAY (FOSC See MPLAB Help for more information. Unlike the similar sequence with the oscillator's LOCK bit, IOLOCK remains in one state until changed. This allows all of the peripheral pin selects to be configured with a single unlock sequence followed by an update to all control registers, then locked with a second lock sequence. DS70283H-page 124 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 10.7 Peripheral Pin Select Registers The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices implement 21 registers for remappable peripheral configuration: * Input Remappable Peripheral Registers (13) * Output Remappable Peripheral Registers (8) Note: Input and Output Register values can only be changed if OSCCON[IOLOCK] = 0. See Section 10.6.3.1 "Control Register Lock" for a specific command sequence. REGISTER 10-1: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 INT1R<4:0> bit 8 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 0 R/W-1 R/W-1 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown Unimplemented: Read as `0' INT1R<4:0>: Assign External Interrupt 1 (INTR1) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 Unimplemented: Read as `0' bit 7-0 (c) 2011 Microchip Technology Inc. DS70283H-page 125 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-2: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 INT2R<4:0> bit 0 R/W-1 RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-1 Unimplemented: Read as `0' INT2R<4:0>: Assign External Interrupt 2 (INTR2) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70283H-page 126 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-3: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 T2CKR<4:0> bit 0 R/W-1 RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 T3CKR<4:0> bit 8 R/W-1 R/W-1 R/W-1 Unimplemented: Read as `0' T3CKR<4:0>: Assign Timer3 External Clock (T3CK) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 Unimplemented: Read as `0' T2CKR<4:0>: Assign Timer2 External Clock (T2CK) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 bit 4-0 (c) 2011 Microchip Technology Inc. DS70283H-page 127 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-4: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 IC1R<4:0> bit 0 R/W-1 RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 IC2R<4:0> bit 8 R/W-1 R/W-1 R/W-1 Unimplemented: Read as `0' IC2R<4:0>: Assign Input Capture 2 (IC2) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 Unimplemented: Read as `0' IC1R<4:0>: Assign Input Capture 1 (IC1) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 bit 4-0 DS70283H-page 128 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-5: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 IC7R<4:0> bit 0 R/W-1 RPINR10: PERIPHERAL PIN SELECT INPUT REGISTER 10 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 IC8R<4:0> bit 8 R/W-1 R/W-1 R/W-1 Unimplemented: Read as `0' IC8R<4:0>: Assign Input Capture 8 (IC8) to the corresponding pin RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 Unimplemented: Read as `0' IC7R<4:0>: Assign Input Capture 7 (IC7) to the corresponding pin RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 bit 4-0 (c) 2011 Microchip Technology Inc. DS70283H-page 129 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-6: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 OCFAR<4:0> bit 0 R/W-1 RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-1 Unimplemented: Read as `0' OCFAR<4:0>: Assign Output Capture A (OCFA) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 REGISTER 10-7: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-5 bit 4-0 RPINR12: PERIPHERAL PIN SELECT INPUT REGISTER 12 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 FLTA1R<4:0> bit 0 R/W-1 R/W-1 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown Unimplemented: Read as `0' FLTA1R<4:0>: Assign PWM1 Fault (FLTA1) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70283H-page 130 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-8: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 FLTA2R<4:0> bit 0 R/W-1 RPINR13: PERIPHERAL PIN SELECT INPUT REGISTER 13 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-1 Unimplemented: Read as `0' FLTA2R<4:0>: Assign PWM2 Fault (FLTA2) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 (c) 2011 Microchip Technology Inc. DS70283H-page 131 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-9: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 QEA1R<4:0> bit 0 R/W-1 RPINR14: PERIPHERAL PIN SELECT OUTPUT REGISTER 14 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 QEB1R<4:0> bit 8 R/W-1 R/W-1 R/W-1 Unimplemented: Read as `0' QEB1R<4:0>: Assign B (QEB) to the corresponding pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 Unimplemented: Read as `0' QEA1R<4:0>: Assign A(QEA) to the corresponding pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 bit 4-0 DS70283H-page 132 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-10: RPINR15: PERIPHERAL PIN SELECT INPUT REGISTER 15 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 INDX1R<4:0> bit 0 R/W-1 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-1 Unimplemented: Read as `0' INDX1R<4:0>: Assign QEI INDEX (INDX) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 (c) 2011 Microchip Technology Inc. DS70283H-page 133 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-11: RPINR18: PERIPHERAL PIN SELECT INPUT REGISTER 18 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 U1RXR<4:0> bit 0 R/W-1 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 U1CTSR<4:0> bit 8 R/W-1 R/W-1 R/W-1 Unimplemented: Read as `0' U1CTSR<4:0>: Assign UART1 Clear to Send (U1CTS) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 Unimplemented: Read as `0' U1RXR<4:0>: Assign UART1 Receive (U1RX) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 bit 4-0 DS70283H-page 134 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-12: RPINR20: PERIPHERAL PIN SELECT INPUT REGISTER 20 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 SDI1R<4:0> bit 0 R/W-1 U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 SCK1R<4:0> bit 8 R/W-1 R/W-1 R/W-1 Unimplemented: Read as `0' SCK1R<4:0>: Assign SPI1 Clock Input (SCK1IN) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 Unimplemented: Read as `0' SDI1R<4:0>: Assign SPI1 Data Input (SDI1) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 bit 7-5 bit 4-0 (c) 2011 Microchip Technology Inc. DS70283H-page 135 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-13: RPINR21: PERIPHERAL PIN SELECT INPUT REGISTER 21 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-1 R/W-1 R/W-1 SS1R<4:0> bit 0 R/W-1 U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-1 Unimplemented: Read as `0' SS1R<4:0>: Assign SPI1 Slave Select Input (SS1IN) to the corresponding RPn pin bits 11111 = Input tied VSS 11001 = Input tied to RP25 . . . 00001 = Input tied to RP1 00000 = Input tied to RP0 DS70283H-page 136 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-14: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTER 0 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP0R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP1R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP1R<4:0>: Peripheral Output Function is Assigned to RP1 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP0R<4:0>: Peripheral Output Function is Assigned to RP0 Output Pin bits (see Table 10-2 for peripheral function numbers) REGISTER 10-15: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTER 1 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP2R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP3R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP3R<4:0>: Peripheral Output Function is Assigned to RP3 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP2R<4:0>: Peripheral Output Function is Assigned to RP2 Output Pin bits (see Table 10-2 for peripheral function numbers) (c) 2011 Microchip Technology Inc. DS70283H-page 137 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-16: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTER 2 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP4R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP5R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP5R<4:0>: Peripheral Output Function is Assigned to RP5 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP4R<4:0>: Peripheral Output Function is Assigned to RP4 Output Pin bits (see Table 10-2 for peripheral function numbers) REGISTER 10-17: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTER 3 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP6R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP7R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP7R<4:0>: Peripheral Output Function is Assigned to RP7 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP6R<4:0>: Peripheral Output Function is Assigned to RP6 Output Pin bits (see Table 10-2 for peripheral function numbers) DS70283H-page 138 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-18: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTER 4 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP8R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP9R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP9R<4:0>: Peripheral Output Function is Assigned to RP9 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP8R<4:0>: Peripheral Output Function is Assigned to RP8 Output Pin bits (see Table 10-2 for peripheral function numbers) REGISTER 10-19: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTER 5 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP10R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP11R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP11R<4:0>: Peripheral Output Function is Assigned to RP11 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP10R<4:0>: Peripheral Output Function is Assigned to RP10 Output Pin bits (see Table 10-2 for peripheral function numbers) (c) 2011 Microchip Technology Inc. DS70283H-page 139 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-20: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTER 6 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP12R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP13R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP13R<4:0>: Peripheral Output Function is Assigned to RP13 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP12R<4:0>: Peripheral Output Function is Assigned to RP12 Output Pin bits (see Table 10-2 for peripheral function numbers) REGISTER 10-21: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTER 7 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP14R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP15R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP15R<4:0>: Peripheral Output Function is Assigned to RP15 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP14R<4:0>: Peripheral Output Function is Assigned to RP14 Output Pin bits (see Table 10-2 for peripheral function numbers) DS70283H-page 140 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-22: RPOR8: PERIPHERAL PIN SELECT OUTPUT REGISTER 8 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP16R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP17R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP17R<4:0>: Peripheral Output Function is Assigned to RP17 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP16R<4:0>: Peripheral Output Function is Assigned to RP16 Output Pin bits (see Table 10-2 for peripheral function numbers) REGISTER 10-23: RPOR9: PERIPHERAL PIN SELECT OUTPUT REGISTER 9 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP18R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP19R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP19R<4:0>: Peripheral Output Function is Assigned to RP19 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP18R<4:0>: Peripheral Output Function is Assigned to RP18 Output Pin bits (see Table 10-2 for peripheral function numbers) (c) 2011 Microchip Technology Inc. DS70283H-page 141 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-24: RPOR10: PERIPHERAL PIN SELECT OUTPUT REGISTER 10 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP20R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP21R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP21R<4:0>: Peripheral Output Function is Assigned to RP21 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP20R<4:0>: Peripheral Output Function is Assigned to RP20 Output Pin bits (see Table 10-2 for peripheral function numbers) REGISTER 10-25: RPOR11: PERIPHERAL PIN SELECT OUTPUT REGISTER 11 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP22R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP23R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP23R<4:0>: Peripheral Output Function is Assigned to RP23 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP22R<4:0>: Peripheral Output Function is Assigned to RP22 Output Pin bits (see Table 10-2 for peripheral function numbers) DS70283H-page 142 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 10-26: RPOR12: PERIPHERAL PIN SELECT OUTPUT REGISTER 12 U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12-8 bit 7-5 bit 4-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP24R<4:0> bit 0 R/W-0 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 RP25R<4:0> bit 8 R/W-0 R/W-0 R/W-0 Unimplemented: Read as `0' RP25R<4:0>: Peripheral Output Function is Assigned to RP25 Output Pin bits (see Table 10-2 for peripheral function numbers) Unimplemented: Read as `0' RP24R<4:0>: Peripheral Output Function is Assigned to RP24 Output Pin bits (see Table 10-2 for peripheral function numbers) (c) 2011 Microchip Technology Inc. DS70283H-page 143 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 144 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 11.0 TIMER1 Timer1 also supports these features: * Timer gate operation * Selectable prescaler settings * Timer operation during CPU Idle and Sleep modes * Interrupt on 16-bit Period register match or falling edge of external gate signal Figure 11-1 presents a block diagram of the 16-bit timer module. To configure Timer1 for operation: 1. 2. 3. 4. 5. 6. Set the TON bit (= 1) in the T1CON register. Select the timer prescaler ratio using the TCKPS<1:0> bits in the T1CON register. Set the Clock and Gating modes using the TCS and TGATE bits in the T1CON register. Set or clear the TSYNC bit in T1CON to select synchronous or asynchronous operation. Load the timer period value into the PR1 register. If interrupts are required, set the interrupt enable bit, T1IE. Use the priority bits, T1IP<2:0>, to set the interrupt priority. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 11. "Timers" (DS70205) of the dsPIC33F/PIC24H Family Reference Manual, which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The Timer1 module is a 16-bit timer, which can serve as the time counter for the real-time clock, or operate as a free-running interval timer/counter. Timer1 can operate in three modes: * 16-bit Timer * 16-bit Synchronous Counter * 16-bit Asynchronous Counter FIGURE 11-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM TCKPS<1:0> SOSCO/ T1CK SOSCEN SOSCI Gate Sync TCY TON 1x 2 Prescaler 1, 8, 64, 256 01 00 TGATE TCS TGATE 1 Set T1IF 0 Reset Q Q D CK 0 TMR1 1 Comparator TSYNC Sync Equal PR1 (c) 2011 Microchip Technology Inc. DS70283H-page 145 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 11-1: R/W-0 TON bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 TGATE R/W-0 R/W-0 U-0 -- R/W-0 TSYNC R/W-0 TCS U-0 -- bit 0 T1CON: TIMER1 CONTROL REGISTER U-0 -- R/W-0 TSIDL U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 TCKPS<1:0> TON: Timer1 On bit 1 = Starts 16-bit Timer1 0 = Stops 16-bit Timer1 Unimplemented: Read as `0' TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode Unimplemented: Read as `0' TGATE: Timer1 Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled TCKPS<1:0> Timer1 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 Unimplemented: Read as `0' TSYNC: Timer1 External Clock Input Synchronization Select bit When TCS = 1: 1 = Synchronize external clock input 0 = Do not synchronize external clock input When TCS = 0: This bit is ignored. TCS: Timer1 Clock Source Select bit 1 = External clock from pin T1CK (on the rising edge) 0 = Internal clock (FCY) Unimplemented: Read as `0' bit 14 bit 13 bit 12-7 bit 6 bit 5-4 bit 3 bit 2 bit 1 bit 0 DS70283H-page 146 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 12.0 TIMER2/3 FEATURE 12.1 32-bit Operation Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 11. "Timers" (DS70205) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The Timer2/3 feature has three 2-bit timers that can also be configured as two independent 16-bit timers with selectable operating modes. As a 32-bit timer, the Timer2/3 feature permits operation in three modes: * Two Independent 16-bit timers (e.g., Timer2 and Timer3) with all 16-bit operating modes (except Asynchronous Counter mode) * Single 32-bit timer (Timer2/3) * Single 32-bit synchronous counter (Timer2/3) The Timer2/3 feature also supports: * * * * * Timer gate operation Selectable prescaler settings Timer operation during Idle and Sleep modes Interrupt on a 32-bit period register match Time base for Input Capture and Output Compare modules (Timer2 and Timer3 only) * ADC1 event trigger (Timer2/3 only) Individually, all eight of the 16-bit timers can function as synchronous timers or counters. They also offer the features listed above, except for the event trigger. The operating modes and enabled features are determined by setting the appropriate bit(s) in the T2CON, T3CON registers. T2CON registers are shown in generic form in Register 12-1. T3CON registers are shown in Register 12-2. For 32-bit timer/counter operation, Timer2 is the least significant word (lsw), and Timer3 is the most significant word (msw) of the 32-bit timers. Note: For 32-bit operation, T3CON control bits are ignored. Only T2CON control bits are used for setup and control. Timer2 clock and gate inputs are used for the 32-bit timer modules, but an interrupt is generated with the Timer3 interrupt flags. 3. 4. 5. To configure the Timer2/3 feature timers for 32-bit operation: 1. 2. 3. 4. Set the T32 control bit. Select the prescaler ratio for Timer2 using the TCKPS<1:0> bits. Set the Clock and Gating modes using the corresponding TCS and TGATE bits. Load the timer period value. PR3 contains the most significant word of the value, while PR2 contains the least significant word. If interrupts are required, set the interrupt enable bit, T3IE. Use the priority bits, T3IP<2:0>, to set the interrupt priority. While Timer2 controls the timer, the interrupt appears as a Timer3 interrupt. Set the corresponding TON bit. 5. 6. The timer value at any point is stored in the register pair, TMR3:TMR2, which always contains the most significant word of the count, while TMR2 contains the least significant word. 12.2 16-bit Operation To configure any of the timers for individual 16-bit operation: 1. 2. Clear the T32 bit corresponding to that timer. Select the timer prescaler ratio using the TCKPS<1:0> bits. Set the Clock and Gating modes using the TCS and TGATE bits. Load the timer period value into the PRx register. If interrupts are required, set the interrupt enable bit, TxIE. Use the priority bits, TxIP<2:0>, to set the interrupt priority. Set the TON bit. 6. (c) 2011 Microchip Technology Inc. DS70283H-page 147 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 12-1: TIMER2/3 (32-BIT) BLOCK DIAGRAM(1) TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 T2CK Gate Sync TCY TGATE 1x 01 TON 00 TGATE TCS 1 Set T3IF 0 PR3 ADC Event Trigger(2) Q Q D CK PR2 Equal MSb Reset 16 Comparator LSb TMR3 TMR2 Sync Read TMR2 Write TMR2 16 16 TMR3HLD 16 Data Bus<15:0> Note 1: 2: The 32-bit timer control bit, T32, must be set for 32-bit timer/counter operation. All control bits are respective to the T2CON register. The ADC event trigger is available only on Timer2/3. DS70283H-page 148 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 12-2: TIMER2 (16-BIT) BLOCK DIAGRAM TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 T2CK Gate Sync TON 1x 01 00 TCY TCS TGATE TGATE 1 Set T2IF 0 Reset TMR2 Q Q D CK Sync Comparator Equal PR2 (c) 2011 Microchip Technology Inc. DS70283H-page 149 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 12-1: R/W-0 TON bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 TGATE R/W-0 R/W-0 R/W-0 T32 U-0 -- R/W-0 TCS U-0 -- bit 0 T2CON CONTROL REGISTER U-0 -- R/W-0 TSIDL U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 TCKPS<1:0> TON: Timer2 On bit When T32 = 1: 1 = Starts 32-bit Timer2/3 0 = Stops 32-bit Timer2/3 When T32 = 0: 1 = Starts 16-bit Timer2 0 = Stops 16-bit Timer2 Unimplemented: Read as `0' TSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode Unimplemented: Read as `0' TGATE: Timer2 Gated Time Accumulation Enable bit When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled TCKPS<1:0>: Timer2 Input Clock Prescale Select bits 11 = 1:256 10 = 1:64 01 = 1:8 00 = 1:1 T32: 32-bit Timer Mode Select bit 1 = Timer2 and Timer3 form a single 32-bit timer 0 = Timer2 and Timer3 act as two 16-bit timers Unimplemented: Read as `0' TCS: Timer2 Clock Source Select bit 1 = External clock from pin T2CK (on the rising edge) 0 = Internal clock (FCY) Unimplemented: Read as `0' bit 14 bit 13 bit 12-7 bit 6 bit 5-4 bit 3 bit 2 bit 1 bit 0 DS70283H-page 150 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 12-2: R/W-0 TON(2) bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 TGATE (2) T3CON CONTROL REGISTER U-0 -- R/W-0 TSIDL (1) U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 R/W-0 (2) U-0 -- U-0 -- R/W-0 TCS (2) U-0 -- bit 0 TCKPS<1:0> TON: Timer3 On bit(2) 1 = Starts 16-bit Timer3 0 = Stops 16-bit Timer3 Unimplemented: Read as `0' TSIDL: Stop in Idle Mode bit(1) 1 = Discontinue timer operation when device enters Idle mode 0 = Continue timer operation in Idle mode Unimplemented: Read as `0' TGATE: Timer3 Gated Time Accumulation Enable bit(2) When TCS = 1: This bit is ignored. When TCS = 0: 1 = Gated time accumulation enabled 0 = Gated time accumulation disabled TCKPS<1:0>: Timer3 Input Clock Prescale Select bits(2) 11 = 1:256 prescale value 10 = 1:64 prescale value 01 = 1:8 prescale value 00 = 1:1 prescale value Unimplemented: Read as `0' TCS: Timer3 Clock Source Select bit(2) 1 = External clock from T3CK pin 0 = Internal clock (FOSC/2) Unimplemented: Read as `0' When 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (T2CON<3>), the TSIDL bit must be cleared to operate the 32-bit timer in Idle mode. When the 32-bit timer operation is enabled (T32 = 1) in the Timer Control register (T2CON<3>), these bits have no effect. bit 14 bit 13 bit 12-7 bit 6 bit 5-4 bit 3-2 bit 1 bit 0 Note 1: 2: (c) 2011 Microchip Technology Inc. DS70283H-page 151 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 152 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 13.0 INPUT CAPTURE Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 12. "Input Capture" (DS70198) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The input capture module is useful in applications requiring frequency (period) and pulse measurement. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices support up to eight input capture channels. The input capture module captures the 16-bit value of the selected Time Base register when an event occurs at the ICx pin. The events that cause a capture event are listed below in three categories: Simple Capture Event modes: - Capture timer value on every falling edge of input at ICx pin - Capture timer value on every rising edge of input at ICx pin 2. Capture timer value on every edge (rising and falling). 3. Prescaler Capture Event modes: - Capture timer value on every 4th rising edge of input at ICx pin - Capture timer value on every 16th rising edge of input at ICx pin Each input capture channel can select one of two 16-bit timers (Timer2 or Timer3) for the time base. The selected timer can use either an internal or external clock. Other operational features include: * Device wake-up from capture pin during CPU Sleep and Idle modes * Interrupt on input capture event * 4-word FIFO buffer for capture values - Interrupt optionally generated after 1, 2, 3 or 4 buffer locations are filled * Use of input capture to provide additional sources of external interrupts 1. FIGURE 13-1: INPUT CAPTURE BLOCK DIAGRAM From 16-bit Timers TMR2 TMR3 16 16 1 Prescaler Counter (1, 4, 16) ICx Pin 3 Edge Detection Logic and Clock Synchronizer ICM<2:0> (ICxCON<2:0>) Mode Select ICOV, ICBNE (ICxCON<4:3>) FIFO R/W Logic 0 ICTMR (ICxCON<7>) ICxBUF ICxI<1:0> ICxCON Interrupt Logic System Bus Set Flag ICxIF (in IFSn Register) Note: An `x' in a signal, register or bit name denotes the number of the capture channel. (c) 2011 Microchip Technology Inc. DS70283H-page 153 FIFO dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 13.1 Input Capture Registers ICxCON: INPUT CAPTURE x CONTROL REGISTER U-0 -- R/W-0 ICSIDL U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 R/W-0 R-0, HC ICOV R-0, HC ICBNE R/W-0 R/W-0 ICM<2:0> bit 0 HC = Cleared in Hardware W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 REGISTER 13-1: U-0 -- bit 15 R/W-0 ICTMR bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 ICI<1:0> Unimplemented: Read as `0' ICSIDL: Input Capture Module Stop in Idle Control bit 1 = Input capture module will halt in CPU Idle mode 0 = Input capture module will continue to operate in CPU Idle mode Unimplemented: Read as `0' ICTMR: Input Capture Timer Select bits 1 = TMR2 contents are captured on capture event 0 = TMR3 contents are captured on capture event ICI<1:0>: Select Number of Captures per Interrupt bits 11 = Interrupt on every fourth capture event 10 = Interrupt on every third capture event 01 = Interrupt on every second capture event 00 = Interrupt on every capture event ICOV: Input Capture Overflow Status Flag bit (read-only) 1 = Input capture overflow occurred 0 = No input capture overflow occurred ICBNE: Input Capture Buffer Empty Status bit (read-only) 1 = Input capture buffer is not empty, at least one more capture value can be read 0 = Input capture buffer is empty ICM<2:0>: Input Capture Mode Select bits 111 = Input capture functions as interrupt pin only when device is in Sleep or Idle mode (Rising edge detect only, all other control bits are not applicable.) 110 = Unused (module disabled) 101 = Capture mode, every 16th rising edge 100 = Capture mode, every 4th rising edge 011 = Capture mode, every rising edge 010 = Capture mode, every falling edge 001 = Capture mode, every edge (rising and falling) (ICI<1:0> bits do not control interrupt generation for this mode.) 000 = Input capture module turned off bit 12-8 bit 7 bit 6-5 bit 4 bit 3 bit 2-0 DS70283H-page 154 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 14.0 OUTPUT COMPARE The Output Compare module can select either Timer2 or Timer3 for its time base. The module compares the value of the timer with the value of one or two compare registers depending on the operating mode selected. The state of the output pin changes when the timer value matches the compare register value. The Output Compare module generates either a single output pulse or a sequence of output pulses, by changing the state of the output pin on the compare match events. The Output Compare module can also generate interrupts on compare match events. The Output Compare module has multiple operating modes: * * * * * * * Active-Low One-Shot mode Active-High One-Shot mode Toggle mode Delayed One-Shot mode Continuous Pulse mode PWM mode without fault protection PWM mode with fault protection Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 13. "Output Compare" (DS70209) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. FIGURE 14-1: OUTPUT COMPARE MODULE BLOCK DIAGRAM Set Flag bit OCxIF OCxRS OCxR Output Logic 3 SQ R Output Enable Logic OCx Comparator 0 1 OCTSEL 0 1 OCM<2:0> Mode Select Output Enable OCFA 16 16 TMR2 TMR3 TMR2 Rollover TMR3 Rollover (c) 2011 Microchip Technology Inc. DS70283H-page 155 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 14.1 Output Compare Modes Configure the Output Compare modes by setting the appropriate Output Compare Mode bits (OCM<2:0>) in the Output Compare Control register (OCxCON<2:0>). Table 14-1 lists the different bit settings for the Output Compare modes. Figure 14-2 illustrates the output compare operation for various modes. The user application must disable the associated timer when writing to the output compare control registers to avoid malfunctions. Note: See Section 13. "Output Compare" (DS70209) in the "dsPIC33F/PIC24H Family Reference Manual" (DS70209) for OCxR and OCxRS register restrictions. TABLE 14-1: OCM<2:0> 000 001 010 011 100 101 110 111 OUTPUT COMPARE MODES Mode Module Disabled Active-Low One-Shot Active-High One-Shot Toggle Mode Delayed One-Shot Continuous Pulse mode PWM mode without fault protection OCx Pin Initial State Controlled by GPIO register 0 1 Current output is maintained 0 0 0, if OCxR is zero 1, if OCxR is non-zero OCx Rising edge OCx Falling edge OCx Rising and Falling edge OCx Falling edge OCx Falling edge No interrupt OCFA Falling edge for OC1 to OC4 OCx Interrupt Generation -- PWM mode with fault protection 0, if OCxR is zero 1, if OCxR is non-zero FIGURE 14-2: OUTPUT COMPARE OPERATION Output Compare Mode enabled Timer is reset on period match OCxRS TMRy OCxR Active-Low One-Shot (OCM = 001) Active-High One-Shot (OCM = 010) Toggle Mode (OCM = 011) Delayed One-Shot (OCM = 100) Continuous Pulse Mode (OCM = 101) PWM Mode (OCM = 110 or 111) DS70283H-page 156 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 14-1: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13 HC = Cleared in Hardware W = Writable bit `1' = Bit is set HS = Set in Hardware U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R-0 HC OCFLT R/W-0 OCTSEL R/W-0 R/W-0 OCM<2:0> bit 0 OCxCON: OUTPUT COMPARE x CONTROL REGISTER U-0 -- R/W-0 OCSIDL U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 Unimplemented: Read as `0' OCSIDL: Stop Output Compare in Idle Mode Control bit 1 = Output Compare x will halt in CPU Idle mode 0 = Output Compare x will continue to operate in CPU Idle mode Unimplemented: Read as `0' OCFLT: PWM Fault Condition Status bit 1 = PWM Fault condition has occurred (cleared in hardware only) 0 = No PWM Fault condition has occurred (This bit is only used when OCM<2:0> = 111.) OCTSEL: Output Compare Timer Select bit 1 = Timer3 is the clock source for Compare x 0 = Timer2 is the clock source for Compare x OCM<2:0>: Output Compare Mode Select bits 111 = PWM mode on OCx, Fault pin enabled 110 = PWM mode on OCx, Fault pin disabled 101 = Initialize OCx pin low, generate continuous output pulses on OCx pin 100 = Initialize OCx pin low, generate single output pulse on OCx pin 011 = Compare event toggles OCx pin 010 = Initialize OCx pin high, compare event forces OCx pin low 001 = Initialize OCx pin low, compare event forces OCx pin high 000 = Output compare channel is disabled bit 12-5 bit 4 bit 3 bit 2-0 (c) 2011 Microchip Technology Inc. DS70283H-page 157 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 158 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 15.0 MOTOR CONTROL PWM MODULE 15.1 PWM1: 6-Channel PWM Module This module simplifies the task of generating multiple synchronized PWM outputs. The following power and motion control applications are supported by the PWM module: * * * * 3-Phase AC Induction Motor Switched Reluctance (SR) Motor Brushless DC (BLDC) Motor Uninterruptible Power Supply (UPS) Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 14. "Motor Control PWM" (DS70187) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 device supports up to two dedicated Pulse-Width Modulation (PWM) modules. The PWM1 module is a 6-channel PWM generator, and the PWM2 module is a 2-channel PWM generator. The PWM module has the following features: Up to 16-bit resolution. On-the-fly PWM frequency changes. Edge and Center-Aligned Output modes. Single Pulse Generation mode. Interrupt support for asymmetrical updates in Center-Aligned mode. * Output override control for Electrically Commutative Motor (ECM) operation or BLDC. * Special Event comparator for scheduling other peripheral events. * Fault pins to optionally drive each of the PWM output pins to a defined state. Duty cycle updates configurable to be immediate or synchronized to the PWM time base. * * * * * This module contains three duty cycle generators, numbered 1 through 3. The module has six PWM output pins, numbered PWM1H1/PWM1L1 through PWM1H3/PWM1L3. The six I/O pins are grouped into high/low numbered pairs, denoted by the suffix H or L, respectively. For complementary loads, the low PWM pins are always the complement of the corresponding high I/O pin. 15.2 PWM2: 2-Channel PWM Module of This module provides an additional pair complimentary PWM outputs that can be used for: * Independent PFC correction in a motor system * Induction cooking This module contains a duty cycle generator that provides two PWM outputs, numbered PWM2H1/PWM2L1. (c) 2011 Microchip Technology Inc. DS70283H-page 159 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 15-1: 6-CHANNEL PWM MODULE BLOCK DIAGRAM (PWM1) PWM1CON1 PWM Enable and Mode SFRs PWM1CON2 P1DTCON1 Dead-Time Control SFRs P1DTCON2 P1FLTACON P1OVDCON Fault Pin Control SFRs PWM Manual Control SFR PWM Generator 3 P1DC3 Buffer 16-bit Data Bus P1DC3 Comparator Channel 3 Dead-Time Generator and Override Logic PWM1H3 PWM1L3 P1TMR PWM Generator 2 Channel 2 Dead-Time Generator and Override Logic PWM1H2 Output Driver PWM1L2 Comparator PWM Generator 1 P1TPER Channel 1 Dead-Time Generator and Override Logic Block PWM1H1 PWM1L1 P1TPER Buffer P1TCON FLTA1 Comparator SEVTDIR P1SECMP PTDIR Special Event Postscaler Special Event Trigger PWM Time Base Note: Details of PWM Generator #1and #2 are not shown for clarity. DS70283H-page 160 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 15-2: 2-CHANNEL PWM MODULE BLOCK DIAGRAM (PWM2) PWM2CON1 PWM2CON2 P2DTCON1 PWM Enable and Mode SFRs Dead-Time Control SFRs P2DTCON2 P2FLTACON P2OVDCON Fault Pin Control SFRs PWM Manual Control SFR PWM Generator 1 P2DC1Buffer 16-bit Data Bus P2DC1 Comparator Channel 1 Dead-Time Generator and Override Logic PWM2H1 PWM2L1 P2TMR Output Comparator Driver Block P2TPER P2TPER Buffer P2TCON FLTA2 Comparator SEVTDIR P2SECMP PTDIR Special Event Postscaler Special Event Trigger PWM Time Base (c) 2011 Microchip Technology Inc. DS70283H-page 161 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-1: R/W-0 PTEN bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PxTCON: PWM TIME BASE CONTROL REGISTER U-0 -- R/W-0 PTSIDL U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 bit 0 PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> PTEN: PWM Time Base Timer Enable bit 1 = PWM time base is on 0 = PWM time base is off Unimplemented: Read as `0' PTSIDL: PWM Time Base Stop in Idle Mode bit 1 = PWM time base halts in CPU Idle mode 0 = PWM time base runs in CPU Idle mode Unimplemented: Read as `0' PTOPS<3:0>: PWM Time Base Output Postscale Select bits 1111 = 1:16 postscale * * * 0001 = 1:2 postscale 0000 = 1:1 postscale PTCKPS<1:0>: PWM Time Base Input Clock Prescale Select bits 11 = PWM time base input clock period is 64 TCY (1:64 prescale) 10 = PWM time base input clock period is 16 TCY (1:16 prescale) 01 = PWM time base input clock period is 4 TCY (1:4 prescale) 00 = PWM time base input clock period is TCY (1:1 prescale) PTMOD<1:0>: PWM Time Base Mode Select bits 11 = PWM time base operates in a Continuous Up/Down Count mode with interrupts for double PWM updates 10 = PWM time base operates in a Continuous Up/Down Count mode 01 = PWM time base operates in Single Pulse mode 00 = PWM time base operates in a Free-Running mode bit 14 bit 13 bit 12-8 bit 7-4 bit 3-2 bit 1-0 DS70283H-page 162 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-2: R-0 PTDIR bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PxTMR: PWM TIMER COUNT VALUE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 PTMR<14:8> bit 8 R/W-0 bit 0 R/W-0 R/W-0 R/W-0 PTMR<7:0> PTDIR: PWM Time Base Count Direction Status bit (read-only) 1 = PWM time base is counting down 0 = PWM time base is counting up PTMR <14:0>: PWM Time Base Register Count Value bits bit 14-0 REGISTER 15-3: U-0 -- bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 bit 14-0 PxTPER: PWM TIME BASE PERIOD REGISTER R/W-0 R/W-0 R/W-0 R/W-0 PTPER<14:8> bit 8 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 0 R/W-0 R/W-0 R/W-0 PTPER<7:0> W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown Unimplemented: Read as `0' PTPER<14:0>: PWM Time Base Period Value bits (c) 2011 Microchip Technology Inc. DS70283H-page 163 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-4: R/W-0 SEVTDIR(1) bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PxSECMP: SPECIAL EVENT COMPARE REGISTER R/W-0 R/W-0 R/W-0 R/W-0 SEVTCMP<14:8>(2) bit 8 R/W-0 bit 0 R/W-0 R/W-0 R/W-0 SEVTCMP<7:0>(2) SEVTDIR: Special Event Trigger Time Base Direction bit(1) 1 = A Special Event Trigger will occur when the PWM time base is counting downward 0 = A Special Event Trigger will occur when the PWM time base is counting upward SEVTCMP<14:0>: Special Event Compare Value bits(2) SEVTDIR is compared with PTDIR (PXTMR<15>) to generate the Special Event Trigger. PxSECMP<14:0> is compared with PXTMR<14:0> to generate the Special Event Trigger. bit 14-0 Note 1: 2: DS70283H-page 164 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-5: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 10-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-1 PEN3H (1) PWMxCON1: PWM CONTROL REGISTER 1(2) U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 PMOD3 R/W-0 PMOD2 R/W-0 PMOD1 bit 8 R/W-1 PEN2H (1) R/W-1 PEN1H (1) U-0 -- R/W-1 PEN3L (1) R/W-1 PEN2L (1) R/W-1 PEN1L(1) bit 0 Unimplemented: Read as `0' PMOD3:PMOD1: PWM I/O Pair Mode bits 1 = PWM I/O pin pair is in the Independent PWM Output mode 0 = PWM I/O pin pair is in the Complementary Output mode Unimplemented: Read as `0' PEN3H:PEN1H: PWMxH I/O Enable bits(1) 1 = PWMxH pin is enabled for PWM output 0 = PWMxH pin disabled, I/O pin becomes general purpose I/O Unimplemented: Read as `0' PEN3L:PEN1L: PWMxL I/O Enable bits(1) 1 = PWMxL pin is enabled for PWM output 0 = PWMxL pin disabled, I/O pin becomes general purpose I/O Reset condition of the PENxH and PENxL bits depends on the value of the PWMPIN Configuration bit in the FPOR Configuration register. PWM2 supports only 1 PWM I/O pin pair. bit 7 bit 6-4 bit 3 bit 2-0 Note 1: 2: (c) 2011 Microchip Technology Inc. DS70283H-page 165 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-6: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-12 bit 11-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 IUE R/W-0 OSYNC PWMxCON2: PWM CONTROL REGISTER 2 U-0 -- U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 R/W-0 bit 8 R/W-0 UDIS bit 0 SEVOPS<3:0> Unimplemented: Read as `0' SEVOPS<3:0>: PWM Special Event Trigger Output Postscale Select bits 1111 = 1:16 postscale * * * 0001 = 1:2 postscale 0000 = 1:1 postscale Unimplemented: Read as `0' IUE: Immediate Update Enable bit 1 = Updates to the active PxDC registers are immediate 0 = Updates to the active PxDC registers are synchronized to the PWM time base OSYNC: Output Override Synchronization bit 1 = Output overrides via the PxOVDCON register are synchronized to the PWM time base 0 = Output overrides via the PxOVDCON register occur on next TCY boundary UDIS: PWM Update Disable bit 1 = Updates from Duty Cycle and Period Buffer registers are disabled 0 = Updates from Duty Cycle and Period Buffer registers are enabled bit 7-3 bit 2 bit 1 bit 0 DS70283H-page 166 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-7: R/W-0 bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 DTBPS<1:0> PxDTCON1: DEAD-TIME CONTROL REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 8 R/W-0 bit 0 DTB<5:0> DTAPS<1:0> DTA<5:0> DTBPS<1:0>: Dead-Time Unit B Prescale Select bits 11 = Clock period for Dead-Time Unit B is 8 TCY 10 = Clock period for Dead-Time Unit B is 4 TCY 01 = Clock period for Dead-Time Unit B is 2 TCY 00 = Clock period for Dead-Time Unit B is TCY DTB<5:0>: Unsigned 6-bit Dead-Time Value for Dead-Time Unit B bits DTAPS<1:0>: Dead-Time Unit A Prescale Select bits 11 = Clock period for Dead-Time Unit A is 8 TCY 10 = Clock period for Dead-Time Unit A is 4 TCY 01 = Clock period for Dead-Time Unit A is 2 TCY 00 = Clock period for Dead-Time Unit A is TCY DTA<5:0>: Unsigned 6-bit Dead-Time Value for Dead-Time Unit A bits bit 13-8 bit 7-6 bit 5-0 (c) 2011 Microchip Technology Inc. DS70283H-page 167 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-8: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-6 bit 5 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-0 DTS3A R/W-0 DTS3I R/W-0 DTS2A R/W-0 DTS2I R/W-0 DTS1A PxDTCON2: DEAD-TIME CONTROL REGISTER 2(1) U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 R/W-0 DTS1I bit 0 Unimplemented: Read as `0' DTS3A: Dead-Time Select for PWM3 Signal Going Active bit 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A DTS3I: Dead-Time Select for PWM3 Signal Going Inactive bit 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A DTS2A: Dead-Time Select for PWM2 Signal Going Active bit 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A DTS2I: Dead-Time Select for PWM2 Signal Going Inactive bit 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A DTS1A: Dead-Time Select for PWM1 Signal Going Active bit 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A DTS1I: Dead-Time Select for PWM1 Signal Going Inactive bit 1 = Dead time provided from Unit B 0 = Dead time provided from Unit A PWM2 supports only 1 PWM I/O pin pair. bit 4 bit 3 bit 2 bit 1 bit 0 Note 1: DS70283H-page 168 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-9: U-0 -- bit 15 R/W-0 FLTAM bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 FAEN3 R/W-0 FAEN2 PxFLTACON: FAULT A CONTROL REGISTER(1) U-0 -- R/W-0 FAOV3H R/W-0 FAOV3L R/W-0 FAOV2H R/W-0 FAOV2L R/W-0 FAOV1H R/W-0 FAOV1L bit 8 R/W-0 FAEN1 bit 0 Unimplemented: Read as `0' FAOVxH<3:1>:FAOVxL<3:1>: Fault Input A PWM Override Value bits 1 = The PWM output pin is driven active on an external Fault input event 0 = The PWM output pin is driven inactive on an external Fault input event FLTAM: Fault A Mode bit 1 = The Fault A input pin functions in the Cycle-by-Cycle mode 0 = The Fault A input pin latches all control pins to the programmed states in PxFLTACON<13:8> Unimplemented: Read as `0' FAEN3: Fault Input A Enable bit 1 = PWMxH3/PWMxL3 pin pair is controlled by Fault Input A 0 = PWMxH3/PWMxL3 pin pair is not controlled by Fault Input A FAEN2: Fault Input A Enable bit 1 = PWMxH2/PWMxL2 pin pair is controlled by Fault Input A 0 = PWMxH2/PWMxL2 pin pair is not controlled by Fault Input A FAEN1: Fault Input A Enable bit 1 = PWMxH1/PWMxL1 pin pair is controlled by Fault Input A 0 = PWMxH1/PWMxL1 pin pair is not controlled by Fault Input A PWM2 supports only 1 PWM I/O pin pair. bit 7 bit 6-3 bit 2 bit 1 bit 0 Note 1: (c) 2011 Microchip Technology Inc. DS70283H-page 169 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-10: PxOVDCON: OVERRIDE CONTROL REGISTER(1) U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-14 bit 13-8 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-0 POUT3H R/W-0 POUT3L R/W-0 POUT2H R/W-0 POUT2L R/W-0 POUT1H U-0 -- R/W-1 POVD3H R/W-1 POVD3L R/W-1 POVD2H R/W-1 POVD2L R/W-1 POVD1H R/W-1 POVD1L bit 8 R/W-0 POUT1L bit 0 Unimplemented: Read as `0' POVDxH<3:1>:POVDxL<3:1>: PWM Output Override bits 1 = Output on PWMx I/O pin is controlled by the PWM generator 0 = Output on PWMx I/O pin is controlled by the value in the corresponding POUTxH:POUTxL bit Unimplemented: Read as `0' POUTxH<3:1>:POUTxL<3:1>: PWM Manual Output bits 1 = PWMx I/O pin is driven active when the corresponding POVDxH:POVDxL bit is cleared 0 = PWMx I/O pin is driven inactive when the corresponding POVDxH:POVDxL bit is cleared PWM2 supports only 1 PWM I/O pin pair. bit 7-6 bit 5-0 Note 1: DS70283H-page 170 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 15-11: PxDC1: PWM DUTY CYCLE REGISTER 1 R/W-0 bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 8 R/W-0 bit 0 PDC1<15:8> PDC1<7:0> PDC1<15:0>: PWM Duty Cycle 1 Value bits REGISTER 15-12: P1DC2: PWM DUTY CYCLE REGISTER 2 R/W-0 bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 8 R/W-0 bit 0 PDC2<15:8> PDC2<7:0> PDC2<15:0>: PWM Duty Cycle 2 Value bits REGISTER 15-13: P1DC3: PWM DUTY CYCLE REGISTER 3 R/W-0 bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 bit 8 R/W-0 bit 0 PDC3<15:8> PDC3<7:0> PDC3<15:0>: PWM Duty Cycle 3 Value bits (c) 2011 Microchip Technology Inc. DS70283H-page 171 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 172 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 16.0 QUADRATURE ENCODER INTERFACE (QEI) MODULE This section describes the Quadrature Encoder Interface (QEI) module and associated operational modes. The QEI module provides the interface to incremental encoders for obtaining mechanical position data. The operational features of the QEI include: * Three input channels for two phase signals and index pulse * 16-bit up/down position counter * Count direction status * Position Measurement (x2 and x4) mode * Programmable digital noise filters on inputs * Alternate 16-bit Timer/Counter mode * Quadrature Encoder Interface interrupts These operating modes are determined by setting the appropriate bits, QEIM<2:0> in (QEIxCON<10:8>). Figure 16-1 depicts the Quadrature Encoder Interface block diagram. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 15. "Quadrature Encoder Interface (QEI)" (DS70208) of the "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. FIGURE 16-1: Sleep Input QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM TQCKPS<1:0> TQCS TCY 0 1 QEIM<2:0> 1 Prescaler 1, 8, 64, 256 2 Synchronize Det 0 TQGATE D CK Q Q QEIIF Event Flag QEAx Programmable Digital Filter UPDN_SRC 0 1 QEIxCON<11> 2 Quadrature Encoder Interface Logic 16-bit Up/Down Counter (POSCNT) Reset Comparator/ Zero Detect Equal 3 QEIM<2:0> Mode Select Max Count Register (MAXCNT) QEBx Programmable Digital Filter INDXx Programmable Digital Filter 3 PCDOUT 0 UPDNx 1 Existing Pin Logic Up/Down (c) 2011 Microchip Technology Inc. DS70283H-page 173 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 16.1 Control and Status Registers The QEI module has four user-accessible registers, accessible in either Byte or Word mode: * Control/Status Register (QEICON) - Allows control of the QEI operation and status flags indicating the module state. * Digital Filter Control Register (DFLTCON) - Allows control of the digital input filter operation. * Position Count Register (POSCNT) - Allows reading and writing of the 16-bit position counter. * Maximum Count Register (MAXCNT) - Holds a value that is compared to the POSCNT counter in some operations. Note: The POSCNT register allows byte accesses. However, reading the register in Byte mode can result in partially updated values in subsequent reads. Either use Word mode reads/writes, or ensure that the counter is not counting during Byte operations. DS70283H-page 174 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 16-1: R/W-0 CNTERR bit 15 R/W-0 SWPAB bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 PCDOUT R/W-0 TQGATE R/W-0 R/W-0 R/W-0 POSRES R/W-0 TQCS QEIxCON: QEI CONTROL REGISTER U-0 -- R/W-0 QEISIDL R-0 INDEX R/W-0 UPDN R/W-0 R/W-0 QEIM<2:0> bit 8 R/W-0 UPDN_SRC bit 0 R/W-0 TQCKPS<1:0> CNTERR: Count Error Status Flag bit 1 = Position count error has occurred 0 = No position count error has occurred Note: CNTERR flag only applies when QEIM<2:0> = `110' or `100'. Unimplemented: Read as `0' QEISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode INDEX: Index Pin State Status bit (Read-Only) 1 = Index pin is High 0 = Index pin is Low UPDN: Position Counter Direction Status bit 1 = Position Counter Direction is positive (+) 0 = Position Counter Direction is negative (-) (Read-only bit when QEIM<2:0> = `1XX') (Read/Write bit when QEIM<2:0> = `001') QEIM<2:0>: Quadrature Encoder Interface Mode Select bits 111 = Quadrature Encoder Interface enabled (x4 mode) with position counter reset by match (MAXCNT) 110 = Quadrature Encoder Interface enabled (x4 mode) with Index Pulse reset of position counter 101 = Quadrature Encoder Interface enabled (x2 mode) with position counter reset by match (MAXCNT) 100 = Quadrature Encoder Interface enabled (x2 mode) with Index Pulse reset of position counter 011 = Unused (Module disabled) 010 = Unused (Module disabled) 001 = Starts 16-bit Timer 000 = Quadrature Encoder Interface/Timer off SWPAB: Phase A and Phase B Input Swap Select bit 1 = Phase A and Phase B inputs swapped 0 = Phase A and Phase B inputs not swapped PCDOUT: Position Counter Direction State Output Enable bit 1 = Position Counter Direction Status Output Enable (QEI logic controls state of I/O pin) 0 = Position Counter Direction Status Output Disabled (Normal I/O pin operation) TQGATE: Timer Gated Time Accumulation Enable bit 1 = Timer gated time accumulation enabled 0 = Timer gated time accumulation disabled bit 14 bit 13 bit 12 bit 11 bit 10-8 bit 7 bit 6 bit 5 (c) 2011 Microchip Technology Inc. DS70283H-page 175 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 16-1: bit 4-3 QEIxCON: QEI CONTROL REGISTER (CONTINUED) TQCKPS<1:0>: Timer Input Clock Prescale Select bits 11 = 1:256 prescale value 10 = 1:64 prescale value 01 = 1:8 prescale value 00 = 1:1 prescale value (Prescaler utilized for 16-bit Timer mode only) POSRES: Position Counter Reset Enable bit 1 = Index Pulse resets Position Counter 0 = Index Pulse does not reset Position Counter Note: Bit applies only when QEIM<2:0> = 100 or 110. TQCS: Timer Clock Source Select bit 1 = External clock from pin QEA (on the rising edge) 0 = Internal clock (TCY) UPDN_SRC: Position Counter Direction Selection Control bit 1 = QEB pin state defines position counter direction 0 = Control/Status bit, UPDN (QEICON<11>), defines timer counter (POSCNT) direction Note: When configured for QEI mode, control bit is a `don't care'. bit 2 bit 1 bit 0 DS70283H-page 176 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 16-2: U-0 -- bit 15 R/W-0 QEOUT bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 10-9 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 QECK<2:0> U-0 -- U-0 -- U-0 -- U-0 -- bit 0 DFLTxCON: DIGITAL FILTER CONTROL REGISTER U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 CEID bit 8 IMV<1:0> Unimplemented: Read as `0' IMV<1:0>: Index Match Value bits - These bits allow the user application to specify the state of the QEA and QEB input pins during an Index pulse when the POSxCNT register is to be reset. In 4X Quadrature Count Mode: IMV1 = Required State of Phase B input signal for match on index pulse IMV0 = Required State of Phase A input signal for match on index pulse In 2X Quadrature Count Mode: IMV1 = Selects Phase input signal for Index state match (0 = Phase A, 1 = Phase B) IMV0 = Required state of the selected Phase input signal for match on index pulse CEID: Count Error Interrupt Disable bit 1 = Interrupts due to count errors are disabled 0 = Interrupts due to count errors are enabled QEOUT: QEA/QEB/INDX Pin Digital Filter Output Enable bit 1 = Digital filter outputs enabled 0 = Digital filter outputs disabled (normal pin operation) QECK<2:0>: QEA/QEB/INDX Digital Filter Clock Divide Select Bits 111 = 1:256 Clock Divide 110 = 1:128 Clock Divide 101 = 1:64 Clock Divide 100 = 1:32 Clock Divide 011 = 1:16 Clock Divide 010 = 1:4 Clock Divide 001 = 1:2 Clock Divide 000 = 1:1 Clock Divide Unimplemented: Read as `0' bit 8 bit 7 bit 6-4 bit 3-0 (c) 2011 Microchip Technology Inc. DS70283H-page 177 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 178 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 17.0 SERIAL PERIPHERAL INTERFACE (SPI) The Serial Peripheral Interface (SPI) module is a synchronous serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices can be serial EEPROMs, shift registers, display drivers, analog-to-digital converters, etc. The SPI module is compatible with SPI and SIOP from Motorola(R). Each SPI module consists of a 16-bit shift register, SPIxSR (where x = 1 or 2), used for shifting data in and out, and a buffer register, SPIxBUF. A control register, SPIxCON, configures the module. Additionally, a status register, SPIxSTAT, indicates status conditions. The serial interface consists of these four pins: * * * * SDIx (serial data input) SDOx (serial data output) SCKx (shift clock input or output) SSx (active-low slave select) Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 18. "Serial Peripheral Interface (SPI)" (DS70206) of the "dsPIC33F/PIC24H Family Reference Manual", which is available on the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. In Master mode operation, SCK is a clock output. In Slave mode, it is a clock input. FIGURE 17-1: SCKx SPI MODULE BLOCK DIAGRAM 1:1 to 1:8 Secondary Prescaler Sync Control Control Clock Shift Control Select Edge 1:1/4/16/64 Primary Prescaler FCY SSx SPIxCON1<1:0> SPIxCON1<4:2> Enable Master Clock SPIxSR SDOx SDIx bit 0 Transfer Transfer SPIxRXB SPIxTXB SPIxBUF Read SPIxBUF Write SPIxBUF 16 Internal Data Bus (c) 2011 Microchip Technology Inc. DS70283H-page 179 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 17-1: R/W-0 SPIEN bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 C = Clearable bit W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/C-0 SPIROV U-0 -- U-0 -- U-0 -- U-0 -- R-0 SPITBF R-0 SPIRBF bit 0 SPIxSTAT: SPIx STATUS AND CONTROL REGISTER U-0 -- R/W-0 SPISIDL U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 SPIEN: SPIx Enable bit 1 = Enables module and configures SCKx, SDOx, SDIx and SSx as serial port pins 0 = Disables module Unimplemented: Read as `0' SPISIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode Unimplemented: Read as `0' SPIROV: Receive Overflow Flag bit 1 = A new byte/word is completely received and discarded. The user software has not read the previous data in the SPIxBUF register 0 = No overflow has occurred. Unimplemented: Read as `0' SPITBF: SPIx Transmit Buffer Full Status bit 1 = Transmit not yet started, SPIxTXB is full 0 = Transmit started, SPIxTXB is empty Automatically set in hardware when CPU writes SPIxBUF location, loading SPIxTXB. Automatically cleared in hardware when SPIx module transfers data from SPIxTXB to SPIxSR. SPIRBF: SPIx Receive Buffer Full Status bit 1 = Receive complete, SPIxRXB is full 0 = Receive is not complete, SPIxRXB is empty Automatically set in hardware when SPIx transfers data from SPIxSR to SPIxRXB. Automatically cleared in hardware when core reads SPIxBUF location, reading SPIxRXB. bit 14 bit 13 bit 12-7 bit 6 bit 5-2 bit 1 bit 0 DS70283H-page 180 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 17-2: U-0 -- bit 15 R/W-0 SSEN bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 bit 12 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown (2) SPIXCON1: SPIx CONTROL REGISTER 1 U-0 -- U-0 -- R/W-0 DISSCK R/W-0 DISSDO R/W-0 MODE16 R/W-0 SMP R/W-0 CKE(1) bit 8 R/W-0 CKP R/W-0 MSTEN R/W-0 R/W-0 SPRE<2:0> (3) R/W-0 R/W-0 R/W-0 bit 0 PPRE<1:0>(3) Unimplemented: Read as `0' DISSCK: Disable SCKx pin bit (SPI Master modes only) 1 = Internal SPI clock is disabled, pin functions as I/O 0 = Internal SPI clock is enabled DISSDO: Disable SDOx pin bit 1 = SDOx pin is not used by module; pin functions as I/O 0 = SDOx pin is controlled by the module MODE16: Word/Byte Communication Select bit 1 = Communication is word-wide (16 bits) 0 = Communication is byte-wide (8 bits) SMP: SPIx Data Input Sample Phase bit Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time Slave mode: SMP must be cleared when SPIx is used in Slave mode. CKE: SPIx Clock Edge Select bit(1) 1 = Serial output data changes on transition from active clock state to Idle clock state (see bit 6) 0 = Serial output data changes on transition from Idle clock state to active clock state (see bit 6) SSEN: Slave Select Enable bit (Slave mode)(2) 1 = SSx pin used for Slave mode 0 = SSx pin not used by module. Pin controlled by port function CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level; active state is a low level 0 = Idle state for clock is a low level; active state is a high level MSTEN: Master Mode Enable bit 1 = Master mode 0 = Slave mode The CKE bit is not used in the Framed SPI modes. Program this bit to `0' for the Framed SPI modes (FRMEN = 1). This bit must be cleared when FRMEN = 1. Do not set both Primary and Secondary prescalers to a value of 1:1. bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 Note 1: 2: 3: (c) 2011 Microchip Technology Inc. DS70283H-page 181 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 17-2: bit 4-2 SPIXCON1: SPIx CONTROL REGISTER 1 (CONTINUED) SPRE<2:0>: Secondary Prescale bits (Master mode)(3) 111 = Secondary prescale 1:1 110 = Secondary prescale 2:1 * * * 000 = Secondary prescale 8:1 PPRE<1:0>: Primary Prescale bits (Master mode)(3) 11 = Primary prescale 1:1 10 = Primary prescale 4:1 01 = Primary prescale 16:1 00 = Primary prescale 64:1 The CKE bit is not used in the Framed SPI modes. Program this bit to `0' for the Framed SPI modes (FRMEN = 1). This bit must be cleared when FRMEN = 1. Do not set both Primary and Secondary prescalers to a value of 1:1. bit 1-0 Note 1: 2: 3: DS70283H-page 182 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 17-3: R/W-0 FRMEN bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 FRMDLY U-0 -- bit 0 SPIxCON2: SPIx CONTROL REGISTER 2 R/W-0 R/W-0 FRMPOL U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- bit 8 SPIFSD FRMEN: Framed SPIx Support bit 1 = Framed SPIx support enabled (SSx pin used as frame sync pulse input/output) 0 = Framed SPIx support disabled SPIFSD: Frame Sync Pulse Direction Control bit 1 = Frame sync pulse input (slave) 0 = Frame sync pulse output (master) FRMPOL: Frame Sync Pulse Polarity bit 1 = Frame sync pulse is active-high 0 = Frame sync pulse is active-low Unimplemented: Read as `0' FRMDLY: Frame Sync Pulse Edge Select bit 1 = Frame sync pulse coincides with first bit clock 0 = Frame sync pulse precedes first bit clock Unimplemented: This bit must not be set to `1' by the user application bit 14 bit 13 bit 12-2 bit 1 bit 0 (c) 2011 Microchip Technology Inc. DS70283H-page 183 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 184 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 18.0 INTER-INTEGRATED CIRCUITTM (I2CTM) 18.1 Operating Modes The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode specifications, as well as 7-bit and 10-bit addressing. The I2C module can operate either as a slave or a master on an I2C bus. The following types of I2C operation are supported: * * * I2C slave operation with 7-bit addressing I2C slave operation with 10-bit addressing I2C master operation with 7-bit or 10-bit addressing Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 19. "Inter-Integrated CircuitTM (DS70195) of the (I2CTM)" "dsPIC33F/PIC24H Family Reference Manual", which is available from the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The Inter-Integrated Circuit (I2C) module provides complete hardware support for both Slave and Multi-Master modes of the I2C serial communication standard, with a 16-bit interface. The I2C module has a 2-pin interface: * The SCLx pin is clock * The SDAx pin is data The I2C module offers the following key features: * I2C interface supporting both Master and Slave modes of operation * I2C Slave mode supports 7-bit and 10-bit addressing * I2C Master mode supports 7-bit and 10-bit addressing * I2C port allows bidirectional transfers between master and slaves * Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control) * I2C supports multi-master operation, detects bus collision and arbitrates accordingly For details about the communication sequence in each of these modes, refer to the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 18.2 I2C Registers I2CxCON and I2CxSTAT are control and status registers, respectively. The I2CxCON register is readable and writable. The lower six bits of I2CxSTAT are read-only. The remaining bits of the I2CSTAT are read/write: * I2CxRSR is the shift register used for shifting data. * I2CxRCV is the receive buffer and the register to which data bytes are written, or from which data bytes are read. * I2CxTRN is the transmit register to which bytes are written during a transmit operation. * The I2CxADD register holds the slave address. * A status bit, ADD10, indicates 10-bit Address mode. * The I2CxBRG acts as the Baud Rate Generator (BRG) reload value. In receive operations, I2CxRSR and I2CxRCV together form a double-buffered receiver. When I2CxRSR receives a complete byte, it is transferred to I2CxRCV, and an interrupt pulse is generated. (c) 2011 Microchip Technology Inc. DS70283H-page 185 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 18-1: I2CTM BLOCK DIAGRAM (X = 1) Internal Data Bus I2CxRCV Read SCLx Shift Clock I2CxRSR LSb SDAx Match Detect Address Match Write I2CxMSK Write Read I2CxADD Read Start and Stop Bit Detect Write Start and Stop Bit Generation Control Logic I2CxSTAT Read Write Collision Detect I2CxCON Read Acknowledge Generation Clock Stretching Write I2CxTRN LSb Shift Clock Reload Control Read Write I2CxBRG Read BRG Down Counter TCY/2 DS70283H-page 186 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 18-1: R/W-0 I2CEN bit 15 R/W-0 GCEN bit 7 Legend: R = Readable bit -n = Value at POR bit 15 U = Unimplemented bit, read as `0' W = Writable bit `1' = Bit is set HS = Set in hardware `0' = Bit is cleared HC = Cleared in hardware x = Bit is unknown R/W-0 STREN R/W-0 ACKDT R/W-0 HC ACKEN R/W-0 HC RCEN R/W-0 HC PEN R/W-0 HC RSEN I2CxCON: I2Cx CONTROL REGISTER U-0 -- R/W-0 I2CSIDL R/W-1 HC SCLREL R/W-0 IPMIEN R/W-0 A10M R/W-0 DISSLW R/W-0 SMEN bit 8 R/W-0 HC SEN bit 0 I2CEN: I2Cx Enable bit 1 = Enables the I2Cx module and configures the SDAx and SCLx pins as serial port pins 0 = Disables the I2Cx module. All I2C pins are controlled by port functions Unimplemented: Read as `0' I2CSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters an Idle mode 0 = Continue module operation in Idle mode SCLREL: SCLx Release Control bit (when operating as I2C slave) 1 = Release SCLx clock 0 = Hold SCLx clock low (clock stretch) If STREN = 1: Bit is R/W (i.e., software can write `0' to initiate stretch and write `1' to release clock). Hardware clear at beginning of slave transmission. Hardware clear at end of slave reception. If STREN = 0: Bit is R/S (i.e., software can only write `1' to release clock). Hardware clear at beginning of slave transmission. IPMIEN: Intelligent Peripheral Management Interface (IPMI) Enable bit 1 = IPMI mode is enabled; all addresses Acknowledged 0 = IPMI mode disabled A10M: 10-bit Slave Address bit 1 = I2CxADD is a 10-bit slave address 0 = I2CxADD is a 7-bit slave address DISSLW: Disable Slew Rate Control bit 1 = Slew rate control disabled 0 = Slew rate control enabled SMEN: SMbus Input Levels bit 1 = Enable I/O pin thresholds compliant with SMbus specification 0 = Disable SMbus input thresholds GCEN: General Call Enable bit (when operating as I2C slave) 1 = Enable interrupt when a general call address is received in the I2CxRSR (module is enabled for reception) 0 = General call address disabled STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave) Used in conjunction with SCLREL bit. 1 = Enable software or receive clock stretching 0 = Disable software or receive clock stretching bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 (c) 2011 Microchip Technology Inc. DS70283H-page 187 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 18-1: bit 5 I2CxCON: I2Cx CONTROL REGISTER (CONTINUED) ACKDT: Acknowledge Data bit (when operating as I2C master, applicable during master receive) Value that will be transmitted when the software initiates an Acknowledge sequence. 1 = Send NACK during Acknowledge 0 = Send ACK during Acknowledge ACKEN: Acknowledge Sequence Enable bit (when operating as I2C master, applicable during master receive) 1 = Initiate Acknowledge sequence on SDAx and SCLx pins and transmit ACKDT data bit. Hardware clear at end of master Acknowledge sequence 0 = Acknowledge sequence not in progress RCEN: Receive Enable bit (when operating as I2C master) 1 = Enables Receive mode for I2C. Hardware clear at end of eighth bit of master receive data byte 0 = Receive sequence not in progress PEN: Stop Condition Enable bit (when operating as I2C master) 1 = Initiate Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop sequence 0 = Stop condition not in progress RSEN: Repeated Start Condition Enable bit (when operating as I2C master) 1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at end of master Repeated Start sequence 0 = Repeated Start condition not in progress SEN: Start Condition Enable bit (when operating as I2C master) 1 = Initiate Start condition on SDAx and SCLx pins. Hardware clear at end of master Start sequence 0 = Start condition not in progress bit 4 bit 3 bit 2 bit 1 bit 0 DS70283H-page 188 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 18-2: R-0 HSC ACKSTAT bit 15 R/C-0 HS IWCOL bit 7 Legend: R = Readable bit -n = Value at POR bit 15 U = Unimplemented bit, read as `0' C = Clear only bit W = Writable bit `1' = Bit is set HS = Set in hardware `0' = Bit is cleared HSC = Hardware set/cleared x = Bit is unknown R/C-0 HS I2COV R-0 HSC D_A R/C-0 HSC P R/C-0 HSC S R-0 HSC R_W R-0 HSC RBF I2CxSTAT: I2Cx STATUS REGISTER U-0 -- U-0 -- U-0 -- R/C-0 HS BCL R-0 HSC GCSTAT R-0 HSC ADD10 bit 8 R-0 HSC TBF bit 0 R-0 HSC TRSTAT ACKSTAT: Acknowledge Status bit (when operating as I2C master, applicable to master transmit operation) 1 = NACK received from slave 0 = ACK received from slave Hardware set or clear at end of slave Acknowledge. TRSTAT: Transmit Status bit (when operating as I2C master, applicable to master transmit operation) 1 = Master transmit is in progress (8 bits + ACK) 0 = Master transmit is not in progress Hardware set at beginning of master transmission. Hardware clear at end of slave Acknowledge. Unimplemented: Read as `0' BCL: Master Bus Collision Detect bit 1 = A bus collision has been detected during a master operation 0 = No collision Hardware set at detection of bus collision. GCSTAT: General Call Status bit 1 = General call address was received 0 = General call address was not received Hardware set when address matches general call address. Hardware clear at Stop detection. ADD10: 10-bit Address Status bit 1 = 10-bit address was matched 0 = 10-bit address was not matched Hardware set at match of 2nd byte of matched 10-bit address. Hardware clear at Stop detection. IWCOL: Write Collision Detect bit 1 = An attempt to write the I2CxTRN register failed because the I2C module is busy 0 = No collision Hardware set at occurrence of write to I2CxTRN while busy (cleared by software). I2COV: Receive Overflow Flag bit 1 = A byte was received while the I2CxRCV register is still holding the previous byte 0 = No overflow Hardware set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software). D_A: Data/Address bit (when operating as I2C slave) 1 = Indicates that the last byte received was data 0 = Indicates that the last byte received was device address Hardware clear at device address match. Hardware set by reception of slave byte. P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. bit 14 bit 13-11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 (c) 2011 Microchip Technology Inc. DS70283H-page 189 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 18-2: bit 3 I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED) S: Start bit 1 = Indicates that a Start (or Repeated Start) bit has been detected last 0 = Start bit was not detected last Hardware set or clear when Start, Repeated Start or Stop detected. R_W: Read/Write Information bit (when operating as I2C slave) 1 = Read - indicates data transfer is output from slave 0 = Write - indicates data transfer is input to slave Hardware set or clear after reception of I 2C device address byte. RBF: Receive Buffer Full Status bit 1 = Receive complete, I2CxRCV is full 0 = Receive not complete, I2CxRCV is empty Hardware set when I2CxRCV is written with received byte. Hardware clear when software reads I2CxRCV. TBF: Transmit Buffer Full Status bit 1 = Transmit in progress, I2CxTRN is full 0 = Transmit complete, I2CxTRN is empty Hardware set when software writes I2CxTRN. Hardware clear at completion of data transmission. bit 2 bit 1 bit 0 DS70283H-page 190 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 18-3: U-0 -- bit 15 R/W-0 AMSK7 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-10 bit 9-0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 AMSK6 R/W-0 AMSK5 R/W-0 AMSK4 R/W-0 AMSK3 R/W-0 AMSK2 R/W-0 AMSK1 I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 AMSK9 R/W-0 AMSK8 bit 8 R/W-0 AMSK0 bit 0 Unimplemented: Read as `0' AMSKx: Mask for Address bit x Select bit 1 = Enable masking for bit x of incoming message address; bit match not required in this position 0 = Disable masking for bit x; bit match required in this position (c) 2011 Microchip Technology Inc. DS70283H-page 191 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 192 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 19.0 UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) The primary features of the UART module are: * Full-Duplex, 8-bit or 9-bit Data Transmission through the UxTX and UxRX pins * Even, Odd or No Parity Options (for 8-bit data) * One or two stop bits * Hardware flow control option with UxCTS and UxRTS pins * Fully integrated Baud Rate Generator with 16-bit prescaler * Baud rates ranging from 10 Mbps to 38 bps at 40 MIPS * 4-deep First-In First-Out (FIFO) Transmit Data buffer * 4-deep FIFO Receive Data buffer * Parity, framing and buffer overrun error detection * Support for 9-bit mode with Address Detect (9th bit = 1) * Transmit and Receive interrupts * A separate interrupt for all UART error conditions * Loopback mode for diagnostic support * Support for sync and break characters * Support for automatic baud rate detection * IrDA(R) encoder and decoder logic * 16x baud clock output for IrDA(R) support A simplified block diagram of the UART module is shown in Figure 19-1. The UART module consists of these key hardware elements: * Baud Rate Generator * Asynchronous Transmitter * Asynchronous Receiver Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 17. "UART" (DS70188) of the "dsPIC33F/PIC24H Family Reference Manual", which is available on the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The Universal Asynchronous Receiver Transmitter (UART) module is one of the serial I/O modules available in the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 device family. The UART is a full-duplex asynchronous system that can communicate with peripheral devices, such as personal computers, LIN, and RS-232 and RS-485 interfaces. The module also supports a hardware flow control option with the UxCTS and UxRTS pins and also includes an IrDA(R) encoder and decoder. FIGURE 19-1: UART SIMPLIFIED BLOCK DIAGRAM Baud Rate Generator IrDA(R) Hardware Flow Control UxRTS/BCLK UxCTS UART Receiver UxRX UART Transmitter UxTX (c) 2011 Microchip Technology Inc. DS70283H-page 193 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 19-1: R/W-0 UARTEN(1) bit 15 R/W-0 HC WAKE bit 7 Legend: R = Readable bit -n = Value at POR bit 15 HC = Hardware Clearable W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 LPBACK R/W-0, HC ABAUD R/W-0 URXINV R/W-0 BRGH R/W-0 R/W-0 UxMODE: UARTx MODE REGISTER U-0 -- R/W-0 USIDL R/W-0 IREN(2) R/W-0 RTSMD U-0 -- R/W-0 R/W-0 bit 8 R/W-0 STSEL bit 0 UEN<1:0> PDSEL<1:0> UARTEN: UARTx Enable bit(1) 1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0> 0 = UARTx is disabled; all UARTx pins are controlled by port latches; UARTx power consumption minimal Unimplemented: Read as `0' USIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode IREN: IrDA(R) Encoder and Decoder Enable bit(2) 1 = IrDA encoder and decoder enabled 0 = IrDA encoder and decoder disabled RTSMD: Mode Selection for UxRTS Pin bit 1 = UxRTS pin in Simplex mode 0 = UxRTS pin in Flow Control mode Unimplemented: Read as `0' UEN<1:0>: UARTx Pin Enable bits 11 = UxTX, UxRX and BCLK pins are enabled and used; UxCTS pin controlled by port latches 10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used 01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin controlled by port latches 00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLK pins controlled by port latches WAKE: Wake-up on Start bit Detect During Sleep Mode Enable bit 1 = UARTx will continue to sample the UxRX pin; interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = No wake-up enabled LPBACK: UARTx Loopback Mode Select bit 1 = Enable Loopback mode 0 = Loopback mode is disabled ABAUD: Auto-Baud Enable bit 1 = Enable baud rate measurement on the next character - requires reception of a Sync field (55h) before other data; cleared in hardware upon completion 0 = Baud rate measurement disabled or completed URXINV: Receive Polarity Inversion bit 1 = UxRX Idle state is `0' 0 = UxRX Idle state is `1' Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for receive or transmit operation. This feature is only available for the 16x BRG mode (BRGH = 0). bit 14 bit 13 bit 12 bit 11 bit 10 bit 9-8 bit 7 bit 6 bit 5 bit 4 Note 1: 2: DS70283H-page 194 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 19-1: bit 3 UxMODE: UARTx MODE REGISTER (CONTINUED) BRGH: High Baud Rate Enable bit 1 = BRG generates 4 clocks per bit period (4x baud clock, High-Speed mode) 0 = BRG generates 16 clocks per bit period (16x baud clock, Standard mode) PDSEL<1:0>: Parity and Data Selection bits 11 = 9-bit data, no parity 10 = 8-bit data, odd parity 01 = 8-bit data, even parity 00 = 8-bit data, no parity STSEL: Stop Bit Selection bit 1 = Two Stop bits 0 = One Stop bit Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for receive or transmit operation. This feature is only available for the 16x BRG mode (BRGH = 0). bit 2-1 bit 0 Note 1: 2: (c) 2011 Microchip Technology Inc. DS70283H-page 195 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 19-2: R/W-0 UTXISEL1 bit 15 R/W-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15,13 HC = Hardware cleared W = Writable bit `1' = Bit is set `0' = Bit is cleared C = Clear only bit U = Unimplemented bit, read as `0' x = Bit is unknown R/W-0 R/W-0 ADDEN R-1 RIDLE R-0 PERR R-0 FERR R/C-0 OERR R-0 URXDA bit 0 UxSTA: UARTx STATUS AND CONTROL REGISTER R/W-0 R/W-0 UTXISEL0 U-0 -- R/W-0 HC UTXBRK R/W-0 UTXEN(1) R-0 UTXBF R-1 TRMT bit 8 UTXINV URXISEL<1:0> UTXISEL<1:0>: Transmission Interrupt Mode Selection bits 11 = Reserved; do not use 10 = Interrupt when a character is transferred to the Transmit Shift Register, and as a result, the transmit buffer becomes empty 01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit operations are completed 00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at least one character open in the transmit buffer) UTXINV: Transmit Polarity Inversion bit If IREN = 0: 1 = UxTX Idle state is `0' 0 = UxTX Idle state is `1' If IREN = 1: 1 = IrDA(R) encoded UxTX Idle state is `1' 0 = IrDA(R) encoded UxTX Idle state is `0' bit 14 bit 12 bit 11 Unimplemented: Read as `0' UTXBRK: Transmit Break bit 1 = Send Sync Break on next transmission - Start bit, followed by twelve `0' bits, followed by Stop bit; cleared by hardware upon completion 0 = Sync Break transmission disabled or completed UTXEN: Transmit Enable bit(1) 1 = Transmit enabled, UxTX pin controlled by UARTx 0 = Transmit disabled, any pending transmission is aborted and buffer is reset. UxTX pin controlled by port UTXBF: Transmit Buffer Full Status bit (read-only) 1 = Transmit buffer is full 0 = Transmit buffer is not full, at least one more character can be written TRMT: Transmit Shift Register Empty bit (read-only) 1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed) 0 = Transmit Shift Register is not empty, a transmission is in progress or queued URXISEL<1:0>: Receive Interrupt Mode Selection bits 11 = Interrupt is set on UxRSR transfer making the receive buffer full (i.e., has 4 data characters) 10 = Interrupt is set on UxRSR transfer making the receive buffer 3/4 full (i.e., has 3 data characters) 0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive buffer. Receive buffer has one or more characters Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for transmit operation. bit 10 bit 9 bit 8 bit 7-6 Note 1: DS70283H-page 196 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 19-2: bit 5 UxSTA: UARTx STATUS AND CONTROL REGISTER (CONTINUED) ADDEN: Address Character Detect bit (bit 8 of received data = 1) 1 = Address Detect mode enabled. If 9-bit mode is not selected, this does not take effect 0 = Address Detect mode disabled RIDLE: Receiver Idle bit (read-only) 1 = Receiver is Idle 0 = Receiver is active PERR: Parity Error Status bit (read-only) 1 = Parity error has been detected for the current character (character at the top of the receive FIFO) 0 = Parity error has not been detected FERR: Framing Error Status bit (read-only) 1 = Framing error has been detected for the current character (character at the top of the receive FIFO) 0 = Framing error has not been detected OERR: Receive Buffer Overrun Error Status bit (read/clear only) 1 = Receive buffer has overflowed 0 = Receive buffer has not overflowed. Clearing a previously set OERR bit (1 0 transition) will reset the receiver buffer and the UxRSR to the empty state URXDA: Receive Buffer Data Available bit (read-only) 1 = Receive buffer has data, at least one more character can be read 0 = Receive buffer is empty Refer to Section 17. "UART" (DS70188) in the "dsPIC33F/PIC24H Family Reference Manual" for information on enabling the UART module for transmit operation. bit 4 bit 3 bit 2 bit 1 bit 0 Note 1: (c) 2011 Microchip Technology Inc. DS70283H-page 197 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 198 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 20.0 10-BIT/12-BIT ANALOG-TO-DIGITAL CONVERTER (ADC) The 12-bit ADC configuration supports all the above features, except: * In the 12-bit configuration, conversion speeds of up to 500 ksps are supported. * There is only 1 sample-and-hold amplifier in the 12-bit configuration, so simultaneous sampling of multiple channels is not supported. Depending on the particular device pinout, the ADC can have up to nine analog input pins, designated AN0 through AN8. In addition, there are two analog input pins for external voltage reference connections. These voltage reference inputs can be shared with other analog input pins. The actual number of analog input pins and external voltage reference input configuration will depend on the specific device. Refer to the device data sheet for further details. A block diagram of the ADC is shown in Figure 20-1. Note 1: This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) of the "dsPIC33F/PIC24H Family Reference Manual", which is available on the Microchip website (www.microchip.com). 2: Some registers and associated bits described in this section may not be available on all devices. Refer to Section 4.0 "Memory Organization" in this data sheet for device-specific register and bit information. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices have up to nine Analog-to-Digital Converter (ADC) module input channels. The AD12B bit (AD1CON1<10>) allows each of the ADC modules to be configured as either a 10-bit, 4 sample-and-hold ADC (default configuration), or a 12-bit, 1 sample-and-hold ADC. Note: The ADC module must be disabled before the AD12B bit can be modified. 20.2 1. 2. ADC Initialization To configure the ADC module: Select port pins as analog inputs (AD1PCFGH<15:0> or AD1PCFGL<15:0>). Select voltage reference source to match expected range on analog inputs (AD1CON2<15:13>). Select the analog conversion clock to match the desired data rate with the processor clock (AD1CON3<7:0>). Determine how many sample-and-hold channels will be used (AD1CON2<9:8> and AD1PCFGH<15:0> or AD1PCFGL<15:0>). Select the appropriate sample/conversion sequence (AD1CON1<7:5> and AD1CON3<12:8>). Select the way conversion results are presented in the buffer (AD1CON1<9:8>). Turn on the ADC module (AD1CON1<15>). Configure ADC interrupt (if required): a) Clear the AD1IF bit. b) Select the ADC interrupt priority. 3. 4. 20.1 Key Features 5. The 10-bit ADC configuration has the following key features: * * * * * * * * * * * Successive Approximation (SAR) conversion Conversion speeds of up to 1.1 Msps Up to 9 analog input pins External voltage reference input pins Simultaneous sampling of up to four analog input pins Automatic Channel Scan mode Selectable conversion trigger source Selectable Buffer Fill modes Four result alignment options (signed/unsigned, fractional/integer) Operation during CPU Sleep and Idle modes 16-word conversion result buffer 6. 7. 8. (c) 2011 Microchip Technology Inc. DS70283H-page 199 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 20-1: ADC1 MODULE BLOCK DIAGRAM FOR dsPIC33FJ16MC304 AND dsPIC33FJ32MC204 DEVICES AN0 AN8 CHANNEL SCAN CH0SA<4:0> CH0 AN1 VREFL CSCNA CH0SB<4:0> S/H0 + - CH0NA CH0NB AN0 AN3 + CH1(2) CH123SA CH123SB AN6 VCFG<2:0> VREFL ADC1BUF0 ADC1BUF1 ADC1BUF2 VREFH CH123NA CH123NB SAR ADC AN1 AN4 + CH2(2) CH123SA CH123SB AN7 S/H2 ADC1BUFE ADC1BUFF VREFL S/H1 VREF+(1) AVDD VREF- (1) AVSS VREFL CH123NA CH123NB AN2 AN5 S/H3 + CH3(2) CH123SA CH123SB AN8 - VREFL CH123NA CH123NB Alternate Input Selection Note 1: 2: VREF+, VREF- inputs can be multiplexed with other analog inputs. Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation. DS70283H-page 200 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 20-2: AN0 AN5 S/H0 CHANNEL SCAN CH0SA<4:0> CH0 AN1 VREFL CSCNA CH0SB<4:0> + - ADC1 MODULE BLOCK DIAGRAM FOR dsPIC33FJ32MC202 DEVICE CH0NA CH0NB AN0 AN3 + CH123SA CH123SB CH1(2) VCFG<2:0> VREFL ADC1BUF0 ADC1BUF1 ADC1BUF2 VREFH CH123NA CH123NB SAR ADC AN1 AN4 + CH123SA CH123SB CH2 (2) VREF+(1) AVDD VREF-(1) AVSS S/H1 - VREFL S/H2 ADC1BUFE ADC1BUFF - VREFL CH123NA CH123NB AN2 AN5 S/H3 + CH123SA CH123SB CH3(2) - VREFL CH123NA CH123NB Alternate Input Selection Note 1: 2: VREF+, VREF- inputs can be multiplexed with other analog inputs. Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation. (c) 2011 Microchip Technology Inc. DS70283H-page 201 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 20-3: ADC CONVERSION CLOCK PERIOD BLOCK DIAGRAM AD1CON3<15> ADC Internal RC Clock(2) AD1CON3<5:0> 6 ADC Conversion Clock Multiplier 1, 2, 3, 4, 5,..., 64 Note 1: 2: 0 TAD 1 TOSC(1) TCY X2 Refer to Figure 8-2 for the derivation of FOSC when the PLL is enabled. If the PLL is not used, FOSC is equal to the clock frequency. TOSC = 1/FOSC. See the ADC Electrical Characteristics for the exact RC clock value. DS70283H-page 202 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 20-1: R/W-0 ADON bit 15 R/W-0 R/W-0 SSRC<2:0> bit 7 Legend: R = Readable bit -n = Value at POR bit 15 HC = Cleared by hardware W = Writable bit `1' = Bit is set HS = Set by hardware U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown R/W-0 U-0 -- R/W-0 SIMSAM R/W-0 ASAM R/W-0 HC,HS SAMP AD1CON1: ADC1 CONTROL REGISTER 1 U-0 -- R/W-0 ADSIDL U-0 -- U-0 -- R/W-0 AD12B R/W-0 R/W-0 bit 8 R/C-0 HC, HS DONE bit 0 C = Clear only bit FORM<1:0> ADON: ADC Operating Mode bit 1 = ADC module is operating 0 = ADC is off Unimplemented: Read as `0' ADSIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device enters Idle mode 0 = Continue module operation in Idle mode Unimplemented: Read as `0' AD12B: 10-bit or 12-bit Operation Mode bit 1 = 12-bit, 1-channel ADC operation 0 = 10-bit, 4-channel ADC operation FORM<1:0>: Data Output Format bits For 10-bit operation: 11 = Signed fractional (DOUT = sddd dddd dd00 0000, where s = .NOT.d<9>) 10 = Fractional (DOUT = dddd dddd dd00 0000) 01 = Signed integer (DOUT = ssss sssd dddd dddd, where s = .NOT.d<9>) 00 = Integer (DOUT = 0000 00dd dddd dddd) For 12-bit operation: 11 = Signed fractional (DOUT = sddd dddd dddd 0000, where s = .NOT.d<11>) 10 = Fractional (DOUT = dddd dddd dddd 0000) 01 = Signed Integer (DOUT = ssss sddd dddd dddd, where s = .NOT.d<11>) 00 = Integer (DOUT = 0000 dddd dddd dddd) SSRC<2:0>: Sample Clock Source Select bits 111 = Internal counter ends sampling and starts conversion (auto-convert) 110 = Reserved 101 = Motor Control PWM2 interval ends sampling and starts conversion 100 = Reserved 011 = Motor Control PWM1 interval ends sampling and starts conversion 010 = GP timer 3 compare ends sampling and starts conversion 001 = Active transition on INT0 pin ends sampling and starts conversion 000 = Clearing sample bit ends sampling and starts conversion Unimplemented: Read as `0' SIMSAM: Simultaneous Sample Select bit (applicable only when CHPS<1:0> = 01 or 1x) When AD12B = 1, SIMSAM is: U-0, Unimplemented, Read as `0' 1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x); or Samples CH0 and CH1 simultaneously (when CHPS<1:0> = 01) 0 = Samples multiple channels individually in sequence bit 14 bit 13 bit 12-11 bit 10 bit 9-8 bit 7-5 bit 4 bit 3 (c) 2011 Microchip Technology Inc. DS70283H-page 203 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 20-1: bit 2 AD1CON1: ADC1 CONTROL REGISTER 1 (CONTINUED) ASAM: ADC Sample Auto-Start bit 1 = Sampling begins immediately after last conversion. SAMP bit is auto-set 0 = Sampling begins when SAMP bit is set SAMP: ADC Sample Enable bit 1 = ADC sample-and-hold amplifiers are sampling 0 = ADC sample-and-hold amplifiers are holding If ASAM = 0, software can write `1' to begin sampling. Automatically set by hardware if ASAM = 1. If SSRC = 000, software can write `0' to end sampling and start conversion. If SSRC 000, automatically cleared by hardware to end sampling and start conversion. DONE: ADC Conversion Status bit 1 = ADC conversion cycle is completed 0 = ADC conversion not started or in progress Automatically set by hardware when ADC conversion is complete. Software can write `0' to clear DONE status (software not allowed to write `1'). Clearing this bit will NOT affect any operation in progress. Automatically cleared by hardware at start of a new conversion. bit 1 bit 0 DS70283H-page 204 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 20-2: R/W-0 bit 15 R-0 BUFS bit 7 Legend: R = Readable bit -n = Value at POR bit 15-13 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 BUFM AD1CON2: ADC1 CONTROL REGISTER 2 R/W-0 R/W-0 U-0 -- U-0 -- R/W-0 CSCNA R/W-0 R/W-0 bit 8 R/W-0 ALTS bit 0 CHPS<1:0> VCFG<2:0> SMPI<3:0> VCFG<2:0>: Converter Voltage Reference Configuration bits ADREF+ 000 001 010 011 1xx AVDD External VREF+ AVDD External VREF+ AVDD ADREFAVSS AVSS External VREFExternal VREFAVSS bit 12-11 bit 10 Unimplemented: Read as `0' CSCNA: Scan Input Selections for CH0+ during Sample A bit 1 = Scan inputs 0 = Do not scan inputs CHPS<1:0>: Select Channels Utilized bits When AD12B = 1, CHPS<1:0> is: U-0, Unimplemented, Read as `0' 1x = Converts CH0, CH1, CH2 and CH3 01 = Converts CH0 and CH1 00 = Converts CH0 BUFS: Buffer Fill Status bit (valid only when BUFM = 1) 1 = ADC is currently filling second half of buffer, user should access data in the first half 0 = ADC is currently filling first half of buffer, user application should access data in the second half Unimplemented: Read as `0' SMPI<3:0>: Sample/Convert Sequences Per Interrupt Selection bits 1111 = Interrupts at the completion of conversion for each 16th sample/convert sequence 1110 = Interrupts at the completion of conversion for each 15th sample/convert sequence * * * 0001 = Interrupts at the completion of conversion for each 2nd sample/convert sequence 0000 = Interrupts at the completion of conversion for each sample/convert sequence BUFM: Buffer Fill Mode Select bit 1 = Starts filling first half of buffer on first interrupt and the second half of buffer on next interrupt 0 = Always starts filling buffer from the beginning ALTS: Alternate Input Sample Mode Select bit 1 = Uses channel input selects for Sample A on first sample and Sample B on next sample 0 = Always uses channel input selects for Sample A bit 9-8 bit 7 bit 6 bit 5-2 bit 1 bit 0 (c) 2011 Microchip Technology Inc. DS70283H-page 205 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 20-3: R/W-0 ADRC bit 15 U-0 bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 AD1CON3: ADC1 CONTROL REGISTER 3 U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 SAMC<4:0>(1) bit 8 R/W-0 bit 0 R/W-0 R/W-0 ADCS<7:0>(2) ADRC: ADC Conversion Clock Source bit 1 = ADC internal RC clock 0 = Clock derived from system clock Unimplemented: Read as `0' SAMC<4:0>: Auto Sample Time bits(1) 11111 = 31 TAD * * * 00001 = 1 TAD 00000 = 0 TAD ADCS<7:0>: ADC Conversion Clock Select bits(2) 11111111 = Reserved * * * * 01000000 = Reserved 00111111 = TCY * (ADCS<7:0> + 1) = 64 * TCY = TAD * * * 00000010 = TCY * (ADCS<7:0> + 1) = 3 * TCY = TAD 00000001 = TCY * (ADCS<7:0> + 1) = 2 * TCY = TAD 00000000 = TCY * (ADCS<7:0> + 1) = 1 * TCY = TAD This bit only used if AD1CON1<7:5> (SSRC2:0) = 111. This bit is not used if AD1CON3<15> (ADRC) = 1. bit 14-13 bit 12-8 bit 7-0 Note 1: 2: DS70283H-page 206 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 20-4: U-0 -- bit 15 U-0 -- bit 7 Legend: R = Readable bit -n = Value at POR bit 15-11 bit 10-9 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 R/W-0 AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 CH123SB bit 8 R/W-0 CH123SA bit 0 CH123NB<1:0> CH123NA<1:0> Unimplemented: Read as `0' CH123NB<1:0>: Channel 1, 2, 3 Negative Input Select for Sample B bits dsPIC33FJ32MC202 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = Reserved 10 = Reserved 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ32MC204 and dsPIC33FJ16MC304 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = Reserved 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREF- bit 8 CH123SB: Channel 1, 2, 3 Positive Input Select for Sample B bit If AD12B = 1: 1 = Reserved 0 = Reserved If AD12B = 0: 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 bit 7-3 Unimplemented: Read as `0' (c) 2011 Microchip Technology Inc. DS70283H-page 207 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 20-4: bit 2-1 AD1CHS123: ADC1 INPUT CHANNEL 1, 2, 3 SELECT REGISTER (CONTINUED) CH123NA<1:0>: Channel 1, 2, 3 Negative Input Select for Sample A bits dsPIC33FJ32MC202 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = Reserved 10 = Reserved 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREFdsPIC33FJ32MC204 and dsPIC33FJ16MC304 devices only: If AD12B = 1: 11 = Reserved 10 = Reserved 01 = Reserved 00 = Reserved If AD12B = 0: 11 = Reserved 10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8 01 = CH1, CH2, CH3 negative input is VREF00 = CH1, CH2, CH3 negative input is VREF- bit 0 CH123SA: Channel 1, 2, 3 Positive Input Select for Sample A bit If AD12B = 1: 1 = Reserved 0 = Reserved If AD12B = 0: 1 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5 0 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2 DS70283H-page 208 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 REGISTER 20-5: R/W-0 CH0NB bit 15 R/W-0 CH0NA bit 7 Legend: R = Readable bit -n = Value at POR bit 15 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 CH0SA<4:0> bit 0 R/W-0 AD1CHS0: ADC1 INPUT CHANNEL 0 SELECT REGISTER U-0 -- U-0 -- R/W-0 R/W-0 R/W-0 CH0SB<4:0> bit 8 R/W-0 R/W-0 R/W-0 CH0NB: Channel 0 Negative Input Select for Sample B bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREFUnimplemented: Read as `0' CH0SB<4:0>: Channel 0 Positive Input Select for Sample B bits dsPIC33FJ32MC204 and dsPIC33FJ16MC304 devices only: 01000 = Channel 0 positive input is AN8 * * * bit 14-13 bit 12-8 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 dsPIC33FJ32MC202 devices only: 00101 = Channel 0 positive input is AN5 * * * 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0. bit 7 CH0NA: Channel 0 Negative Input Select for Sample A bit 1 = Channel 0 negative input is AN1 0 = Channel 0 negative input is VREFUnimplemented: Read as `0' CH0SA<4:0>: Channel 0 Positive Input Select for Sample A bits dsPIC33FJ32MC204 and dsPIC33FJ16MC304 devices only: 01000 = Channel 0 positive input is AN8 * * * bit 6-5 bit 4-0 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 dsPIC33FJ32MC202 devices only: 00101 = Channel 0 positive input is AN5 * * * 00010 = Channel 0 positive input is AN2 00001 = Channel 0 positive input is AN1 00000 = Channel 0 positive input is AN0 (c) 2011 Microchip Technology Inc. DS70283H-page 209 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 ,2 REGISTER 20-6: U-0 -- bit 15 R/W-0 CSS7 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-9 bit 8-0 AD1CSSL: ADC1 INPUT SCAN SELECT REGISTER LOW(1,2) U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 CSS8 bit 8 R/W-0 CSS6 R/W-0 CSS5 R/W-0 CSS4 R/W-0 CSS3 R/W-0 CSS2 R/W-0 CSS1 R/W-0 CSS0 bit 0 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown Unimplemented: Read as `0' CSS<8:0>: ADC Input Scan Selection bits 1 = Select ANx for input scan 0 = Skip ANx for input scan Note 1: On devices without 9 analog inputs, all AD1CSSL bits can be selected by the user application. However, inputs selected for scan without a corresponding input on device converts VREFL. 2: CSSx = ANx, where x = 0 through 8. REGISTER 20-7: U-0 -- bit 15 R/W-0 PCFG7 bit 7 Legend: R = Readable bit -n = Value at POR bit 15-9 bit 8-0 AD1PCFGL: ADC1 PORT CONFIGURATION REGISTER LOW(1,2,3) U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 PCFG8 bit 8 R/W-0 R/W-0 PCFG5 R/W-0 PCFG4 R/W-0 PCFG3 R/W-0 PCFG2 R/W-0 PCFG1 R/W-0 PCFG0 bit 0 PCFG6 W = Writable bit `1' = Bit is set U = Unimplemented bit, read as `0' `0' = Bit is cleared x = Bit is unknown Unimplemented: Read as `0' PCFG<8:0>: ADC Port Configuration Control bits 1 = Port pin in Digital mode, port read input enabled, ADC input multiplexer connected to AVSS 0 = Port pin in Analog mode, port read input disabled, ADC samples pin voltage On devices without 9 analog inputs, all PCFG bits are R/W by user software. However, the PCFG bits are ignored on ports without a corresponding input on device. PCFGx = ANx, where x = 0 through 8. The PCFGx bits have no effect if the ADC module is disabled by setting ADxMD bit in the PMDx Register. In this case, all port pins multiplexed with ANx will be in Digital mode. Note 1: 2: 3: DS70283H-page 210 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 21.0 Note: SPECIAL FEATURES This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24F Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. 21.1 Configuration Bits dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices provide nonvolatile memory implementation for device configuration bits. Refer to Section 25. "Device Configuration" (DS70194) of the "dsPIC33F/PIC24H Family Reference Manual", for more information on this implementation. The Configuration bits can be programmed (read as `0'), or left unprogrammed (read as `1'), to select various device configurations. These bits are mapped starting at program memory location 0xF80000. The individual Configuration bit descriptions for the Configuration registers are shown in Table 21-2. Note that address 0xF80000 is beyond the user program memory space. It belongs to the configuration memory space (0x800000-0xFFFFFF), which can only be accessed using table reads and table writes. The Device Configuration register map is shown in Table 21-1. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices include several features intended to maximize application flexibility and reliability, and minimize cost through elimination of external components. These are: * * * * * * Flexible configuration Watchdog Timer (WDT) Code Protection and CodeGuardTM Security JTAG Boundary Scan Interface In-Circuit Serial ProgrammingTM (ICSPTM) In-Circuit emulation TABLE 21-1: Address 0xF80000 FBS DEVICE CONFIGURATION REGISTER MAP Name Bit 7 -- -- -- IESO Bit 6 -- -- -- -- Bit 5 -- -- -- -- IOL1WAY -- LPOL JTAGEN -- WDTPRE ALTI2C -- -- -- -- Bit 4 -- -- -- -- -- -- -- Bit 3 Bit 2 BSS<2:0> -- GSS<1:0> FNOSC<2:0> OSCIOFNC POSCMD<1:0> WDTPOST<3:0> FPWRT<2:0> ICS<1:0> -- Bit 1 Bit 0 BWRP -- GWRP 0xF80002 RESERVED 0xF80004 FGS 0xF80006 FOSCSEL 0xF80008 FOSC 0xF8000A FWDT 0xF8000C FPOR 0xF8000E FICD 0xF80010 FUID0 0xF80012 FUID1 0xF80014 FUID2 0xF80016 FUID3 FCKSM<1:0> FWDTEN WINDIS PWMPIN HPOL Reserved(1) User Unit ID Byte 0 User Unit ID Byte 1 User Unit ID Byte 2 User Unit ID Byte 3 Legend: -- = unimplemented bit, read as `0'. Note 1: These bits are reserved for use by development tools and must be programmed as `1'. (c) 2011 Microchip Technology Inc. DS70283H-page 211 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 21-2: Bit Field BWRP dsPIC33F CONFIGURATION BITS DESCRIPTION Register FBS RTSP Effect Description Immediate Boot Segment Program Flash Write Protection 1 = Boot segment can be written 0 = Boot segment is write-protected Immediate dsPIC33FJ32MC202 and dsPIC33FJ32MC204 Devices Only Boot Segment Program Flash Code Protection Size X11 = No Boot program Flash segment Boot space is 768 Instruction Words (except interrupt vectors) 110 = Standard security; boot program Flash segment ends at 0x0007FE 010 = High security; boot program Flash segment ends at 0x0007FE Boot space is 3840 Instruction Words (except interrupt vectors) 101 = Standard security; boot program Flash segment, ends at 0x001FFE 001 = High security; boot program Flash segment ends at 0x001FFE Boot space is 7936 Instruction Words (except interrupt vectors) 100 = Standard security; boot program Flash segment ends at 0x003FFE 000 = High security; boot program Flash segment ends at 0x003FFE BSS<2:0> FBS BSS<2:0> FBS Immediate dsPIC33FJ16MC304 Device Only Boot Segment Program Flash Code Protection Size X11 = No Boot program Flash segment Boot space is 768 Instruction Words (except interrupt vectors) 110 = Standard security; boot program Flash segment ends at 0x0007FE 010 = High security; boot program Flash segment ends at 0x0007FE Boot space is 3840 Instruction Words (except interrupt vectors) 101 = Standard security; boot program Flash segment, ends at 0x001FFE 001 = High security; boot program Flash segment ends at 0x001FFE Boot space is 5376 Instruction Words (except interrupt vectors) 100 = Standard security; boot program Flash segment ends at 0x002BFE 000 = High security; boot program Flash segment ends at 0x002BFE GSS<1:0> FGS Immediate General Segment Code-Protect bit 11 = User program memory is not code-protected 10 = Standard security 0x = High security Immediate General Segment Write-Protect bit 1 = User program memory is not write-protected 0 = User program memory is write-protected GWRP FGS IESO FOSCSEL Immediate Two-speed Oscillator Start-up Enable bit 1 = Start-up device with FRC, then automatically switch to the user-selected oscillator source when ready 0 = Start-up device with user-selected oscillator source FOSCSEL If clock switch is enabled, RTSP effect is on any device Reset; otherwise, Immediate Initial Oscillator Source Selection bits 111 = Internal Fast RC (FRC) oscillator with postscaler 110 = Internal Fast RC (FRC) oscillator with divide-by-16 101 = LPRC oscillator 100 = Secondary (LP) oscillator 011 = Primary (XT, HS, EC) oscillator with PLL 010 = Primary (XT, HS, EC) oscillator 001 = Internal Fast RC (FRC) oscillator with PLL 000 = FRC oscillator FNOSC<2:0> DS70283H-page 212 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 21-2: Bit Field FCKSM<1:0> dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED) Register FOSC RTSP Effect Description Immediate Clock Switching Mode bits 1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled Immediate Peripheral pin select configuration 1 = Allow only one reconfiguration 0 = Allow multiple reconfigurations Immediate OSC2 Pin Function bit (except in XT and HS modes) 1 = OSC2 is clock output 0 = OSC2 is general purpose digital I/O pin Immediate Primary Oscillator Mode Select bits 11 = Primary oscillator disabled 10 = HS Crystal Oscillator mode 01 = XT Crystal Oscillator mode 00 = EC (External Clock) mode Immediate Watchdog Timer Enable bit 1 = Watchdog Timer always enabled (LPRC oscillator cannot be disabled. Clearing the SWDTEN bit in the RCON register will have no effect.) 0 = Watchdog Timer enabled/disabled by user software (LPRC can be disabled by clearing the SWDTEN bit in the RCON register) Immediate Watchdog Timer Window Enable bit 1 = Watchdog Timer in Non-Window mode 0 = Watchdog Timer in Window mode Immediate Watchdog Timer Prescaler bit 1 = 1:128 0 = 1:32 Immediate Watchdog Timer Postscaler bits 1111 = 1:32,768 1110 = 1:16,384 * * * 0001 = 1:2 0000 = 1:1 Immediate Motor Control PWM Module Pin Mode bit 1 = PWM module pins controlled by PORT register at device Reset (tri-stated) 0 = PWM module pins controlled by PWM module at device Reset (configured as output pins) IOL1WAY FOSC OSCIOFNC FOSC POSCMD<1:0> FOSC FWDTEN FWDT WINDIS FWDT WDTPRE FWDT WDTPOST<3:0> FWDT PWMPIN FPOR (c) 2011 Microchip Technology Inc. DS70283H-page 213 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 21-2: Bit Field HPOL dsPIC33F CONFIGURATION BITS DESCRIPTION (CONTINUED) Register FPOR RTSP Effect Description Immediate Motor Control PWM High Side Polarity bit 1 = PWM module high side output pins have active-high output polarity 0 = PWM module high side output pins have active-low output polarity Immediate Motor Control PWM Low Side Polarity bit 1 = PWM module low side output pins have active-high output polarity 0 = PWM module low side output pins have active-low output polarity Immediate Power-on Reset Timer Value Select bits 111 = PWRT = 128 ms 110 = PWRT = 64 ms 101 = PWRT = 32 ms 100 = PWRT = 16 ms 011 = PWRT = 8 ms 010 = PWRT = 4 ms 001 = PWRT = 2 ms 000 = PWRT = Disabled Immediate Alternate I2CTM pins 1 = I2C mapped to SDA1/SCL1 pins 0 = I2C mapped to ASDA1/ASCL1 pins Immediate JTAG Enable bit 1 = JTAG enabled 0 = JTAG disabled Immediate ICD Communication Channel Select bits 11 = Communicate on PGEC1 and PGED1 10 = Communicate on PGEC2 and PGED2 01 = Communicate on PGEC3 and PGED3 00 = Reserved, do not use LPOL FPOR FPWRT<2:0> FPOR ALTI2C FPOR JTAGEN FICD ICS<1:0> FICD DS70283H-page 214 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 21.2 On-Chip Voltage Regulator 21.3 BOR: Brown-Out Reset The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices power their core digital logic at a nominal 2.5V. This can create a conflict for designs that are required to operate at a higher typical voltage, such as 3.3V. To simplify system design, all devices in the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The regulator provides power to the core from the other VDD pins. When the regulator is enabled, a low-ESR (less than 5 ohms) capacitor (such as tantalum or ceramic) must be connected to the VCAP pin (Figure 21-1). This helps to maintain the stability of the regulator. The recommended value for the filter capacitor is provided in Table 24-13 located in Section 24.1 "DC Characteristics". Note: It is important for low-ESR capacitors to be placed as close as possible to the VCAP pin. The Brown-out Reset (BOR) module is based on an internal voltage reference circuit that monitors the regulated supply voltage VCAP. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (for example, missing portions of the AC cycle waveform due to bad power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned on). A BOR generates a Reset pulse, which resets the device. The BOR selects the clock source, based on the device Configuration bit values (FNOSC<2:0> and POSCMD<1:0>). If an oscillator mode is selected, the BOR activates the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, the clock is held until the LOCK bit (OSCCON<5>) is `1'. Concurrently, the PWRT time-out (TPWRT) is applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, then a nominal delay of TFSCM = 100 is applied. The total delay in this case is TFSCM. The BOR Status bit (RCON<1>) is set to indicate that a BOR has occurred. The BOR circuit continues to operate while in Sleep or Idle modes and resets the device should VDD fall below the BOR threshold voltage. On a POR, it takes approximately 20 s for the on-chip voltage regulator to generate an output voltage. During this time, designated as TSTARTUP, code execution is disabled. TSTARTUP is applied every time the device resumes operation after any power-down. FIGURE 21-1: CONNECTIONS FOR THE ON-CHIP VOLTAGE REGULATOR(1) 3.3V dsPIC33F VDD VCAP CEFC 10 F VSS Note 1: 2: These are typical operating voltages. Refer to Table 24-13 located in Section 24.1 "DC Characteristics" for the full operating ranges of VDD and VCAP. It is important for low-ESR capacitors to be placed as close as possible to the VCAP pin. (c) 2011 Microchip Technology Inc. DS70283H-page 215 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 21.4 Watchdog Timer (WDT) 21.4.2 SLEEP AND IDLE MODES For dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices, the WDT is driven by the LPRC oscillator. When the WDT is enabled, the clock source is also enabled. If the WDT is enabled, it will continue to run during Sleep or Idle modes. When the WDT time-out occurs, the device will wake the device and code execution will continue from where the PWRSAV instruction was executed. The corresponding SLEEP or IDLE bits (RCON<3,2>) will need to be cleared in software after the device wakes up. 21.4.1 PRESCALER/POSTSCALER The nominal WDT clock source from LPRC is 32 kHz. This feeds a prescaler than can be configured for either 5-bit (divide-by-32) or 7-bit (divide-by-128) operation. The prescaler is set by the WDTPRE Configuration bit. With a 32 kHz input, the prescaler yields a nominal WDT time-out period (TWDT) of 1 ms in 5-bit mode, or 4 ms in 7-bit mode. A variable postscaler divides down the WDT prescaler output and allows for a wide range of time-out periods. The postscaler is controlled by the WDTPOST<3:0> Configuration bits (FWDT<3:0>), which allow the selection of 16 settings, from 1:1 to 1:32,768. Using the prescaler and postscaler, time-out periods ranging from 1 ms to 131 seconds can be achieved. The WDT, prescaler and postscaler are reset: * On any device Reset * On the completion of a clock switch, whether invoked by software (i.e., setting the OSWEN bit after changing the NOSC bits) or by hardware (i.e., Fail-Safe Clock Monitor) * When a PWRSAV instruction is executed (i.e., Sleep or Idle mode is entered) * When the device exits Sleep or Idle mode to resume normal operation * By a CLRWDT instruction during normal execution Note: The CLRWDT and PWRSAV instructions clear the prescaler and postscaler counts when executed. 21.4.3 ENABLING WDT The WDT is enabled or disabled by the FWDTEN Configuration bit in the FWDT Configuration register. When the FWDTEN Configuration bit is set, the WDT is always enabled. The WDT can be optionally controlled in software when the FWDTEN Configuration bit has been programmed to `0'. The WDT is enabled in software by setting the SWDTEN control bit (RCON<5>). The SWDTEN control bit is cleared on any device Reset. The software WDT option allows the user application to enable the WDT for critical code segments and disable the WDT during non-critical segments for maximum power savings. Note: If the WINDIS bit (FWDT<6>) is cleared, the CLRWDT instruction should be executed by the application software only during the last 1/4 of the WDT period. This CLRWDT window can be determined by using a timer. If a CLRWDT instruction is executed before this window, a WDT Reset occurs. The WDT flag bit, WDTO (RCON<4>), is not automatically cleared following a WDT time-out. To detect subsequent WDT events, the flag must be cleared in software. FIGURE 21-2: WDT BLOCK DIAGRAM All Device Resets Transition to New Clock Source Exit Sleep or Idle Mode PWRSAV Instruction CLRWDT Instruction Watchdog Timer Sleep/Idle WDTPRE WDTPOST<3:0> WDT Wake-up RS Prescaler (divide by N1) RS 1 WDT Reset Postscaler (divide by N2) 0 SWDTEN FWDTEN LPRC Clock WINDIS WDT Window Select CLRWDT Instruction DS70283H-page 216 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 21.5 JTAG Interface 21.7 In-Circuit Debugger dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices implement a JTAG interface, which supports boundary scan device testing, as well as in-circuit programming. Detailed information on this interface will be provided in future revisions of the document. When MPLAB(R) ICD 2 is selected as a debugger, the in-circuit debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. Debugging functionality is controlled through the PGECx (Emulation/Debug Clock) and PGEDx (Emulation/Debug Data) pin functions. Any of the three pairs of debugging clock/data pins can be used: * PGEC1 and PGED1 * PGEC2 and PGED2 * PGEC3 and PGED3 To use the in-circuit debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, and the PGECx/PGEDx pin pair. In addition, when the feature is enabled, some of the resources are not available for general use. These resources include the first 80 bytes of data RAM and two I/O pins. 21.6 In-Circuit Serial Programming dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family digital signal controllers can be serially programmed while in the end application circuit. This is done with two lines for clock and data and three other lines for power, ground and the programming sequence. Serial programming allows customers to manufacture boards with unprogrammed devices and then program the digital signal controller just before shipping the product. Serial programming also allows the most recent firmware or a custom firmware to be programmed. Refer to the "dsPIC33F/PIC24H Flash Programming Specification" (DS70152) document for details about In-Circuit Serial Programming (ICSP). Any of the three pairs of programming clock/data pins can be used: * PGEC1 and PGED1 * PGEC2 and PGED2 * PGEC3 and PGED3 (c) 2011 Microchip Technology Inc. DS70283H-page 217 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 21.8 Code Protection and CodeGuardTM Security When coupled with software encryption libraries, CodeGuardTM Security can be used to securely update Flash even when multiple IPs reside on the single chip. The code protection features are controlled by the Configuration registers: FBS and FGS. Secure segment and RAM protection is not implemented in dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. Note: Refer to Section 23. "CodeGuardTM Security" (DS70199) in the "dsPIC33F/PIC24H Family Reference Manual" for further information on usage, configuration and operation of CodeGuard Security. The dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices offer the intermediate implementation of CodeGuardTM Security. CodeGuard Security enables multiple parties to securely share resources (memory, interrupts and peripherals) on a single chip. This feature helps protect individual Intellectual Property in collaborative system designs. TABLE 21-3: CODE FLASH SECURITY SEGMENT SIZES FOR 32 KBYTE DEVICES VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 003FFEh 004000h 0057FEh TABLE 21-4: CODE FLASH SECURITY SEGMENT SIZES FOR 16 KBYTE DEVICES VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 002BFEh VS = 256 IW 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h CONFIG BITS CONFIG BITS BSS<2:0> = x11 0K GS = 11008 IW BSS<2:0> = x11 0K GS = 5376 IW VS = 256 IW BSS<2:0> = x10 256 GS = 10240 IW VS = 256 IW BSS<2:0> = x01 768 GS = 7168 IW VS = 256 IW BSS<2:0> = x00 1792 GS = 3072 IW BS = 7936 IW BS = 3840 IW BS = 768 IW BSS<2:0> = x10 256 BS = 768 IW GS = 4608 IW VS = 256 IW BSS<2:0> = x01 768 GS = 1536 IW VS = 256 IW BSS<2:0> = x00 1792 BS = 5376 IW BS = 3840 IW 002BFEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 002BFEh 000000h 0001FEh 000200h 0007FEh 000800h 001FFEh 002000h 002BFEh DS70283H-page 218 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 22.0 Note: INSTRUCTION SET SUMMARY This data sheet summarizes the features of the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site (www.microchip.com) for the latest dsPIC33F/PIC24H Family Reference Manual sections. Most bit-oriented instructions (including rotate/shift instructions) have two operands: simple * The W register (with or without an address modifier) or file register (specified by the value of `Ws' or `f') * The bit in the W register or file register (specified by a literal value or indirectly by the contents of register `Wb') The literal instructions that involve data movement can use some of the following operands: * A literal value to be loaded into a W register or file register (specified by `k') * The W register or file register where the literal value is to be loaded (specified by `Wb' or `f') However, literal instructions that involve arithmetic or logical operations use some of the following operands: * The first source operand, which is a register `Wb' without any address modifier * The second source operand, which is a literal value * The destination of the result (only if not the same as the first source operand), which is typically a register `Wd' with or without an address modifier The MAC class of DSP instructions can use some of the following operands: * The accumulator (A or B) to be used (required operand) * The W registers to be used as the two operands * The X and Y address space prefetch operations * The X and Y address space prefetch destinations * The accumulator write-back destination The other DSP instructions do not involve any multiplication and can include: * The accumulator to be used (required) * The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier * The amount of shift specified by a W register `Wn' or a literal value The control instructions can use some of the following operands: * A program memory address * The mode of the table read and table write instructions The dsPIC33F instruction set is identical to that of the dsPIC30F. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single-word instruction is a 24-bit word, divided into an 8-bit opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: * * * * * Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations Table 22-1 shows the general symbols used in describing the instructions. The dsPIC33F instruction set summary in Table 22-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: * The first source operand, which is typically a register `Wb' without any address modifier * The second source operand, which is typically a register `Ws' with or without an address modifier * The destination of the result, which is typically a register `Wd' with or without an address modifier However, word or byte-oriented file register instructions have two operands: * The file register specified by the value `f' * The destination, which could be either the file register `f' or the W0 register, which is denoted as `WREG' (c) 2011 Microchip Technology Inc. DS70283H-page 219 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Most instructions are a single word. Certain double-word instructions are designed to provide all the required information in these 48 bits. In the second word, the 8 MSbs are `0's. If this second word is executed as an instruction (by itself), it will execute as a NOP. The double-word instructions execute in two instruction cycles. Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table reads and writes and RETURN/RETFIE instructions, which are single-word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or two-word instruction. Moreover, double-word moves require two cycles. Note: For more details on the instruction set, refer to the "16-bit MCU and DSC Programmer's Reference Manual" (DS70157). TABLE 22-1: Field #text (text) [text] {} SYMBOLS USED IN OPCODE DESCRIPTIONS Description Means literal defined by "text" Means "content of text" Means "the location addressed by text" Optional field or operation Register bit field Byte mode selection Double-Word mode selection Shadow register select Word mode selection (default) One of two accumulators {A, B} Accumulator write back destination address register {W13, [W13]+ = 2} 4-bit bit selection field (used in word addressed instructions) {0...15} MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Absolute address, label or expression (resolved by the linker) File register address {0x0000...0x1FFF} 1-bit unsigned literal {0,1} 4-bit unsigned literal {0...15} 5-bit unsigned literal {0...31} 8-bit unsigned literal {0...255} 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode 14-bit unsigned literal {0...16384} 16-bit unsigned literal {0...65535} 23-bit unsigned literal {0...8388608}; LSb must be `0' Field does not require an entry, can be blank DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate Program Counter 10-bit signed literal {-512...511} 16-bit signed literal {-32768...32767} 6-bit signed literal {-16...16} Base W register {W0..W15} Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Destination W register { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Dividend, Divisor working register pair (direct addressing) DS70283H-page 220 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 22-1: Field Wm*Wm Wm*Wn Wn Wnd Wns WREG Ws Wso Wx SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Description Multiplicand and Multiplier working register pair for Square instructions {W4 * W4,W5 * W5,W6 * W6,W7 * W7} Multiplicand and Multiplier working register pair for DSP instructions {W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7} One of 16 working registers {W0..W15} One of 16 destination working registers {W0...W15} One of 16 source working registers {W0...W15} W0 (working register used in file register instructions) Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Source W register { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } X data space prefetch address register for DSP instructions {[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2, [W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2, [W9 + W12], none} X data space prefetch destination register for DSP instructions {W4...W7} Y data space prefetch address register for DSP instructions {[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2, [W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2, [W11 + W12], none} Y data space prefetch destination register for DSP instructions {W4...W7} Wxd Wy Wyd (c) 2011 Microchip Technology Inc. DS70283H-page 221 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 22-2: Base Instr # 1 Assembly Mnemonic ADD ADD ADD ADD ADD ADD ADD ADD 2 ADDC ADDC ADDC ADDC ADDC ADDC 3 AND AND AND AND AND AND 4 ASR ASR ASR ASR ASR ASR 5 BCLR BCLR BCLR 6 BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA BRA 7 BSET BSET BSET 8 BSW BSW.C BSW.Z INSTRUCTION SET OVERVIEW Assembly Syntax Acc f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd Wso,#Slit4,Acc f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG Ws,Wd Wb,Wns,Wnd Wb,#lit5,Wnd f,#bit4 Ws,#bit4 C,Expr GE,Expr GEU,Expr GT,Expr GTU,Expr LE,Expr LEU,Expr LT,Expr LTU,Expr N,Expr NC,Expr NN,Expr NOV,Expr NZ,Expr OA,Expr OB,Expr OV,Expr SA,Expr SB,Expr Expr Z,Expr Wn f,#bit4 Ws,#bit4 Ws,Wb Ws,Wb Description Add Accumulators f = f + WREG WREG = f + WREG Wd = lit10 + Wd Wd = Wb + Ws Wd = Wb + lit5 16-bit Signed Add to Accumulator f = f + WREG + (C) WREG = f + WREG + (C) Wd = lit10 + Wd + (C) Wd = Wb + Ws + (C) Wd = Wb + lit5 + (C) f = f .AND. WREG WREG = f .AND. WREG Wd = lit10 .AND. Wd Wd = Wb .AND. Ws Wd = Wb .AND. lit5 f = Arithmetic Right Shift f WREG = Arithmetic Right Shift f Wd = Arithmetic Right Shift Ws Wnd = Arithmetic Right Shift Wb by Wns Wnd = Arithmetic Right Shift Wb by lit5 Bit Clear f Bit Clear Ws Branch if Carry Branch if greater than or equal Branch if unsigned greater than or equal Branch if greater than Branch if unsigned greater than Branch if less than or equal Branch if unsigned less than or equal Branch if less than Branch if unsigned less than Branch if Negative Branch if Not Carry Branch if Not Negative Branch if Not Overflow Branch if Not Zero Branch if Accumulator A overflow Branch if Accumulator B overflow Branch if Overflow Branch if Accumulator A saturated Branch if Accumulator B saturated Branch Unconditionally Branch if Zero Computed Branch Bit Set f Bit Set Ws Write C bit to Ws DS70283H-page 222 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 22-2: Base Instr # 9 Assembly Mnemonic BTG BTG BTG 10 BTSC BTSC BTSC 11 BTSS BTSS BTSS 12 BTST BTST BTST.C BTST.Z BTST.C BTST.Z 13 BTSTS BTSTS BTSTS.C BTSTS.Z 14 CALL CALL CALL 15 CLR CLR CLR CLR CLR 16 17 CLRWDT COM CLRWDT COM COM COM 18 CP CP CP CP 19 CP0 CP0 CP0 20 CPB CPB CPB CPB 21 22 23 24 25 26 CPSEQ CPSGT CPSLT CPSNE DAW DEC CPSEQ CPSGT CPSLT CPSNE DAW DEC DEC DEC 27 DEC2 DEC2 DEC2 DEC2 28 DISI DISI f f,WREG Ws,Wd f Wb,#lit5 Wb,Ws f Ws f Wb,#lit5 Wb,Ws Wb, Wn Wb, Wn Wb, Wn Wb, Wn Wn f f,WREG Ws,Wd f f,WREG Ws,Wd #lit14 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax f,#bit4 Ws,#bit4 f,#bit4 Ws,#bit4 f,#bit4 Ws,#bit4 f,#bit4 Ws,#bit4 Ws,#bit4 Ws,Wb Ws,Wb f,#bit4 Ws,#bit4 Ws,#bit4 lit23 Wn f WREG Ws Acc,Wx,Wxd,Wy,Wyd,AWB Bit Toggle f Bit Toggle Ws Bit Test f, Skip if Clear Bit Test Ws, Skip if Clear Bit Test f, Skip if Set Bit Test Ws, Skip if Set Bit Test f Bit Test Ws to C Bit Test Ws to Z Bit Test Ws (c) 2011 Microchip Technology Inc. DS70283H-page 223 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 22-2: Base Instr # 29 Assembly Mnemonic DIV DIV.S DIV.SD DIV.U DIV.UD 30 31 DIVF DO DIVF DO DO 32 33 34 35 36 37 38 ED EDAC EXCH FBCL FF1L FF1R GOTO ED EDAC EXCH FBCL FF1L FF1R GOTO GOTO 39 INC INC INC INC 40 INC2 INC2 INC2 INC2 41 IOR IOR IOR IOR IOR IOR 42 43 44 LAC LNK LSR LAC LNK LSR LSR LSR LSR LSR 45 MAC MAC INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax Wm,Wn Wm,Wn Wm,Wn Wm,Wn Wm,Wn #lit14,Expr Wn,Expr Wm*Wm,Acc,Wx,Wy,Wxd Wm*Wm,Acc,Wx,Wy,Wxd Wns,Wnd Ws,Wnd Ws,Wnd Ws,Wnd Expr Wn f f,WREG Ws,Wd f f,WREG Ws,Wd f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd Wso,#Slit4,Acc #lit14 f f,WREG Ws,Wd Wb,Wns,Wnd Wb,#lit5,Wnd Wm*Wn,Acc,Wx,Wxd,Wy,Wyd , AWB Wm*Wm,Acc,Wx,Wxd,Wy,Wyd f,Wn f f,WREG #lit16,Wn #lit8,Wn Wn,f Wso,Wdo WREG,f Wns,Wd Ws,Wnd Acc,Wx,Wxd,Wy,Wyd,AWB Description Signed 16/16-bit Integer Divide Signed 32/16-bit Integer Divide Unsigned 16/16-bit Integer Divide Unsigned 32/16-bit Integer Divide Signed 16/16-bit Fractional Divide Do code to PC + Expr, lit14 + 1 times Do code to PC + Expr, (Wn) + 1 times Euclidean Distance (no accumulate) Euclidean Distance Swap Wns with Wnd Find Bit Change from Left (MSb) Side Find First One from Left (MSb) Side Find First One from Right (LSb) Side Go to address Go to indirect f=f+1 WREG = f + 1 Wd = Ws + 1 f=f+2 WREG = f + 2 Wd = Ws + 2 f = f .IOR. WREG WREG = f .IOR. WREG Wd = lit10 .IOR. Wd Wd = Wb .IOR. Ws Wd = Wb .IOR. lit5 Load Accumulator Link Frame Pointer f = Logical Right Shift f WREG = Logical Right Shift f Wd = Logical Right Shift Ws Wnd = Logical Right Shift Wb by Wns Wnd = Logical Right Shift Wb by lit5 Multiply and Accumulate # of # of Words Cycles 1 1 1 1 1 2 2 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 18 18 18 18 18 2 2 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Status Flags Affected N,Z,C,OV N,Z,C,OV N,Z,C,OV N,Z,C,OV N,Z,C,OV None None OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB None C C C None None C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z N,Z N,Z N,Z N,Z N,Z OA,OB,OAB, SA,SB,SAB None C,N,OV,Z C,N,OV,Z C,N,OV,Z N,Z N,Z OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB None N,Z None None None None None None None None None MAC 46 MOV MOV MOV MOV MOV MOV.b MOV MOV MOV MOV.D MOV.D 47 MOVSAC MOVSAC Square and Accumulate Move f to Wn Move f to f Move f to WREG Move 16-bit literal to Wn Move 8-bit literal to Wn Move Wn to f Move Ws to Wd Move WREG to f Move Double from W(ns):W(ns + 1) to Wd Move Double from Ws to W(nd + 1):W(nd) Prefetch and store accumulator 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 1 DS70283H-page 224 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 22-2: Base Instr # 48 Assembly Mnemonic MPY INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Description Multiply Wm by Wn to Accumulator Square Wm to Accumulator -(Multiply Wm by Wn) to Accumulator Multiply and Subtract from Accumulator # of # of Words Cycles 1 1 1 1 1 1 1 1 Status Flags Affected OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB None OA,OB,OAB, SA,SB,SAB None None None None None None None OA,OB,OAB, SA,SB,SAB C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z None None None None None All None None None None WDTO,Sleep None None None None None None None None C,N,Z C,N,Z C,N,Z N,Z N,Z N,Z C,N,Z C,N,Z C,N,Z 49 50 MPY.N MSC MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd , AWB Wb,Ws,Wnd Wb,Ws,Wnd Wb,Ws,Wnd Wb,Ws,Wnd Wb,#lit5,Wnd Wb,#lit5,Wnd f Acc f f,WREG Ws,Wd 51 MUL MUL.SS MUL.SU MUL.US MUL.UU MUL.SU MUL.UU MUL {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(Ws) {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(lit5) W3:W2 = f * WREG Negate Accumulator f=f+1 WREG = f + 1 Wd = Ws + 1 No Operation No Operation 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 2 1 1 2 2 1 1 1 3 (2) 3 (2) 3 (2) 1 1 1 1 1 1 1 1 1 52 NEG NEG NEG NEG NEG 53 NOP NOP NOPR 54 POP POP POP POP.D POP.S f Wdo Wnd Pop f from Top-of-Stack (TOS) Pop from Top-of-Stack (TOS) to Wdo Pop from Top-of-Stack (TOS) to W(nd):W(nd + 1) Pop Shadow Registers 55 PUSH PUSH PUSH PUSH.D PUSH.S f Wso Wns Push f to Top-of-Stack (TOS) Push Wso to Top-of-Stack (TOS) Push W(ns):W(ns + 1) to Top-of-Stack (TOS) Push Shadow Registers #lit1 Go into Sleep or Idle mode Relative Call Computed Call Repeat Next Instruction lit14 + 1 times Repeat Next Instruction (Wn) + 1 times Software device Reset Return from interrupt 56 57 PWRSAV RCALL PWRSAV RCALL RCALL Expr Wn #lit14 Wn 58 REPEAT REPEAT REPEAT 59 60 61 62 63 RESET RETFIE RETLW RETURN RLC RESET RETFIE RETLW RETURN RLC RLC RLC f f,WREG Ws,Wd f f,WREG Ws,Wd f f,WREG Ws,Wd #lit10,Wn Return with literal in Wn Return from Subroutine f = Rotate Left through Carry f WREG = Rotate Left through Carry f Wd = Rotate Left through Carry Ws f = Rotate Left (No Carry) f WREG = Rotate Left (No Carry) f Wd = Rotate Left (No Carry) Ws f = Rotate Right through Carry f WREG = Rotate Right through Carry f Wd = Rotate Right through Carry Ws 64 RLNC RLNC RLNC RLNC 65 RRC RRC RRC RRC (c) 2011 Microchip Technology Inc. DS70283H-page 225 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 22-2: Base Instr # 66 Assembly Mnemonic RRNC RRNC RRNC RRNC 67 SAC SAC SAC.R 68 69 SE SETM SE SETM SETM SETM 70 SFTAC SFTAC SFTAC 71 SL SL SL SL SL SL 72 SUB SUB SUB SUB SUB SUB SUB 73 SUBB SUBB SUBB SUBB SUBB SUBB 74 SUBR SUBR SUBR SUBR SUBR 75 SUBBR SUBBR SUBBR SUBBR SUBBR 76 SWAP SWAP.b SWAP 77 78 79 80 81 82 TBLRDH TBLRDL TBLWTH TBLWTL ULNK XOR TBLRDH TBLRDL TBLWTH TBLWTL ULNK XOR XOR XOR XOR XOR 83 ZE ZE f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd Ws,Wnd INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax f f,WREG Ws,Wd Acc,#Slit4,Wdo Acc,#Slit4,Wdo Ws,Wnd f WREG Ws Acc,Wn Acc,#Slit6 f f,WREG Ws,Wd Wb,Wns,Wnd Wb,#lit5,Wnd Acc f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG #lit10,Wn Wb,Ws,Wd Wb,#lit5,Wd f f,WREG Wb,Ws,Wd Wb,#lit5,Wd f f,WREG Wb,Ws,Wd Wb,#lit5,Wd Wn Wn Ws,Wd Ws,Wd Ws,Wd Ws,Wd Description f = Rotate Right (No Carry) f WREG = Rotate Right (No Carry) f Wd = Rotate Right (No Carry) Ws Store Accumulator Store Rounded Accumulator Wnd = sign-extended Ws f = 0xFFFF WREG = 0xFFFF Ws = 0xFFFF Arithmetic Shift Accumulator by (Wn) Arithmetic Shift Accumulator by Slit6 f = Left Shift f WREG = Left Shift f Wd = Left Shift Ws Wnd = Left Shift Wb by Wns Wnd = Left Shift Wb by lit5 Subtract Accumulators f = f - WREG WREG = f - WREG Wn = Wn - lit10 Wd = Wb - Ws Wd = Wb - lit5 f = f - WREG - (C) WREG = f - WREG - (C) Wn = Wn - lit10 - (C) Wd = Wb - Ws - (C) Wd = Wb - lit5 - (C) f = WREG - f WREG = WREG - f Wd = Ws - Wb Wd = lit5 - Wb f = WREG - f - (C) WREG = WREG - f - (C) Wd = Ws - Wb - (C) Wd = lit5 - Wb - (C) Wn = nibble swap Wn Wn = byte swap Wn Read Prog<23:16> to Wd<7:0> Read Prog<15:0> to Wd Write Ws<7:0> to Prog<23:16> Write Ws to Prog<15:0> Unlink Frame Pointer f = f .XOR. WREG WREG = f .XOR. WREG Wd = lit10 .XOR. Wd Wd = Wb .XOR. Ws Wd = Wb .XOR. lit5 Wnd = Zero-extend Ws # of # of Words Cycles 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 1 1 1 1 1 1 1 Status Flags Affected N,Z N,Z N,Z None None C,N,Z None None None OA,OB,OAB, SA,SB,SAB OA,OB,OAB, SA,SB,SAB C,N,OV,Z C,N,OV,Z C,N,OV,Z N,Z N,Z OA,OB,OAB, SA,SB,SAB C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z C,DC,N,OV,Z None None None None None None None N,Z N,Z N,Z N,Z N,Z C,Z,N DS70283H-page 226 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 23.0 DEVELOPMENT SUPPORT 23.1 The PIC(R) microcontrollers and dsPIC(R) digital signal controllers are supported with a full range of software and hardware development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families * Simulators - MPLAB SIM Software Simulator * Emulators - MPLAB REAL ICETM In-Circuit Emulator * In-Circuit Debuggers - MPLAB ICD 3 - PICkitTM 3 Debug Express * Device Programmers - PICkitTM 2 Programmer - MPLAB PM3 Device Programmer * Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows(R) operating system-based application that contains: * A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) * A full-featured editor with color-coded context * A multiple project manager * Customizable data windows with direct edit of contents * High-level source code debugging * Mouse over variable inspection * Drag and drop variables from source to watch windows * Extensive on-line help * Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: * Edit your source files (either C or assembly) * One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) * Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. (c) 2011 Microchip Technology Inc. DS70283H-page 227 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 23.2 MPLAB C Compilers for Various Device Families 23.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip's PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 23.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip's PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 23.6 MPLAB Assembler, Linker and Librarian for Various Device Families 23.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: * Integration into MPLAB IDE projects * User-defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility DS70283H-page 228 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 23.7 MPLAB SIM Software Simulator 23.9 The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC(R) DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC(R) Flash microcontrollers and dsPIC(R) DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 23.8 MPLAB REAL ICE In-Circuit Emulator System 23.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC(R) and dsPIC(R) Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial ProgrammingTM. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. MPLAB REAL ICE In-Circuit Emulator System is Microchip's next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC(R) Flash MCUs and dsPIC(R) Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. (c) 2011 Microchip Technology Inc. DS70283H-page 229 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 23.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express The PICkitTM 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip's Flash families of microcontrollers. The full featured Windows(R) programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip's powerful MPLAB Integrated Development Environment (IDE) the PICkitTM 2 enables in-circuit debugging on most PIC(R) microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user's guide, lessons, tutorial, compiler and MPLAB IDE software. 23.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEMTM and dsPICDEMTM demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ(R) security ICs, CAN, IrDA(R), PowerSmart battery management, SEEVAL(R) evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. 23.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSPTM cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS70283H-page 230 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 24.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(1) Ambient temperature under bias.............................................................................................................-40C to +125C Storage temperature .............................................................................................................................. -65C to +160C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant with respect to VSS(4) .................................................... -0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to Vss when VDD 3.0V(4) .................................................... -0.3V to +5.6V Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(4)..................................................... -0.3V to 3.6V Voltage on VCAP with respect to VSS ...................................................................................................... 2.25V to 2.75V Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin(2) ...........................................................................................................................250 mA Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA Maximum output current sourced by any I/O pin(3) ...................................................................................................4 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports(2) ...............................................................................................................200 mA Note 1: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 24-2). 3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx and PGEDx pins, which are able to sink/source 12 mA. 4: Refer to the "Pin Diagrams" section for 5V tolerant pins. (c) 2011 Microchip Technology Inc. DS70283H-page 231 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 24.1 DC Characteristics OPERATING MIPS VS. VOLTAGE Max MIPS Characteristic VDD Range (in Volts) 3.0-3.6V DC5 3.0-3.6V Temp Range (in C) -40C to +85C -40C to +125C dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 40 40 TABLE 24-1: TABLE 24-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit Industrial Temperature Devices Operating Junction Temperature Range Operating Ambient Temperature Range Extended Temperature Devices Operating Junction Temperature Range Operating Ambient Temperature Range Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD - IOH) I/O Pin Power Dissipation: I/O = ({VDD - VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ - TA)/JA W TJ TA -40 -40 -- -- +140 +125 C C TJ TA -40 -40 -- -- +125 +85 C C PD PINT + PI/O W TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol Typ 32 45 45 50 71 35 Max -- -- -- -- -- -- Unit C/W C/W C/W C/W C/W C/W Notes 1 1 1 1 1 1 Package Thermal Resistance, 44-pin QFN Package Thermal Resistance, 44-pin TFQP Package Thermal Resistance, 28-pin SPDIP Package Thermal Resistance, 28-pin SOIC Package Thermal Resistance, 28-pin SSOP Package Thermal Resistance, 28-pin QFN-S Note 1: JA JA JA JA JA JA Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations. DS70283H-page 232 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. Operating Voltage DC10 DC12 DC16 Supply Voltage VDD VDR VPOR -- RAM Data Retention Voltage VDD Start Voltage to ensure internal Power-on Reset signal VDD Rise Rate to ensure internal Power-on Reset signal VDD Core(3) Internal regulator voltage (2) 3.0 1.8 -- -- -- -- 3.6 -- VSS V V V Industrial and Extended -- -- DC17 SVDD 0.03 -- -- V/ms 0-3.0V in 0.1s DC18 VCORE 2.25 -- 2.75 V Voltage is dependent on load, temperature and VDD Note 1: 2: 3: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. This is the limit to which VDD may be lowered without losing RAM data. These parameters are characterized but not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 233 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Max Units Conditions DC CHARACTERISTICS Parameter No. Typical(1) Operating Current (IDD)(2) DC20d DC20a DC20b DC20c DC21d DC21a DC21b DC21c DC22d DC22a DC22b DC22c DC23d DC23a DC23b DC23c DC24d DC24a DC24b DC24c Note 1: 2: 20 19 19 19 28 27 27 27 33 33 33 33 44 43 42 41 55 54 52 51 30 22 25 30 40 30 32 36 50 40 40 50 60 50 55 65 75 65 70 80 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA -40C +25C +85C +125C -40C +25C +85C +125C -40C +25C +85C +125C -40C +25C +85C +125C -40C +25C +85C +125C 3.3V 40 MIPS 3.3V 30 MIPS(3) 3.3V 20 MIPS(3) 3.3V 16 MIPS(3) 3.3V 10 MIPS(3) 3: Data in "Typical" column is at 3.3V, 25C unless otherwise stated. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VSS. MCLR = VDD, WDT and FSCM are disabled. CPU, SRAM, program memory and data memory are operational. No peripheral modules are operating; however, every peripheral is being clocked (PMD bits are all zeroed). These parameters are characterized, but are not tested in manufacturing. DS70283H-page 234 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Max Units Conditions DC CHARACTERISTICS Parameter No. Typical(1) Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC40d DC40a DC40b DC40c DC41d DC41a DC41b DC41c DC42d DC42a DC42b DC42c DC43d DC43a DC43b DC43c DC44d DC44a DC44b DC44c Note 1: 2: 3: 7 6 6 6 10 8 8 8 11 10 10 10 14 13 13 13 14 17 17 18 20 7 10 20 20 9 10 20 20 10 12 20 25 14 15 25 25 20 20 30 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA -40C +25C +85C +125C -40C +25C +85C +125C -40C +25C +85C +125C -40C +25C +85C +125C -40C +25C +85C +125C 3.3V 40 MIPS 3.3V 30 MIPS 3.3V 20 MIPS 3.3V 16 MIPS 3.3V 10 MIPS Data in "Typical" column is at 3.3V, 25C unless otherwise stated. Base IIDLE current is measured with core off, clock on and all modules turned off. Peripheral Module Disable SFR registers are zeroed. All I/O pins are configured as inputs and pulled to VSS. These parameters are characterized, but are not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 235 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Max Units Conditions DC CHARACTERISTICS Parameter No. Typical(1) Power-Down Current (IPD)(2) DC60d DC60a DC60b DC60c DC61d DC61a DC61b DC61c Note 1: 2: 3: 4: 5: 55 63 85 146 8 2 2 3 500 300 350 600 15 3 2 5 A A A A A A A A -40C +25C +85C +125C -40C +25C +85C +125C 3.3V Watchdog Timer Current: IWDT(3,5) 3.3V Base Power-Down Current(3,4) Data in the Typical column is at 3.3V, 25C unless otherwise stated. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1. The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. These currents are measured on the device containing the most memory in this family. These parameters are characterized, but are not tested in manufacturing. TABLE 24-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Max 51 28 24 46 20 20 46 25 20 55 30 25 Doze Ratio 1:2 1:64 1:128 1:2 1:64 1:128 1:2 1:64 1:128 1:2 1:64 1:128 Units mA mA mA mA mA mA mA mA mA mA mA mA +125C 3.3V 40 MIPS +85C 3.3V 40 MIPS +25C 3.3V 40 MIPS -40C 3.3V 40 MIPS Conditions DC CHARACTERISTICS Parameter No. DC73a DC73f DC73g DC70a DC70f DC70g DC71a DC71f DC71g DC72a DC72f DC72g Note 1: 2: Typical(1,2) 41 20 19 40 18 18 40 18 18 39 18 18 Data in the Typical column is at 3.3V, 25C unless otherwise stated. Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing. DS70283H-page 236 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Input Low Voltage I/O pins MCLR I/O Pins with OSC1 or SOSCI SDAx, SCLx SDAx, SCLx VIH DI20 DI28 DI29 ICNPU DI30 Note 1: 2: Input High Voltage I/O Pins Not 5V Tolerant(4) I/O Pins 5V Tolerant(4) SDAx, SCLx SDAx, SCLx CNx Pull-up Current 50 250 400 A VDD = 3.3V, VPIN = VSS 0.7 VDD 0.7 VDD 0.7 VDD 2.1 -- -- -- -- VDD 5.5 5.5 5.5 V V V V SMbus disabled SMbus enabled VSS VSS VSS VSS VSS -- -- -- -- -- 0.2 VDD 0.2 VDD 0.2 VDD 0.3 VDD 0.8 V V V V V V SMbus disabled SMbus enabled Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. VIL DI10 DI15 DI16 DI18 DI19 3: 4: 5: 6: 7: 8: 9: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. See "Pin Diagrams" for a list of digital-only and analog pins. VIL source < (VSS - 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. Digital 5V tolerant pins cannot tolerate any "positive" input injection current from input sources > 5.5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical "absolute instantaneous" sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. (c) 2011 Microchip Technology Inc. DS70283H-page 237 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Input Leakage Current(2,3) I/O Pins 5V Tolerant(4) I/O Pins Not 5V Tolerant(4) -- -- -- -- 2 1 A A VSS VPIN VDD, Pin at high-impedance VSS VPIN VDD, Pin at high-impedance, -40C TA +85C Shared with external reference pins, -40C TA +85C VSS VPIN VDD, Pin at high-impedance, -40C TA +125C Analog pins shared with external reference pins, -40C TA +125C VSS VPIN VDD VSS VPIN VDD, XT and HS modes Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. IIL DI50 DI51 DI51a I/O Pins Not 5V Tolerant(4) -- -- 2 A DI51b I/O Pins Not 5V Tolerant(4) -- -- 3.5 A DI51c I/O Pins Not 5V Tolerant(4) -- -- 8 A DI55 DI56 Note 1: 2: MCLR OSC1 -- -- -- -- 2 2 A A 3: 4: 5: 6: 7: 8: 9: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. See "Pin Diagrams" for a list of digital-only and analog pins. VIL source < (VSS - 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. Digital 5V tolerant pins cannot tolerate any "positive" input injection current from input sources > 5.5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical "absolute instantaneous" sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. DS70283H-page 238 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Input Low Injection Current 0 -- -5(5,8) mA All pins except VDD, VSS, AVDD, AVSS, MCLR, VCAP, SOSCI, SOSCO, and RB14 Min Typ(1) Max Units Conditions DC CHARACTERISTICS Param Symbol No. IICL DI60a IICH DI60b Input High Injection Current 0 -- +5(6,7,8) mA All pins except VDD, VSS, AVDD, AVSS, MCLR, VCAP, SOSCI, SOSCO, RB14, and digital 5V-tolerant designated pins Absolute instantaneous sum of all input injection currents from all I/O pins IICT ( | IICL + | IICH | ) IICT DI60c Total Input Injection Current (sum of all I/O and control pins) -20(9) -- +20(9) mA Note 1: 2: 3: 4: 5: 6: 7: 8: 9: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. See "Pin Diagrams" for a list of digital-only and analog pins. VIL source < (VSS - 0.3). Characterized but not tested. Non-5V tolerant pins VIH source > (VDD + 0.3), 5V tolerant pins VIH source > 5.5V. Characterized but not tested. Digital 5V tolerant pins cannot tolerate any "positive" input injection current from input sources > 5.5V. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. Any number and/or combination of I/O pins not excluded under IICL or IICH conditions are permitted provided the mathematical "absolute instantaneous" sum of the input injection currents from all pins do not exceed the specified limit. Characterized but not tested. (c) 2011 Microchip Technology Inc. DS70283H-page 239 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Output Low Voltage I/O ports OSC2/CLKO VOH DO20 DO26 Output High Voltage I/O ports OSC2/CLKO 2.40 2.41 -- -- -- -- V V IOH = -2.3 mA, VDD = 3.3V IOH = -1.3 mA, VDD = 3.3V -- -- -- -- 0.4 0.4 V V IOL = 2 mA, VDD = 3.3V IOL = 2 mA, VDD = 3.3V Min Typ Max Units Conditions Param Symbol No. VOL DO10 DO16 TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) BOR Event on VDD transition high-to-low BOR event is tied to VDD core voltage decrease Min 2.40 Typ -- Max 2.55 Units V Conditions -- Param No. BO10 Symbol VBOR Note 1: Parameters are for design guidance only and are not tested in manufacturing. DS70283H-page 240 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-12: DC CHARACTERISTICS: PROGRAM MEMORY DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min Typ(1) Max Units Conditions Param Symbol No. Characteristic(3) Program Flash Memory D130 D131 D132B D134 D135 D136a D136b D137a D137b D138a D138b Note 1: 2: EP VPR VPEW TRETD IDDP TRW TRW TPE TPE TWW TWW Cell Endurance VDD for Read VDD for Self-Timed Write Characteristic Retention Supply Current during Programming Row Write Time Row Write Time Page Erase Time Page Erase Time Word Write Cycle Time Word Write Cycle Time 10,000 VMIN VMIN 20 -- 1.32 1.28 20.1 19.5 42.3 41.1 -- -- -- -- 10 -- -- -- -- -- -- -- 3.6 3.6 -- -- 1.74 1.79 26.5 27.3 55.9 57.6 E/W -40 C to +125 C V V VMIN = Minimum operating voltage VMIN = Minimum operating voltage Year Provided no other specifications are violated, -40 C to +125 C mA ms ms ms ms s s TRW = 11064 FRC cycles, TA = +85C, See Note 2 TRW = 11064 FRC cycles, TA = +125C, See Note 2 TPE = 168517 FRC cycles, TA = +85C, See Note 2 TPE = 168517 FRC cycles, TA = +125C, See Note 2 TWW = 355 FRC cycles, TA = +85C, See Note 2 TWW = 355 FRC cycles, TA = +125C, See Note 2 3: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. Other conditions: FRC = 7.37 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max). This parameter depends on the FRC accuracy (see Table 24-18) and the value of the FRC Oscillator Tuning register (see Register 8-4). For complete details on calculating the Minimum and Maximum time see Section 5.3 "Programming Operations". These parameters are assured by design, but are not characterized or tested in manufacturing. TABLE 24-13: INTERNAL VOLTAGE REGULATOR SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Param No. -- Symbol CEFC Characteristics External Filter Capacitor Value Min 4.7 Typ 10 Max -- Units F Comments Capacitor must be low series resistance (< 5 ohms) (c) 2011 Microchip Technology Inc. DS70283H-page 241 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 24.2 AC Characteristics and Timing Parameters This section defines dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 AC characteristics and timing parameters. TABLE 24-14: TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Operating voltage VDD range as described in Table 24-1. AC CHARACTERISTICS FIGURE 24-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 2 - for OSC2 Load Condition 1 - for all pins except OSC2 VDD/2 RL Pin VSS CL Pin VSS CL RL = 464 CL = 50 pF for all pins except OSC2 15 pF for OSC2 output TABLE 24-15: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS Param Symbol No. DO50 COSC2 Characteristic OSC2/SOSC2 pin Min -- Typ -- Max 15 Units pF Conditions In XT and HS modes when external clock is used to drive OSC1 EC mode In I2CTM mode DO56 DO58 CIO CB All I/O pins and OSC2 SCLx, SDAx -- -- -- -- 50 400 pF pF DS70283H-page 242 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-2: EXTERNAL CLOCK TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 OS20 OS25 OS30 OS30 OS31 OS31 CLKO OS41 OS40 TABLE 24-16: EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic External CLKI Frequency(4) (External clocks allowed only in EC and ECPLL modes) Oscillator Crystal Frequency(5) Min DC Typ(1) -- Max 40 Units MHz Conditions EC Param No. OS10 Symb FIN 3.5 10 12.5 25 0.375 x TOSC -- -- -- 14 -- -- -- -- -- -- -- 5.2 5.2 16 10 40 33 DC DC 0.625 x TOSC 20 -- -- 18 MHz MHz kHz ns ns ns ns ns ns mA/V XT HS SOSC -- -- EC EC -- -- VDD = 3.3V TA = +25C OS20 OS25 OS30 OS31 OS40 OS41 OS42 Note 1: 2: TOSC TCY TosL, TosH TosR, TosF TckR TckF GM TOSC = 1/FOSC(4) Instruction Cycle Time(2,4) External Clock in High or Low Time (OSC1)(5) External Clock in (OSC1)(5) Rise or Fall Time CLKO Rise Time(3,5) CLKO Fall Time(3,5) External Oscillator Transconductance(6) 3: 4: 5: 6: Data in "Typ" column is at 3.3V, 25C unless otherwise stated. Instruction cycle period (TCY) equals two times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the "max." cycle time limit is "DC" (no clock) for all devices. Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin. These parameters are characterized by similarity, but are tested in manufacturing at FIN = 40 MHz only. These parameters are characterized by similarity, but are not tested in manufacturing. Data for this parameter is preliminary. This parameter is characterized, but is not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 243 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-17: PLL CLOCK TIMING SPECIFICATIONS (VDD = 3.0V TO 3.6V) AC CHARACTERISTICS Param No. OS50 Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic PLL Voltage Controlled Oscillator (VCO) Input Frequency Range(2) On-Chip VCO System Frequency(3) PLL Start-up Time (Lock Time)(3) CLKO Stability (Jitter)(3) Min 0.8 Typ(1) -- Max 8 Units MHz Conditions ECPLL, XTPLL modes Symbol FPLLI OS51 OS52 OS53 Note 1: 2: 3: FSYS TLOCK DCLK 100 0.9 -3 -- 1.5 0.5 200 3.1 3 MHz mS % -- -- Measured over 100 ms period Data in "Typ" column is at 3.3V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized by similarity, but are tested in manufacturing at 7.7 MHz input only. These parameters are characterized by similarity, but are not tested in manufacturing. This specification is based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time bases or communication clocks use this formula: DCLK Peripheral Clock Jitter = ----------------------------------------------------------------------FOSC ------------------------------------------------------------- Peripheral Bit Rate Clock For example: Fosc = 32 MHz, DCLK = 3%, SPI bit rate clock, (i.e., SCK) is 2 MHz. DCLK 3% 3%SPI SCK Jitter = ----------------------------- = --------- = ------- = 0.75% 4 16 32 MHz ------------------ 2 MHz TABLE 24-18: AC CHARACTERISTICS: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C +85C for industrial TA -40C TA +125C for Extended Min Typ Max Units Conditions Characteristic Internal FRC Accuracy @ FRC Frequency = 7.37 MHz(1) F20a FRC -2 -- +2 % -40C TA +85C VDD = 3.0-3.6V VDD = 3.0-3.6V F20b FRC -5 -- +5 % -40C TA +125C Note 1: Frequency calibrated at 25C and 3.3V. TUN bits can be used to compensate for temperature drift. TABLE 24-19: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min Typ Max Units Conditions Characteristic LPRC @ 32.768 kHz(1,2) F21a LPRC -15 6 +15 % -40C TA +85C VDD = 3.0-3.6V VDD = 3.0-3.6V F21b LPRC -40 -- +40 % -40C TA +125C Note 1: Change of LPRC frequency as VDD changes. 2: LPRC impacts the Watchdog Timer Time-out Period (TWDT1). See Section 21.4 "Watchdog Timer (WDT)" for more information. DS70283H-page 244 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-3: I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) Old Value DO31 DO32 Note: Refer to Figure 24-1 for load conditions. New Value TABLE 24-20: I/O TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(2) Port Output Rise Time Port Output Fall Time INTx Pin High or Low Time (input) CNx High or Low Time (input) Min -- -- 25 2 Typ(1) 10 10 -- -- Max 25 25 -- -- Units ns ns ns TCY Conditions -- -- -- -- Param No. DO31 DO32 DI35 DI40 Note 1: 2: Symbol TIOR TIOF TINP TRBP Data in "Typ" column is at 3.3V, 25C unless otherwise stated. These parameters are characterized, but are not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 245 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS VDD MCLR Internal POR SY12 SY10 SY11 PWRT Time-out OSC Time-out Internal Reset Watchdog Timer Reset SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 24-1 for load conditions. SY20 SY13 SY30 DS70283H-page 246 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic MCLR Pulse Width (low)(1) Power-up Timer Period(1) Min 2 -- Typ(2) -- 2 4 8 16 32 64 128 10 0.72 Max -- -- Units s ms Conditions -40C to +85C -40C to +85C User programmable Param Symbol No. SY10 SY11 TMCL TPWRT SY12 SY13 TPOR TIOZ Power-on Reset Delay(3) I/O High-Impedance from MCLR Low or Watchdog Timer Reset(1) Watchdog Timer Time-out Period (1) Oscillator Start-up Time Fail-Safe Clock Monitor Delay(1) 3 0.68 30 1.2 s s -40C to +85C -- SY20 TWDT1 -- -- -- ms See Section 21.4 "Watchdog Timer (WDT)" and LPRC parameter F21a (Table 24-21). TOSC = OSC1 period -40C to +85C SY30 SY35 Note 1: 2: 3: TOST TFSCM -- -- 1024 TOSC 500 -- 900 -- s These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. These parameters are characterized by similarity, but are not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 247 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-5: TIMER1, 2 AND 3 EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx10 Tx15 OS60 TMRx Tx11 Tx20 Note: Refer to Figure 24-1 for load conditions. TABLE 24-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(2) TxCK High Time Synchronous, no prescaler Synchronous, with prescaler Asynchronous TA11 TTXL TxCK Low Time Synchronous, no prescaler Synchronous, with prescaler Asynchronous TA15 TTXP TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler Asynchronous OS60 Ft1 SOSC1/T1CK Oscillator Input frequency Range (oscillator enabled by setting bit TCS (T1CON<1>)) Min 0.5 TCY + 20 10 10 0.5 TCY + 20 10 10 TCY + 40 Greater of: 20 ns or (TCY + 40)/N 20 DC Typ -- -- -- -- -- -- -- -- Max -- -- -- -- -- -- -- -- Units ns ns ns ns ns ns ns -- -- N = prescale value (1, 8, 64, 256) -- -- Must also meet parameter TA15 Conditions Must also meet parameter TA15 Param No. TA10 Symbol TTXH -- -- -- 50 ns kHz TA20 Note 1: 2: TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment 0.5 TCY 1.5 TCY -- -- Timer1 is a Type A. These parameters are characterized by similarity, but are not tested in manufacturing. DS70283H-page 248 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) TxCK High Synchronous mode Time Min Greater of: 20 or (TCY + 20)/N Typ -- Max -- Units ns Conditions Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) N = prescale value (1, 8, 64, 256) -- Param No. TB10 Symbol TtxH TB11 TtxL TxCK Low Synchronous Time mode Greater of: 20 or (TCY + 20)/N -- -- ns TB15 TtxP TxCK Input Period Synchronous mode Greater of: 40 or (2 TCY + 40)/N -- -- ns TB20 TCKEXTMRL Delay from External TxCK 0.75 TCY + 40 Clock Edge to Timer Increment -- 1.75 TCY + 40 ns Note 1: These parameters are characterized, but are not tested in manufacturing. TABLE 24-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) TxCK High Time TxCK Low Time TxCK Input Period Synchronous Synchronous Synchronous, with prescaler Min TCY + 20 TCY + 20 2 TCY + 40 Typ -- -- -- Max -- -- -- Units ns ns ns Conditions Must also meet parameter TC15 Must also meet parameter TC15 N = prescale value (1, 8, 64, 256) -- Param No. TC10 TC11 TC15 Symbol TtxH TtxL TtxP TC20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment 0.75 TCY + 40 -- 1.75 TCY + 40 ns Note 1: These parameters are characterized, but are not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 249 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-6: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS QEB TQ10 TQ15 POSCNT TQ11 TQ20 TABLE 24-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) TQCK High Time TQCK Low Time TQCP Input Period Synchronous, with prescaler Synchronous, with prescaler Min TCY + 20 TCY + 20 Typ -- -- -- -- Max -- -- -- 1.5 TCY Units ns ns ns -- Conditions Must also meet parameter TQ15 Must also meet parameter TQ15 -- -- Param No. TQ10 TQ11 TQ15 TQ20 Note 1: Symbol TtQH TtQL TtQP Synchronous, 2 * TCY + 40 with prescaler 0.5 TCY TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment These parameters are characterized but not tested in manufacturing. DS70283H-page 250 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-7: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICx IC10 IC15 Note: Refer to Figure 24-1 for load conditions. IC11 TABLE 24-26: INPUT CAPTURE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) ICx Input Low Time ICx Input High Time ICx Input Period No Prescaler With Prescaler IC11 IC15 Note 1: TccH TccP No Prescaler With Prescaler Min 0.5 TCY + 20 10 0.5 TCY + 20 10 (TCY + 40)/N Max -- -- -- -- -- Units ns ns ns ns ns N = prescale value (1, 4, 16) -- Conditions -- Param No. IC10 Symbol TccL These parameters are characterized but not tested in manufacturing. FIGURE 24-8: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC11 OC10 Note: Refer to Figure 24-1 for load conditions. TABLE 24-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min -- -- Typ -- -- Max -- -- Units ns ns Conditions See parameter D032 See parameter D031 Param Symbol No. OC10 OC11 Note 1: TccF TccR Characteristic(1) OCx Output Fall Time OCx Output Rise Time These parameters are characterized but not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 251 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-9: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA OC15 OCx Active Tri-state TABLE 24-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Fault Input to PWM I/O Change Fault Input Pulse-Width Min -- TCY + 20 Typ -- -- Max TCY + 20 -- Units ns ns Conditions -- -- Param No. OC15 OC20 Note 1: Symbol TFD TFLT These parameters are characterized but not tested in manufacturing. DS70283H-page 252 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-10: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS MP30 FLTA MP20 PWMx FIGURE 24-11: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS MP11 MP10 PWMx Note: Refer to Figure 24-1 for load conditions. TABLE 24-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) PWM Output Fall Time PWM Output Rise Time Fault Input to PWM I/O Change Minimum Pulse-Width Min -- -- -- 50 Typ -- -- -- -- Max -- -- 50 -- Units ns ns ns ns Conditions See parameter D032 See parameter D031 -- -- Param No. MP10 MP11 MP20 MP30 Note 1: Symbol TFPWM TRPWM TFD TFH These parameters are characterized but not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 253 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-12: QEA/QEB INPUT CHARACTERISTICS TQ36 QEA (input) TQ31 TQ35 TQ30 QEB (input) TQ41 TQ40 TQ31 TQ35 TQ30 QEB Internal TABLE 24-30: QUADRATURE DECODER TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Quadrature Input Low Time Quadrature Input High Time Quadrature Input Period Quadrature Phase Period Filter Time to Recognize Low, with Digital Filter Filter Time to Recognize High, with Digital Filter Typ(2) 6 TCY 6 TCY 12 TCY 3 TCY 3 * N * TCY 3 * N * TCY Max -- -- -- -- -- -- Units ns ns ns ns ns ns Conditions -- -- -- -- N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 3) N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 3) Param No. TQ30 TQ31 TQ35 TQ36 TQ40 TQ41 Note 1: 2: 3: Symbol TQUL TQUH TQUIN TQUP TQUFL TQUFH These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. N = Index Channel Digital Filter Clock Divide Select bits. Refer to Section 15. "Quadrature Encoder Interface (QEI)" (DS70208) in the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site for the latest dsPIC33F/PIC24H Family Reference Manual sections. DS70283H-page 254 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-13: QEA (input) QEI MODULE INDEX PULSE TIMING CHARACTERISTICS QEB (input) Ungated Index TQ51 Index Internal TQ50 TQ55 Position Counter Reset TABLE 24-31: QEI INDEX PULSE TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Filter Time to Recognize Low, with Digital Filter Filter Time to Recognize High, with Digital Filter Index Pulse Recognized to Position Counter Reset (ungated index) Min 3 * N * TCY 3 * N * TCY 3 TCY Max -- -- -- Units ns ns ns Conditions N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) -- Param No. TQ50 TQ51 TQ55 Note 1: 2: Symbol TqIL TqiH Tqidxr These parameters are characterized but not tested in manufacturing. Alignment of index pulses to QEA and QEB is shown for position counter Reset timing only. Shown for forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but index pulse recognition occurs on falling edge. (c) 2011 Microchip Technology Inc. DS70283H-page 255 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-32: SPIx MAXIMUM DATA/CLOCK RATE SUMMARY AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Master Transmit/Receive (Full-Duplex) -- Table 24-34 Table 24-35 -- -- -- -- Slave Transmit/Receive (Full-Duplex) -- -- -- Table 24-36 Table 24-37 Table 24-38 Table 24-39 CKE 0,1 1 0 1 1 0 0 CKP 0,1 0,1 0,1 0 1 1 0 SMP 0,1 1 1 0 0 0 0 Maximum Data Rate 15 Mhz 9 Mhz 9 Mhz 15 Mhz 11 Mhz 15 Mhz 11 Mhz Master Transmit Only (Half-Duplex) Table 24-33 -- -- -- -- -- -- FIGURE 24-14: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx SP30, SP31 MSb Bit 14 - - - - - -1 LSb SP30, SP31 Note: Refer to Figure 24-1 for load conditions. FIGURE 24-15: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx MSb Bit 14 - - - - - -1 SP30, SP31 LSb Note: Refer to Figure 24-1 for load conditions. DS70283H-page 256 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-33: SPIx MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Maximum SCK Frequency SCKx Output Fall Time SCKx Output Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time SDOx Data Output Valid after SCKx Edge SDOx Data Output Setup to First SCKx Edge Min -- -- -- -- -- -- 30 Typ(2) -- -- -- -- -- 6 -- Max 15 -- -- -- -- 20 -- Units MHz ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- -- Param No. SP10 SP20 SP21 SP30 SP31 SP35 SP36 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, TscL2doV TdiV2scH, TdiV2scL These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2011 Microchip Technology Inc. DS70283H-page 257 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-16: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = X, SMP = 1) TIMING CHARACTERISTICS SP36 SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx MSb Bit 14 - - - - - -1 SP30, SP31 LSb SP40 SDIx MSb In SP41 Bit 14 - - - -1 LSb In Note: Refer to Figure 24-1 for load conditions. TABLE 24-34: SPIx MASTER MODE (FULL-DUPLEX, CKE = 1, CKP = x, SMP = 1) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Maximum SCK Frequency SCKx Output Fall Time SCKx Output Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min -- -- -- -- -- Typ(2) -- -- -- -- -- Max 9 -- -- -- -- Units MHz ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- Param No. SP10 SP20 SP21 SP30 SP31 SP35 SP36 SP40 SP41 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after -- 6 20 ns TscL2doV SCKx Edge TdoV2sc, SDOx Data Output Setup to 30 -- -- ns -- TdoV2scL First SCKx Edge TdiV2scH, Setup Time of SDIx Data 30 -- -- ns -- TdiV2scL Input to SCKx Edge TscH2diL, Hold Time of SDIx Data Input 30 -- -- ns -- TscL2diL to SCKx Edge These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. DS70283H-page 258 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-17: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = X, SMP = 1) TIMING CHARACTERISTICS SCKx (CKP = 0) SP10 SCKx (CKP = 1) SP35 SP20 SP21 SP21 SP20 SDOx SP30, SP31 SDIx MSb Bit 14 - - - - - -1 LSb SP30, SP31 Bit 14 - - - -1 LSb In MSb In SP40 SP41 Note: Refer to Figure 24-1 for load conditions. TABLE 24-35: SPIx MASTER MODE (FULL-DUPLEX, CKE = 0, CKP = x, SMP = 1) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Maximum SCK Frequency SCKx Output Fall Time SCKx Output Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min -- -- -- -- -- Typ(2) -- -- -- -- -- Max 9 -- -- -- -- Units MHz ns ns ns ns Conditions -40C to +125C and see Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- Param No. SP10 SP20 SP21 SP30 SP31 SP35 SP36 SP40 SP41 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after -- 6 20 ns TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to 30 -- -- ns -- TdoV2scL First SCKx Edge TdiV2scH, Setup Time of SDIx Data 30 -- -- ns -- TdiV2scL Input to SCKx Edge TscH2diL, Hold Time of SDIx Data Input 30 -- -- ns -- TscL2diL to SCKx Edge These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 111 ns. The clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2011 Microchip Technology Inc. DS70283H-page 259 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-18: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP50 SCKx (CKP = 0) SP70 SCKx (CKP = 1) SP35 SP72 MSb Bit 14 - - - - - -1 SP30,SP31 SDI SDIx MSb In SP41 SP40 Bit 14 - - - -1 LSb In LSb SP51 SP73 SP73 SP72 SP52 SDOx Note: Refer to Figure 24-1 for load conditions. DS70283H-page 260 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-36: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 0, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time SDOx Data Output Valid after SCKx Edge SDOx Data Output Setup to First SCKx Edge Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx to SCKx or SCKx Input SSx to SDOx Output High-Impedance(4) Min -- -- -- -- -- -- 30 30 30 120 10 1.5 TCY + 40 Typ(2) -- -- -- -- -- 6 -- -- -- -- -- -- Max 15 -- -- -- -- 20 -- -- -- -- 50 -- Units MHz ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- -- -- -- -- -- See Note 4 Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 SP60 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, TscL2doV TdoV2scH, TdoV2scL TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ TscH2ssH SSx after SCKx Edge TscL2ssH TssL2doV SDOx Data Output Valid after -- -- 50 ns -- SSx Edge These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2011 Microchip Technology Inc. DS70283H-page 261 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-19: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SP60 SSx SP50 SCKx (CKP = 0) SP70 SCKx (CKP = 1) SP35 SP52 SDOx MSb Bit 14 - - - - - -1 SP30,SP31 SDIx SDI MSb In SP41 SP40 Note: Refer to Figure 24-1 for load conditions. Bit 14 - - - -1 LSb In SP72 LSb SP51 SP73 SP73 SP72 SP52 DS70283H-page 262 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-37: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 1, CKP = 1, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min -- -- -- -- -- -- 30 30 30 120 10 1.5 TCY + 40 -- Typ(2) -- -- -- -- -- 6 -- -- -- -- -- -- -- Max 11 -- -- -- -- 20 -- -- -- -- 50 -- 50 Units MHz ns ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- -- -- -- -- -- See Note 4 -- Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 SP60 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx to SCKx or SCKx Input SSx to SDOx Output High-Impedance(4) TscH2ssH SSx after SCKx Edge TscL2ssH TssL2doV SDOx Data Output Valid after SSx Edge These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2011 Microchip Technology Inc. DS70283H-page 263 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-20: SPIx SLAVE MODE (FULL-DUPLEX CKE = 0, CKP = 1, SMP = 0) TIMING CHARACTERISTICS SSX SP50 SCKX (CKP = 0) SP70 SCKX (CKP = 1) SP35 SDOX MSb SP72 SP73 SP73 SP72 SP52 Bit 14 - - - - - -1 SP30,SP31 LSb SP51 LSb In SDIX MSb In SP41 SP40 Bit 14 - - - -1 Note: Refer to Figure 24-1 for load conditions. DS70283H-page 264 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-38: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 1, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min -- -- -- -- -- -- 30 30 30 120 10 1.5 TCY + 40 Typ(2) -- -- -- -- -- 6 -- -- -- -- -- -- Max 15 -- -- -- -- 20 -- -- -- -- 50 -- Units MHz ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- -- -- -- -- -- See Note 4 Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx to SCKx or SCKx Input SSx to SDOx Output High-Impedance(4) TscH2ssH SSx after SCKx Edge TscL2ssH These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 66.7 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2011 Microchip Technology Inc. DS70283H-page 265 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-21: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING CHARACTERISTICS SSX SP50 SCKX (CKP = 0) SP70 SCKX (CKP = 1) SP35 SDOX MSb SP72 SP73 SP73 SP72 SP52 Bit 14 - - - - - -1 SP30,SP31 LSb SP51 LSb In SDIX MSb In SP41 SP40 Bit 14 - - - -1 Note: Refer to Figure 24-1 for load conditions. DS70283H-page 266 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-39: SPIx SLAVE MODE (FULL-DUPLEX, CKE = 0, CKP = 0, SMP = 0) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Maximum SCK Input Frequency SCKx Input Fall Time SCKx Input Rise Time SDOx Data Output Fall Time SDOx Data Output Rise Time Min -- -- -- -- -- -- 30 30 30 120 10 1.5 TCY + 40 Typ(2) -- -- -- -- -- 6 -- -- -- -- -- -- Max 11 -- -- -- -- 20 -- -- -- -- 50 -- Units MHz ns ns ns ns ns ns ns ns ns ns ns Conditions See Note 3 See parameter DO32 and Note 4 See parameter DO31 and Note 4 See parameter DO32 and Note 4 See parameter DO31 and Note 4 -- -- -- -- -- -- See Note 4 Param No. SP70 SP72 SP73 SP30 SP31 SP35 SP36 SP40 SP41 SP50 SP51 SP52 Note 1: 2: 3: 4: Symbol TscP TscF TscR TdoF TdoR TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdoV2scH, SDOx Data Output Setup to TdoV2scL First SCKx Edge TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx to SCKx or SCKx Input SSx to SDOx Output High-Impedance(4) TscH2ssH SSx after SCKx Edge TscL2ssH These parameters are characterized, but are not tested in manufacturing. Data in "Typ" column is at 3.3V, 25C unless otherwise stated. The minimum clock period for SCKx is 91 ns. Therefore, the SCK clock generated by the Master must not violate this specification. Assumes 50 pF load on all SPIx pins. (c) 2011 Microchip Technology Inc. DS70283H-page 267 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-22: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCLx IM31 IM30 IM33 IM34 SDAx Start Condition Note: Refer to Figure 24-1 for load conditions. Stop Condition FIGURE 24-23: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM11 IM10 IM11 IM26 IM21 SCLx IM10 IM25 IM33 SDAx In IM40 IM40 IM45 SDAx Out Note: Refer to Figure 24-1 for load conditions. DS70283H-page 268 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-40: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(3) Min(1) Max Units Conditions Param Symbol No. IM10 IM11 IM20 IM21 IM25 IM26 IM30 IM31 IM33 IM34 IM40 IM45 IM50 IM51 Note 1: 2: 3: 4: -- s -- TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) -- s -- 400 kHz mode TCY/2 (BRG + 1) -- s -- 1 MHz mode(2) TCY/2 (BRG + 1) THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1) -- s -- -- s -- 400 kHz mode TCY/2 (BRG + 1) -- s -- 1 MHz mode(2) TCY/2 (BRG + 1) TF:SCL SDAx and SCLx 100 kHz mode -- 300 ns CB is specified to be Fall Time from 10 to 400 pF 300 ns 400 kHz mode 20 + 0.1 CB (2) -- 100 ns 1 MHz mode TR:SCL SDAx and SCLx 100 kHz mode -- 1000 ns CB is specified to be Rise Time from 10 to 400 pF 300 ns 400 kHz mode 20 + 0.1 CB -- 300 ns 1 MHz mode(2) TSU:DAT Data Input 100 kHz mode 250 -- ns -- Setup Time 400 kHz mode 100 -- ns 40 -- ns 1 MHz mode(2) THD:DAT Data Input 100 kHz mode 0 -- s -- Hold Time 400 kHz mode 0 0.9 s 0.2 -- s 1 MHz mode(2) TSU:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) -- s Only relevant for Setup Time Repeated Start -- s 400 kHz mode TCY/2 (BRG + 1) condition (2) TCY/2 (BRG + 1) -- s 1 MHz mode THD:STA Start Condition 100 kHz mode TCY/2 (BRG + 1) -- s After this period the Hold Time first clock pulse is -- s 400 kHz mode TCY/2 (BRG + 1) generated -- s 1 MHz mode(2) TCY/2 (BRG + 1) TSU:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) -- s -- Setup Time -- s 400 kHz mode TCY/2 (BRG + 1) -- s 1 MHz mode(2) TCY/2 (BRG + 1) -- ns -- THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) (BRG + 1) -- ns Hold Time 400 kHz mode TCY/2 -- ns 1 MHz mode(2) TCY/2 (BRG + 1) TAA:SCL Output Valid 100 kHz mode -- 3500 ns -- From Clock 400 kHz mode -- 1000 ns -- (2) -- 400 ns -- 1 MHz mode TBF:SDA Bus Free Time 100 kHz mode 4.7 -- s Time the bus must be free before a new 400 kHz mode 1.3 -- s transmission can start 0.5 -- s 1 MHz mode(2) CB Bus Capacitive Loading -- 400 pF -- Pulse Gobbler Delay 65 390 ns See Note 4 TPGD BRG is the value of the I2C Baud Rate Generator. Refer to Section 19. "Inter-Integrated Circuit (I2CTM)" (DS70195) in the "dsPIC33F/PIC24H Family Reference Manual". Please see the Microchip web site for the latest dsPIC33F/PIC24H Family Reference Manual sections. Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). These parameters are characterized by similarity, but are not tested in manufacturing. Typical value for this parameter is 130 ns. (c) 2011 Microchip Technology Inc. DS70283H-page 269 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-24: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCLx IS31 IS30 IS33 IS34 SDAx Start Condition Stop Condition FIGURE 24-25: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS11 IS10 IS30 IS26 IS21 SCLx IS31 IS25 IS33 SDAx In IS40 IS40 IS45 SDAx Out DS70283H-page 270 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-41: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE) AC CHARACTERISTICS Characteristic(2) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min 4.7 1.3 0.5 4.0 0.6 0.5 -- 20 + 0.1 CB -- -- 20 + 0.1 CB -- 250 100 100 0 0 0 4.7 0.6 0.25 4.0 0.6 0.25 4.7 0.6 0.6 4000 600 250 0 0 0 4.7 Max -- -- -- -- -- -- 300 300 100 1000 300 300 -- -- -- -- 0.9 0.3 -- -- -- -- -- -- -- -- -- -- -- 3500 1000 350 -- Units s s s s s s ns ns ns ns ns ns ns ns ns s s s s s s s s s s s s ns ns ns ns ns ns s Conditions Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz -- Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz -- CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF -- Param. Symbol IS10 TLO:SCL Clock Low Time IS11 THI:SCL Clock High Time IS20 TF:SCL SDAx and SCLx Fall Time SDAx and SCLx Rise Time IS21 TR:SCL IS25 TSU:DAT Data Input Setup Time THD:DAT Data Input Hold Time TSU:STA Start Condition Setup Time THD:STA Start Condition Hold Time TSU:STO Stop Condition Setup Time THD:ST O IS26 -- IS30 Only relevant for Repeated Start condition After this period, the first clock pulse is generated -- IS31 IS33 IS34 Stop Condition Hold Time -- IS40 TAA:SCL Output Valid From Clock TBF:SDA Bus Free Time -- IS45 400 kHz mode 1.3 -- s 0.5 -- s 1 MHz mode(1) IS50 CB Bus Capacitive Loading -- 400 pF Note 1: Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only). 2: These parameters are characterized by similarity, but are not tested in manufacturing. Time the bus must be free before a new transmission can start -- (c) 2011 Microchip Technology Inc. DS70283H-page 271 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-42: ADC MODULE SPECIFICATIONS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min. Typ Max. Units Conditions Param Symb No. ol Characteristic Device Supply AD01 AVDD Module VDD Supply(2) Greater of VDD - 0.3 or 3.0 VSS - 0.3 AVSS + 2.5 3.0 VREFL Reference Voltage Low AVSS 0 VREF IREF Absolute Reference Voltage(2) Current Drain Operating Current 2.5 -- -- -- -- VINL -- Lesser of VDD + 0.3 or 3.6 VSS + 0.3 AVDD 3.6 AVDD - 2.5 0 3.6 550 10 9.0 3.2 VREFH V -- V V V V V V A A mA mA V See Note 1 VREFH = AVDD VREFL = AVSS = 0, see Note 2 See Note 1 VREFH = AVDD VREFL = AVSS = 0, see Note 2 VREF = VREFH - VREFL ADC operating, See Note 1 ADC off, See Note 1 10-bit ADC mode, See Note 2 12-bit ADC mode, See Note 2 This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), positive input This voltage reflects Sample and Hold Channels 0, 1, 2, and 3 (CH0-CH3), negative input 10-bit ADC 12-bit ADC -- AD02 AD05 AD05a AD06 AD06a AD07 AD08 AVSS VREFH Module VSS Supply(2) Reference Voltage High -- -- -- -- -- -- 250 -- 7.0 2.7 -- Reference Inputs AD08a IAD Analog Input AD12 VINH Input Voltage Range VINH(2) AD13 VINL Input Voltage Range VINL(2) VREFL -- AVSS + 1V V AD17 Note 1: 2: 3: RIN Recommended Impedance of Analog Voltage Source(3) -- -- -- -- 200 200 These parameters are not characterized or tested in manufacturing. These parameters are characterized, but are not tested in manufacturing. These parameters are assured by design, but are not characterized or tested in manufacturing. DS70283H-page 272 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-43: ADC MODULE SPECIFICATIONS (12-BIT MODE) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Min. Typ Max. Units Conditions Param No. AD20a AD21a AD22a AD23a AD24a AD25a AD20a AD21a AD22a AD23a AD24a AD25a AD30a AD31a AD32a AD33a AD34a Note 1: 2: 3: 4: Symbol ADC Accuracy (12-bit Mode) - Measurements with external VREF+/VREF-(3) Nr INL DNL GERR EOFF -- Nr INL DNL GERR EOFF -- THD SINAD SFDR FNYQ ENOB Resolution(4) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Resolution(4) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Total Harmonic Distortion Signal to Noise and Distortion Spurious Free Dynamic Range Input Signal Bandwidth Effective Number of Bits -2 >-1 -- -- -- -- 68.5 80 -- 11.09 -2 >-1 -- -- -- 12 data bits -- -- 3.4 0.9 -- 12 data bits -- -- 10.5 3.8 -- -- 69.5 -- -- 11.3 +2 <1 20 10 -- -75 -- -- 250 -- +2 <1 10 5 -- bits LSb LSb LSb LSb -- bits LSb LSb LSb LSb -- dB dB dB kHz bits -- VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Guaranteed(1) -- VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V Guaranteed(1) -- -- -- -- -- ADC Accuracy (12-bit Mode) - Measurements with internal VREF+/VREF-(3) Dynamic Performance (12-bit Mode)(2) The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. These parameters are characterized by similarity, but are not tested in manufacturing. These parameters are characterized, but are tested at 20 ksps only. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. (c) 2011 Microchip Technology Inc. DS70283H-page 273 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-44: ADC MODULE SPECIFICATIONS (10-BIT MODE) AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Min. Typ Max. Units Conditions Param No. AD20b AD21b AD22b AD23b AD24b AD25b AD20b AD21b AD22b AD23b AD24b AD25b AD30b AD31b AD32b AD33b AD34b Note 1: 2: 3: 4: Symbol ADC Accuracy (10-bit Mode) - Measurements with external VREF+/VREF-(3) Nr INL DNL GERR EOFF -- Nr INL DNL GERR EOFF -- THD SINAD SFDR FNYQ ENOB Resolution(4) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Resolution(4) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Monotonicity Total Harmonic Distortion Signal to Noise and Distortion Spurious Free Dynamic Range Input Signal Bandwidth Effective Number of Bits -1 >-1 -- -- -- -- 57 72 -- 9.16 -1.5 >-1 -- -- -- 10 data bits -- -- 3 2 -- 10 data bits -- -- 7 3 -- -- 58.5 -- -- 9.4 +1 <1 15 7 -- -64 -- -- 550 -- +1.5 <1 6 5 -- bits LSb LSb LSb LSb -- bits LSb LSb LSb LSb -- dB dB dB kHz bits -- VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V Guaranteed(1) -- VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V Guaranteed(1) -- -- -- -- -- ADC Accuracy (10-bit Mode) - Measurements with internal VREF+/VREF-(3) Dynamic Performance (10-bit Mode)(2) The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. These parameters are characterized by similarity, but are not tested in manufacturing. These parameters are characterized, but are tested at 20 ksps only. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. DS70283H-page 274 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-26: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS (ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution SAMP AD61 AD60 TSAMP DONE AD1IF AD55 Set SAMP Clear SAMP 1 2 3 4 5 6 7 5 - Convert bit 11. 6 - Convert bit 10. 7 - Convert bit 1. 8 - Convert bit 0. 8 9 1 - Software sets AD1CON. SAMP to start sampling. 2 - Sampling starts after discharge period. TSAMP is described in Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) in the "dsPIC33F/PIC24H Family Reference Manual". 3 - Software clears AD1CON. SAMP to start conversion. 4 - Sampling ends, conversion sequence starts. 9 - One TAD for end of conversion. TABLE 24-45: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS AC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Min. Typ Max. Units Conditions Param No. Symbol Clock Parameters AD50 AD51 TAD tRC ADC Clock Period(2) 117.6 -- -- 250 -- -- ns ns -- -- ADC Internal RC Oscillator Period(2) Conversion Time(2) Conversion Rate AD55 AD56 AD57 AD60 AD61 AD62 AD63 Note 1: 2: tCONV FCNV TSAMP tPCS tPSS tCSS tDPU -- -- 3.0 TAD 2.0 TAD 2.0 TAD -- -- 14 TAD -- -- -- -- 0.5 TAD -- -- 500 -- 3.0 TAD 3.0 TAD -- 20 ns Ksps -- -- -- -- s -- -- -- Auto convert trigger not selected -- -- -- Throughput Rate(2) Sample Time(2) Conversion Start from Sample Trigger(2) Sample Start from Setting Sample (SAMP) bit(2) Conversion Completion to Sample Start (ASAM = 1)(2) Time to Stabilize Analog Stage from ADC Off to ADC On(2) Timing Parameters Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity performance, especially at elevated temperatures. These parameters are characterized but not tested in manufacturing. (c) 2011 Microchip Technology Inc. DS70283H-page 275 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 FIGURE 24-27: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000) AD50 ADCLK Instruction Execution Set SAMP SAMP AD61 AD60 TSAMP DONE AD1IF AD55 AD55 Clear SAMP 1 2 3 4 5 6 7 8 5 6 7 8 1 - Software sets AD1CON. SAMP to start sampling. 2 - Sampling starts after discharge period. TSAMP is described in Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) in the "dsPIC33F/PIC24H Family Reference Manual". 3 - Software clears AD1CON. SAMP to start conversion. 4 - Sampling ends, conversion sequence starts. 5 - Convert bit 9. 6 - Convert bit 8. 7 - Convert bit 0. 8 - One TAD for end of conversion. FIGURE 24-28: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001) AD50 ADCLK Instruction Set ADON Execution SAMP TSAMP AD1IF AD55 AD55 TSAMP AD55 DONE 1 2 3 4 5 6 7 3 4 5 6 8 1 - Software sets AD1CON. ADON to start AD operation. 2 - Sampling starts after discharge period. TSAMP is described in Section 16. "Analog-to-Digital Converter (ADC)" (DS70183) in the "dsPIC33F/PIC24H Family Reference Manual". 3 - Convert bit 9. 4 - Convert bit 8. 5 - Convert bit 0. 6 - One TAD for end of conversion. 7 - Begin conversion of next channel. 8 - Sample for time specified by SAMC<4:0>. DS70283H-page 276 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 24-46: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V AC CHARACTERISTICS (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic Min. Typ(1) Max. Units Conditions Param Symbol No. Clock Parameters AD50 AD51 TAD tRC ADC Clock Period (1) 76 -- -- 250 -- -- ns ns -- -- ADC Internal RC Oscillator Period(1) Conversion Time Sample Time(1) Conversion Start from Sample Trigger(1) Sample Start from Setting Sample (SAMP) bit(1) Conversion Completion to Sample Start (ASAM = 1)(1) Time to Stabilize Analog Stage from ADC Off to ADC On(1) (1) Conversion Rate AD55 AD56 AD57 AD60 AD61 AD62 AD63 Note 1: 2: tCONV FCNV TSAMP tPCS tPSS tCSS tDPU -- -- 2.0 TAD 2.0 TAD 2.0 TAD -- -- 12 TAD -- -- -- -- 0.5 TAD -- -- 1.1 -- 3.0 TAD 3.0 TAD -- 20 -- Msps -- -- -- -- s -- -- -- Auto-Convert Trigger not selected -- -- -- Throughput Rate(1) Timing Parameters These parameters are characterized but not tested in manufacturing. Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity performance, especially at elevated temperatures. (c) 2011 Microchip Technology Inc. DS70283H-page 277 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 278 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 25.0 HIGH TEMPERATURE ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 electrical characteristics for devices operating in an ambient temperature range of -40C to +150C. Note: Programming of the Flash memory is not allowed above 125C. The specifications between -40C to +150C are identical to those shown in Section 24.0 "Electrical Characteristics" for operation between -40C to +125C, with the exception of the parameters listed in this section. Parameters in this section begin with an H, which denotes High temperature. For example, parameter DC10 in Section 24.0 "Electrical Characteristics" is the Industrial and Extended temperature equivalent of HDC10. Absolute maximum ratings for the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 high temperature devices are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(1) Ambient temperature under bias(4) .........................................................................................................-40C to +150C Storage temperature .............................................................................................................................. -65C to +160C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V Voltage on any pin that is not 5V tolerant with respect to VSS(5) .................................................... -0.3V to (VDD + 0.3V) Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V(5) .................................................... -0.3V to 3.6V Voltage on any 5V tolerant pin with respect to VSS when VDD 3.0V(5) .................................................... -0.3V to 5.6V Voltage on VCAP with respect to VSS ...................................................................................................... 2.25V to 2.75V Maximum current out of VSS pin .............................................................................................................................60 mA Maximum current into VDD pin(2) .............................................................................................................................60 mA Maximum junction temperature............................................................................................................................. +155C Maximum output current sunk by any I/O pin(3) ........................................................................................................1 mA Maximum output current sourced by any I/O pin(3) ...................................................................................................1 mA Maximum current sunk by all ports combined ........................................................................................................10 mA Maximum current sourced by all ports combined(2) ................................................................................................10 mA Note 1: Stresses above those listed under "Absolute Maximum Ratings" can cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods can affect device reliability. 2: Maximum allowable current is a function of device maximum power dissipation (see Table 25-2). 3: Unlike devices at 125C and below, the specifications in this section also apply to the CLKOUT, VREF+, VREF-, SCLx, SDAx, PGCx and PGDx pins. 4: AEC-Q100 reliability testing for devices intended to operate at 150C is 1,000 hours. Any design in which the total operating time from 125C to 150C will be greater than 1,000 hours is not warranted without prior written approval from Microchip Technology Inc. 5: Refer to the "Pin Diagrams" section for 5V tolerant pins. (c) 2011 Microchip Technology Inc. DS70283H-page 279 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 25.1 High Temperature DC Characteristics OPERATING MIPS VS. VOLTAGE Max MIPS Characteristic HDC5 VDD Range (in Volts) 3.0V to 3.6V Temperature Range (in C) -40C to +150C dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 20 TABLE 25-1: TABLE 25-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Typ Max Unit High Temperature Devices Operating Junction Temperature Range Operating Ambient Temperature Range Power Dissipation: Internal chip power dissipation: PINT = VDD x (IDD - IOH) I/O Pin Power Dissipation: I/O = ({VDD - VOH} x IOH) + (VOL x IOL) Maximum Allowed Power Dissipation PDMAX (TJ - TA)/JA W TJ TA -40 -40 -- -- +155 +150 C C PD PINT + PI/O W TABLE 25-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Characteristic Min Typ Max Units Conditions DC CHARACTERISTICS Parameter No. Symbol Operating Voltage HDC10 Supply Voltage VDD -- 3.0 3.3 3.6 V -40C to +150C TABLE 25-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Max Units Conditions DC CHARACTERISTICS Parameter No. Typical Power-Down Current (IPD) HDC60e HDC61c Note 1: 2: 3: 4: 250 3 2000 5 A A +150C +150C 3.3V 3.3V Base Power-Down Current(1,3) Watchdog Timer Current: IWDT(2,4) Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1. The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. These currents are measured on the device containing the most memory in this family. These parameters are characterized, but are not tested in manufacturing. DS70283H-page 280 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-5: DC CHARACTERISTICS: DOZE CURRENT (IDD) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Max Units Conditions DC CHARACTERISTICS Parameter No. HDC20 HDC21 HDC22 Note 1: Typical(1) Operating Current (IPD)(1) 19 27 33 35 45 55 mA mA mA +150C +150C +150C 3.3V 3.3V 3.3V 10 MIPS 16 MIPS 20 MIPS These parameters are characterized, but are not tested in manufacturing. TABLE 25-6: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Max 45 25 25 Doze Ratio 1:2 1:64 1:128 Units mA mA mA +150C 3.3V 20 MIPS Conditions DC CHARACTERISTICS Parameter No. HDC72a HDC72f HDC72g Note 1: Typical(1) 39 18 18 Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing. TABLE 25-7: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Characteristic Output Low Voltage I/O ports OSC2/CLKO -- -- 2.40 2.41 -- -- -- -- 0.4 0.4 -- -- V V V V IOL = 1 mA, VDD = 3.3V IOL = 1 mA, VDD = 3.3V IOH = -1 mA, VDD = 3.3V IOH = -1 mA, VDD = 3.3V Min Typ Max Units Conditions DC CHARACTERISTICS Param No. Symbol VOL HDO10 HDO16 VOH HDO20 HDO26 Output High Voltage I/O ports OSC2/CLKO (c) 2011 Microchip Technology Inc. DS70283H-page 281 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-8: DC CHARACTERISTICS: PROGRAM MEMORY Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Min Typ Max Units Conditions DC CHARACTERISTICS Param Symbol No. Characteristic(1) Program Flash Memory HD130 EP HD134 TRETD Note 1: 2: Cell Endurance Characteristic Retention 10,000 20 -- -- -- -- E/W Year -40 C to +150 C(2) 1000 E/W cycles or less and no other specifications are violated These parameters are assured by design, but are not characterized or tested in manufacturing. Programming of the Flash memory is not allowed above 125C. DS70283H-page 282 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 25.2 AC Characteristics and Timing Parameters Parameters in this section begin with an H, which denotes High temperature. For example, parameter OS53 in Section 24.2 "AC Characteristics and Timing Parameters" is the Industrial and Extended temperature equivalent of HOS53. The information contained in this section defines dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 AC characteristics and timing parameters for high temperature devices. However, all AC timing specifications in this section are the same as those in Section 24.2 "AC Characteristics and Timing Parameters", with the exception of the parameters listed in this section. TABLE 25-9: TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Operating voltage VDD range as described in Table 25-1. AC CHARACTERISTICS FIGURE 25-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 2 - for OSC2 Load Condition 1 - for all pins except OSC2 VDD/2 RL Pin VSS CL Pin VSS CL RL = 464 CL = 50 pF for all pins except OSC2 15 pF for OSC2 output TABLE 25-10: PLL CLOCK TIMING SPECIFICATIONS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. HOS53 Note 1: Symbol DCLK Characteristic CLKO Stability (Jitter)(1) Min -5 Typ 0.5 Max 5 Units % Conditions Measured over 100 ms period These parameters are characterized by similarity, but are not tested in manufacturing. This specification is based on clock cycle by clock cycle measurements. To calculate the effective jitter for individual time bases or communication clocks use this formula:: DCLK Peripheral Clock Jitter = ----------------------------------------------------------------------FOSC ------------------------------------------------------------- Peripheral Bit Rate Clock For example: Fosc = 32 MHz, DCLK = 5%, SPI bit rate clock, (i.e., SCK) is 2 MHz. DCLK 5%5% SPI SCK Jitter = ----------------------------- = --------- = ------- = 1.25% 4 16 32 MHz ------------------ 2 MHz (c) 2011 Microchip Technology Inc. DS70283H-page 283 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-11: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. HSP35 HSP40 HSP41 Note 1: Symbol TscH2doV, TscL2doV TdiV2scH, TdiV2scL TscH2diL, TscL2diL Characteristic(1) SDOx Data Output Valid after SCKx Edge Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge Min -- 28 35 Typ 10 -- -- Max 25 -- -- Units ns ns ns Conditions -- -- -- These parameters are characterized but not tested in manufacturing. TABLE 25-12: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. HSP35 HSP36 HSP40 HSP41 Note 1: Symbol Characteristic(1) Min -- 35 28 35 Typ 10 -- -- -- Max 25 -- -- -- Units ns ns ns ns Conditions -- -- -- -- TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdoV2sc, TdoV2scL SDOx Data Output Setup to First SCKx Edge TdiV2scH, Setup Time of SDIx Data Input TdiV2scL to SCKx Edge TscH2diL, TscL2diL Hold Time of SDIx Data Input to SCKx Edge These parameters are characterized but not tested in manufacturing. DS70283H-page 284 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-13: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. HSP35 HSP40 HSP41 HSP51 Note 1: 2: Symbol TscH2doV, TscL2doV TdiV2scH, TdiV2scL TscH2diL, TscL2diL TssH2doZ Characteristic(1) SDOx Data Output Valid after SCKx Edge Setup Time of SDIx Data Input to SCKx Edge Hold Time of SDIx Data Input to SCKx Edge SSx to SDOx Output High-Impedance Min -- 25 25 15 Typ -- -- -- -- Max 35 -- -- 55 Units ns ns ns ns Conditions -- -- -- See Note 2 These parameters are characterized but not tested in manufacturing. Assumes 50 pF load on all SPIx pins. TABLE 25-14: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS AC CHARACTERISTICS Param No. HSP35 HSP40 HSP41 HSP51 HSP60 Note 1: 2: Symbol Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Characteristic(1) Min -- 25 25 15 -- Typ -- -- -- -- -- Max 35 -- -- 55 55 Units ns ns ns ns ns Conditions -- -- -- See Note 2 -- TscH2doV, SDOx Data Output Valid after TscL2doV SCKx Edge TdiV2scH, Setup Time of SDIx Data Input TdiV2scL to SCKx Edge TscH2diL, TscL2diL TssH2doZ TssL2doV Hold Time of SDIx Data Input to SCKx Edge SSx to SDOX Output High-Impedance SDOx Data Output Valid after SSx Edge These parameters are characterized but not tested in manufacturing. Assumes 50 pF load on all SPIx pins. TABLE 25-15: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic LPRC @ 32.768 kHz(1,2) HF21 Note 1: 2: LPRC -70 -- +70 % -40C TA +150C VDD = 3.0-3.6V Change of LPRC frequency as VDD changes. LPRC accuracy impacts the Watchdog Timer Time-out Period (TWDT1). See Section 21.4 "Watchdog Timer (WDT)" for more information. Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for Extended Min Typ Max Units Conditions (c) 2011 Microchip Technology Inc. DS70283H-page 285 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-16: ADC MODULE SPECIFICATIONS AC CHARACTERISTICS Param No. HAD08 Note 1: 2: Symbol Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40C TA +150C for High Temperature Characteristic Min Typ Max Units Conditions Reference Inputs IREF Current Drain -- -- 250 -- 600 50 A A ADC operating, See Note 1 ADC off, See Note 1 These parameters are not characterized or tested in manufacturing. These parameters are characterized, but are not tested in manufacturing. TABLE 25-17: ADC MODULE SPECIFICATIONS (12-BIT MODE)(3) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. HAD20a HAD21a HAD22a HAD23a HAD24a Symbol Characteristic Min Typ Max Units Conditions ADC Accuracy (12-bit Mode) - Measurements with External VREF+/VREF-(1) Nr INL DNL GERR EOFF Resolution(3) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error -2 > -1 -2 -3 12 data bits -- -- -- -- +2 <1 10 4 bits LSb LSb LSb LSb -- VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V -- VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V -- ADC Accuracy (12-bit Mode) - Measurements with Internal VREF+/VREF-(1) HAD20a HAD21a HAD22a HAD23a HAD24a HAD33a Note 1: 2: 3: Nr INL DNL GERR EOFF FNYQ Resolution(3) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Input Signal Bandwidth -2 > -1 2 2 -- 12 data bits -- -- -- -- -- +2 <1 20 10 200 bits LSb LSb LSb LSb kHz Dynamic Performance (12-bit Mode)(2) These parameters are characterized, but are tested at 20 ksps only. These parameters are characterized by similarity, but are not tested in manufacturing. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. DS70283H-page 286 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-18: ADC MODULE SPECIFICATIONS (10-BIT MODE)(3) Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions ADC Accuracy (10-bit Mode) - Measurements with External VREF+/VREF-(1) HAD20b Nr HAD21b INL HAD22b DNL HAD23b GERR HAD24b EOFF Resolution(3) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error -3 > -1 -5 -1 10 data bits -- -- -- -- 3 <1 6 5 bits LSb LSb LSb LSb -- VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3.6V -- VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V VINL = AVSS = 0V, AVDD = 3.6V -- ADC Accuracy (10-bit Mode) - Measurements with Internal VREF+/VREF-(1) HAD20b Nr HAD21b INL HAD22b DNL HAD23b GERR HAD24b EOFF HAD33b FNYQ Note 1: 2: 3: Resolution(3) Integral Nonlinearity Differential Nonlinearity Gain Error Offset Error Input Signal Bandwidth -2 > -1 -5 -1.5 -- 10 data bits -- -- -- -- -- 2 <1 15 7 400 bits LSb LSb LSb LSb kHz Dynamic Performance (10-bit Mode)(2) These parameters are characterized, but are tested at 20 ksps only. These parameters are characterized by similarity, but are not tested in manufacturing. Injection currents > | 0 | can affect the ADC results by approximately 4-6 counts. (c) 2011 Microchip Technology Inc. DS70283H-page 287 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE 25-19: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions Clock Parameters HAD50 HAD56 Note 1: TAD FCNV ADC Clock Period(1) Throughput Rate(1) 147 Conversion Rate -- -- 400 Ksps -- These parameters are characterized but not tested in manufacturing. -- -- ns -- TABLE 25-20: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) AC CHARACTERISTICS Operating temperature -40C TA +150C for High Temperature Param No. Symbol Characteristic Min Typ Max Units Conditions Clock Parameters HAD50 HAD56 Note 1: TAD FCNV ADC Clock Period(1) 104 -- -- -- -- 800 ns Ksps -- -- Conversion Rate Throughput Rate(1) These parameters are characterized but not tested in manufacturing. DS70283H-page 288 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 26.0 26.1 PACKAGING INFORMATION Package Marking Information 28-Lead SPDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example dsPIC33FJ32MC 202-E/SP e3 0730235 28-Lead SOIC XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example dsPIC33FJ32MC 202-E/SO e3 0730235 28-Lead SSOP XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example 33FJ32MC 202-E/SS e3 0730235 Legend: XX...X Y YY WW NNN * e3 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2011 Microchip Technology Inc. DS70283H-page 289 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 26.1 Package Marking Information (Continued) Example 28-Lead QFN-S XXXXXXXX XXXXXXXX YYWWNNN 33FJ32MC 202EML e3 0730235 44-Lead QFN Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN dsPIC33FJ32 MC204-E/ML e3 0730235 44-Lead TQFP Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN dsPIC33FJ 32MC204 -E/PT e3 0730235 Legend: XX...X Y YY WW NNN * e3 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information. DS70283H-page 290 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 26.2 Package Details 28-Lead Skinny Plastic Dual In-Line (SP) - 300 mil Body [SPDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 3 D E A A2 L c eB A1 b1 b e Units Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing N e A A2 A1 E E1 D L c b1 b eB - .120 .015 .290 .240 1.345 .110 .008 .040 .014 - MIN INCHES NOM 28 .100 BSC - .135 - .310 .285 1.365 .130 .010 .050 .018 - .200 .150 - .335 .295 1.400 .150 .015 .070 .022 MAX .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-070B (c) 2011 Microchip Technology Inc. DS70283H-page 291 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 28-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 123 e b h h c A A2 L A1 L1 Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Top Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom N e A A2 A1 E E1 D h L L1 c b 0 0.18 0.31 5 5 0.25 0.40 - 2.05 0.10 MIN MILLMETERS NOM 28 1.27 BSC - - - 10.30 BSC 7.50 BSC 17.90 BSC - - 1.40 REF - - - - - 8 0.33 0.51 15 0.75 1.27 2.65 - 0.30 MAX 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-052B DS70283H-page 292 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging (c) 2011 Microchip Technology Inc. DS70283H-page 293 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 /HDG 3ODVWLF 6KULQN 6PDOO 2XWOLQH 66 PP %RG\ >6623@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 12 NOTE 1 b e c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page 294 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging (c) 2011 Microchip Technology Inc. DS70283H-page 295 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 /HDG 3ODVWLF 4XDG )ODW 1R /HDG 3DFNDJH 00 [[ PP %RG\ >4)16@ ZLWK PP &RQWDFW /HQJWK 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D D2 EXPOSED PAD e E2 E b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page 296 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 /HDG 3ODVWLF 4XDG )ODW 1R /HDG 3DFNDJH 00 [[ PP %RG\ >4)16@ ZLWK PP &RQWDFW /HQJWK 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ (c) 2011 Microchip Technology Inc. DS70283H-page 297 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D EXPOSED PAD D2 e E E2 b 2 1 N TOP VIEW NOTE 1 2 1 N L BOTTOM VIEW K A A3 A1 Units Dimension Limits Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Width Exposed Pad Width Overall Length Exposed Pad Length Contact Width Contact Length Contact-to-Exposed Pad N e A A1 A3 E E2 D D2 b L K 6.30 0.25 0.30 0.20 6.30 0.80 0.00 MIN MILLIMETERS NOM 44 0.65 BSC 0.90 0.02 0.20 REF 8.00 BSC 6.45 8.00 BSC 6.45 0.30 0.40 - 6.80 0.38 0.50 - 6.80 1.00 0.05 MAX Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-103B DS70283H-page 298 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 /HDG 3ODVWLF 4XDG )ODW 1R /HDG 3DFNDJH 0/ [ PP %RG\ >4)1@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ (c) 2011 Microchip Technology Inc. DS70283H-page 299 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 E e E1 N b NOTE 1 123 NOTE 2 A c A1 L L1 A2 Units Dimension Limits Number of Leads Lead Pitch Overall Height Molded Package Thickness Standoff Foot Length Footprint Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom N e A A2 A1 L L1 E D E1 D1 c b 0.09 0.30 11 11 0 - 0.95 0.05 0.45 MIN MILLIMETERS NOM 44 0.80 BSC - 1.00 - 0.60 1.00 REF 3.5 12.00 BSC 12.00 BSC 10.00 BSC 10.00 BSC - 0.37 12 12 0.20 0.45 13 13 7 1.20 1.05 0.15 0.75 MAX Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-076B DS70283H-page 300 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 /HDG 3ODVWLF 7KLQ 4XDG )ODWSDFN 37 [[ PP %RG\ PP >74)3@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWSZZZPLFURFKLSFRPSDFNDJLQJ (c) 2011 Microchip Technology Inc. DS70283H-page 301 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 NOTES: DS70283H-page 302 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 APPENDIX A: REVISION HISTORY * The following tables in Section 24.0 "Electrical Characteristics" have been updated with preliminary values: - Updated Max MIPS for -40C to +125C Temp Range (see Table 24-1) - Updated parameter DC18 (see Table 24-4) - Added new parameters for +125C, and updated Typical and Max values for most parameters (see Table 24-5) - Added new parameters for +125C, and updated Typical and Max values for most parameters (see Table 24-6) - Added new parameters for +125C, and updated Typical and Max values for most parameters (see Table 24-7) - Added new parameters for +125C, and updated Typical and Max values for most parameters (see Table 24-8) - Updated parameter DI51, added parameters DI51a, DI51b, and DI51c (see Table 24-9) - Added Note 1 (see Table 24-11) - Updated parameters OS10 and OS30 (see Table 24-16) - Updated parameter OS52 (see Table 24-17) - Updated parameter F20, added Note 2 (see Table 24-18) - Updated parameter F21 (see Table 24-19) - Updated parameter TA15 (see Table 24-22) - Updated parameter TB15 (see Table 24-23) - Updated parameter TC15 (see Table 24-24) - Updated parameter IC15 (see Table 24-26) - Updated parameters AD05, AD06, AD07, AD08, AD10 through AD13 and AD17; added parameters AD05a and AD06a; added Note 2; modified ADC Accuracy headings to include measurement information (see Table 24-38) - Separated the ADC Module Specifications table into three tables (see Table 24-38, Table 24-39, and Table 24-40) - Updated parameter AD50 (see Table 24-41) - Updated parameters AD50 and AD57 (see Table 24-42) Revision A (February 2007) Initial release of this document. Revision B (May 2007) This revision includes the following corrections and updates: * Minor typographical and formatting corrections throughout the data sheet text. * New content: - Addition of bullet item (16-word conversion result buffer) (see Section 20.1 "Key Features") * Updated register map information for RPINR14 and RPINR15 (see Table 4-16) * Figure updates: - Updated Oscillator System Diagram (see Figure 8-1) - Updated WDT Block Diagram (see Figure 21-2) * Equation update: - Serial Clock Rate (see Equation 17-1) * Register updates: - Peripheral Pin Select Input Registers (see Register 10-1 through Register 10-13) - Updated ADC1 Input Channel 0 Select register (see Register 20-5) (c) 2011 Microchip Technology Inc. DS70283H-page 303 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Revision C (June 2008) This revision includes minor typographical and formatting changes throughout the data sheet text. The major changes are referenced by their respective section in the following table. TABLE A-1: MAJOR SECTION UPDATES Update Description Added Extended Interrupts column to Remappable Peripherals in the Controller Families table and Note 3 (see Table 1). Added Note 1 to all pin diagrams, which references RPn pin usage by remappable peripherals (see "Pin Diagrams"). Section Name "High-Performance, 16-bit Digital Signal Controllers" Section 1.0 "Device Overview" Section 4.0 "Memory Organization" Changed PORTA pin name from RA15 to RA10 (see Table 1-1). Added SFR definitions (ACCAL, ACCAH, ACCAU, ACCBL, ACCBH, and ACCBU) to the CPU Core Register Map (see Table 4-1). Updated Reset value for CORCON (see Table 4-1). Updated Reset values for the following SFRs: IPC1, IPC3-IPC5, IPC7, IPC16, and INTTREG (see Table 4-4). Updated all SFR names in QEI1 Register Map (see Table 4-10). Updated the bit range for AD1CON3 from ADCS<5:0> to ADCS<7:0>) (see Table 4-14 and Table 4-15). Updated the Reset value for CLKDIV in the System Control Register Map (see Table 4-23). Section 6.0 "Resets" Section 8.0 "Oscillator Configuration" Entire section was replaced to maintain consistency with other dsPIC33F data sheets. Removed the first sentence of the third clock source item (External Clock) in Section 8.1.1.2 "Primary". Updated the default bit values for DOZE and FRCDIV in the Clock Divisor Register (see Register 8-2). Added the center frequency in the OSCTUN register for the FRC Tuning bits (TUN<5:0>) value 011111 and updated the center frequency for bits value 011110 (see Register 8-4). Section 9.0 "Power-Saving Features" Added the following two registers: * PMD1: Peripheral Module Disable Control Register 1 * PMD2: Peripheral Module Disable Control Register 2 * PMD3: Peripheral Module Disable Control Register 3 Added paragraph and Table 10-1 to Section 10.2 "Open-Drain Configuration", which provides details on I/O pins and their functionality. Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * 9.4.2 "Available Peripherals" * 9.4.3.3 "Mapping" * 9.4.5 "Considerations for Peripheral Pin Selection" Section 10.0 "I/O Ports" Section 14.0 "Output Compare" Replaced sections 13.1, 13.2, and 13.3 and related figures and tables with entirely new content. DS70283H-page 304 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE A-1: MAJOR SECTION UPDATES (CONTINUED) Update Description Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * * * * * * * * * * * * * * * * Section 16.0 "Quadrature Encoder Interface (QEI) Module" 14.3 "PWM Time Base" 14.4 "PWM Period" 14.5 "Edge-Aligned PWM" 14.6 "Center-Aligned PWM" 14.7 "PWM Duty Cycle Comparison Units" 14.8 "Complementary PWM Operation" 14.9 "Dead-Time Generators" 14.10 "Independent PWM Output" 14.11 "Single Pulse PWM Operation" 14.12 "PWM Output Override" 14.13 "PWM Output and Polarity Control" 14.14 "PWM Fault Pins" 14.15 "PWM Update Lockout" 14.16 "PWM Special Event Trigger" 14.17 "PWM Operation During CPU Sleep Mode" 14.18 "PWM Operation During CPU Idle Mode" Section Name Section 15.0 "Motor Control PWM Module" Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * * * * * * * * 15.1 "Quadrature Encoder Interface Logic" 15.2 "16-bit Up/Down Position Counter Mode" 15.3 "Position Measurement Mode" 15.4 "Programmable Digital Noise Filters" 15.5 "Alternate 16-bit Timer/Counter" 15.6 QEI Module Operation During CPU Sleep Mode" 15.7 "QEI Module Operation During CPU Idle Mode" 15.8 "Quadrature Encoder Interface Interrupts" Section 17.0 "Serial Peripheral Interface (SPI)" Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * * * * 16.1 "Interrupts" 16.2 "Receive Operations" 16.3 "Transmit Operations" 16.4 "SPI Setup" (retained Figure 17-1: SPI Module Block Diagram) (c) 2011 Microchip Technology Inc. DS70283H-page 305 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE A-1: MAJOR SECTION UPDATES (CONTINUED) Update Description Removed the following sections, which are now available in the related section of the dsPIC33F/PIC24H Family Reference Manual: * * * * * * * * * * * * 17.3 "I2C Interrupts" 17.4 "Baud Rate Generator" (retained Figure 15-1: I2C Block Diagram) 17.5 "I2C Module Addresses" 17.6 "Slave Address Masking" 17.7 "IPMI Support" 17.8 "General Call Address Support" 17.9 "Automatic Clock Stretch" 17.10 "Software Controlled Clock Stretching (STREN = 1)" 17.11 "Slope Control" 17.12 "Clock Arbitration" 17.13 "Multi-Master Communication, Bus Collision, and Bus Arbitration" 17.14 "Peripheral Pin Select Limitations" Section Name Section 18.0 "Inter-Integrated CircuitTM (I2CTM)" Section 19.0 "Universal Removed the following sections, which are now available in the related Asynchronous Receiver Transmitter section of the dsPIC33F/PIC24H Family Reference Manual: (UART)" * 18.1 "UART Baud Rate Generator" * 18.2 "Transmitting in 8-bit Data Mode" * 18.3 "Transmitting in 9-bit Data Mode" * 18.4 "Break and Sync Transmit Sequence" * 18.5 "Receiving in 8-bit or 9-bit Data Mode" * 18.6 "Flow Control Using UxCTS and UxRTS Pins" * 18.7 "Infrared Support" Removed IrDA references and Note 1, and updated the bit and bit value descriptions for UTXINV (UxSTA<14>) in the UARTx Status and Control Register (see Register 19-2). Section 20.0 "10-bit/12-bit Analog-to-Digital Converter (ADC)" Removed Equation 19-1: ADC Conversion Clock Period and Figure 19-2: ADC Transfer Function (10-Bit Example). Added ADC1 Module Block Diagram for dsPIC33FJ16MC304 and dsPIC33FJ32MC204 Devices (Figure 20-1) and ADC1 Module Block Diagram FOR dsPIC33FJ32MC202 Devices (Figure 20-2). Added Note 2 to Figure 20-3: ADC Conversion Clock Period Block Diagram. Updated ADC Conversion Clock Select bits in the AD1CON3 register from ADCS<5:0> to ADCS<7:0>. Any references to these bits have also been updated throughout this data sheet (Register 20-3). Added device-specific information to Note 1 in the ADC1 Input Scan Select Register Low (see Register 20-6), and updated the default bit value for bits 12-10 (CSS12-CSS10) from U-0 to R/W-0. Added device-specific information to Note 1 in the ADC1 Port Configuration Register Low (see Register 20-7), and updated the default bit value for bits 12-10 (PCFG12-PCFG10) from U-0 to R/W-0. DS70283H-page 306 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE A-1: MAJOR SECTION UPDATES (CONTINUED) Update Description Added FICD register information for address 0xF8000E in the Device Configuration Register Map (see Table 21-1). Added FICD register content (BKBUG, COE, JTAGEN, and ICS<1:0> to the dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Configuration Bits Description (see Table 21-2). Added a note regarding the placement of low-ESR capacitors, after the second paragraph of Section 21.2 "On-Chip Voltage Regulator" and to Figure 19-1. Removed the words "if enabled" from the second sentence in the fifth paragraph of Section 21.3 "BOR: Brown-Out Reset". Section 24.0 "Electrical Characteristics" Updated Max MIPS value for -40C to +125C temperature range in Operating MIPS vs. Voltage (see Table 24-1). Removed Typ value for parameter DC12 (see Table 24-4). Updated MIPS conditions for parameters DC24c, DC44c, DC72a, DC72f and DC72g (see Table 24-5, Table 24-6, and Table 24-8). Added Note 4 (reference to new table containing digital-only and analog pin information to I/O Pin Input Specifications (see Table 24-4). Updated Typ, Min and Max values for Program Memory parameters D136, D137 and D138 (see Table 24-12). Updated Max value for Internal RC Accuracy parameter F21 for -40C TA +125C condition and added Note 2 (see Table 24-19). Removed all values for Reset, Watchdog Timer, Oscillator Start-up Timer, and Power-up Timer parameter SY20 and updated conditions, which now refers to Section 21.4 "Watchdog Timer (WDT)" and LPRC parameter F21a (see Table 24-21). Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63 and removed Note 3 (see Table 24-41). Updated Min and Typ values for parameters AD60, AD61, AD62 and AD63 and removed Note 3 (see Table 24-42). Section Name Section 21.0 "Special Features" (c) 2011 Microchip Technology Inc. DS70283H-page 307 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Revision D (December 2008) This revision includes minor typographical and formatting changes throughout the data sheet text. The major changes are referenced by their respective section in the following table. TABLE A-2: MAJOR SECTION UPDATES Update Description Updated all pin diagrams to denote the pin voltage tolerance (see "Pin Diagrams"). Added new section to the data sheet that provides guidelines on getting started with 16-bit Digital Signal Controllers. Updated 5V tolerant status for I/O pin RB4 from Yes to No (see Table 10-1). Removed the maximum value for parameter DC12 (RAM Data Retention Voltage) in Table 24-4. Updated typical values for Operating Current (IDD) and added Note 3 in Table 24-5. Updated typical and maximum values for Idle Current (IIDLE): Core OFF Clock ON Base Current and added Note 3 in Table 24-6. Updated typical and maximum values for Power Down Current (IPD) and added Note 5 in Table 24-7. Updated typical and maximum values for Doze Current (IDOZE) and added Note 2 in Table 24-8. Added Note 3 to Table 24-12. Updated minimum value for Internal Voltage Regulator Specifications in Table 24-13. Added parameter OS42 (GM) and Notes 4, 5 and 6 to Table 24-16. Added Notes 2 and 3 to Table 24-17. Added Note 2 to Table 24-20. Added Note 2 to Table 24-21. Added Note 2 to Table 24-22. Added Note 1 to Table 24-23. Added Note 1 to Table 24-24. Added Note 3 to Table 24-36. Added Note 2 to Table 24-37. Updated typical value for parameter AD08 (ADC in operation) and added Notes 2 and 3 in Table 24-38. Updated minimum, typical, and maximum values for parameters AD23a, AD24a, AD30a, AD32a, AD32a and AD34a, and added Notes 2 and 3 in Table 24-39. Updated minimum, typical, and maximum values for parameters AD23b, AD24b, AD30b, AD32b, AD32b and AD34b, and added Notes 2 and 3 in Table 24-40. Section Name "High-Performance, 16-bit Digital Signal Controllers" Section 2.0 "Guidelines for Getting Started with 16-bit Digital Signal Controllers" Section 10.0 "I/O Ports" Section 24.0 "Electrical Characteristics" DS70283H-page 308 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Revision E (June 2009) This revision includes minor typographical and formatting changes throughout the data sheet text. Global changes include: * Changed all instances of OSCI to OSC1 and OSCO to OSC2 * Changed all instances of PGCx/EMUCx and PGDx/EMUDx (where x = 1, 2 or 3) to PGECx and PGEDx Changed all instances of VDDCORE and VDDCORE/VCAP to VCAP/VDDCORE All other major changes are referenced by their respective section in the following table. TABLE A-3: MAJOR SECTION UPDATES Section Name Update Description Added Note 2 to the 28-Pin QFN-S and 44-Pin QFN pin diagrams, which references pin connections to VSS. Updated addresses for interrupt vectors 80, 81, 82 and 83-125 (see Table 7-1). Updated the Oscillator System Diagram (see Figure 8-1). Added Note 1 to the Oscillator Tuning register (OSCTUN) (see Register 8-4). "High-Performance, 16-bit Digital Signal Controllers" Section 7.0 "Interrupt Controller" Section 8.0 "Oscillator Configuration" Section 10.0 "I/O Ports" Removed Table 10-1 and added reference to pin diagrams for I/O pin availability and functionality. Updated the UTXINV bit settings in the UxSTA register and added Note 1 (see Register 19-2). Updated the Min value for parameter DC12 (RAM Retention Voltage) and added Note 4 to the DC Temperature and Voltage Specifications (see Table 24-4). Updated the Min value for parameter DI35 (see Table 24-20). Updated AD08 and added reference to Note 2 for parameters AD05a, AD06a and AD08a (see Table 24-38). Section 17.0 "Serial Peripheral Interface (SPI)" Added Note 2 to the SPIx Control Register 1 (see Register 17-2). Section 19.0 "Universal Asynchronous Receiver Transmitter (UART)" Section 24.0 "Electrical Characteristics" (c) 2011 Microchip Technology Inc. DS70283H-page 309 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Revision F (November 2009) The revision includes the following global update: * Added Note 2 to the shaded table that appears at the beginning of each chapter. This new note provides information regarding the availability of registers and their associated bits This revision also includes minor typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE A-4: MAJOR SECTION UPDATES Section Name Update Description Added information on high temperature operation (see "Operating Range:"). Changed the reference to digital-only pins to 5V tolerant pins in the second paragraph of Section 10.2 "Open-Drain Configuration". Updated the two baud rate range features to: 10 Mbps to 38 bps at 40 MIPS. Updated the ADC1 block diagrams (see Figure 20-1 and Figure 20-2). Updated the second paragraph and removed the fourth paragraph in Section 21.1 "Configuration Bits". Updated the Device Configuration Register Map (see Table 21-1). "High-Performance, 16-bit Digital Signal Controllers" Section 10.0 "I/O Ports" Section 19.0 "Universal Asynchronous Receiver Transmitter (UART)" Section 20.0 "10-bit/12-bit Analog-to-Digital Converter (ADC)" Section 21.0 "Special Features" Section 24.0 "Electrical Characteristics" Updated the Absolute Maximum Ratings for high temperature and added Note 4. Updated the SPIx Module Slave Mode (CKE = 1) Timing Characteristics (see Figure 24-17). Updated the Internal RC Accuracy parameter numbers (see Table 24-18 and Table 24-19). Section 25.0 "High Temperature Electrical Characteristics" "Product Identification System" Added new chapter with high temperature specifications. Added the "H" definition for high temperature. Revision G (November 2009) This revision includes minor typographical and formatting changes throughout the data sheet text. All other major changes are referenced by their respective section in the following table. TABLE A-5: MAJOR SECTION UPDATES Section Name Update Description Updated MIPS rating from 16 to 20 for high temperature devices in "Operating Range:" and in Table 25-1: Operating MIPS vs. Voltage. Section 25.0 "High Temperature Electrical Characteristics" DS70283H-page 310 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Revision H (February 2011) This revision includes typographical and formatting changes throughout the data sheet text. In addition, all instances of VDDCORE have been removed. All other major changes are referenced by their respective section in the following table. TABLE A-6: MAJOR SECTION UPDATES Section Name Update Description Added the SSOP package information (see "Packaging:", Table 1, and "Pin Diagrams"). Updated the title of Section 2.3 "CPU Logic Filter Capacitor Connection (Vcap)". The frequency limitation for device PLL start-up conditions was updated in Section 2.7 "Oscillator Value Conditions on Device Start-up". The second paragraph in Section 2.9 "Unused I/Os" was updated. High-Performance, 16-bit Digital Signal Controllers Section 2.0 "Guidelines for Getting Started with 16-bit Digital Signal Controllers" Section 3.0 "CPU" Section 4.0 "Memory Organization" Removed references to DMA in the CPU Core Block Diagram (see Figure 3-1). Updated the data memory reference in the third paragraph in Section 4.2 "Data Address Space". All Resets values for the following SFRs in the Timer Register Map were changed (see Table 4-5): * TMR1 * TMR2 * TMR3 Section 8.0 "Oscillator Configuration" Added Note 3 to the OSCCON: Oscillator Control Register (see Register 8-1). Added Note 2 to the CLKDIV: Clock Divisor Register (see Register 8-2). Added Note 1 to the PLLFBD: PLL Feedback Divisor Register (see Register 8-3). Added Note 2 to the OSCTUN: FRC Oscillator Tuning Register (see Register 8-4). Section 20.0 "10-bit/12-bit Analog-to-Digital Updated the VREFL references in the ADC1 module block diagrams Converter (ADC)" (see Figure 20-1 and Figure 20-2). Section 21.0 "Special Features" Added a new paragraph and removed the third paragraph in Section 21.1 "Configuration Bits". Added the column "RTSP Effects" to the Configuration Bits Descriptions (see Table 21-2). (c) 2011 Microchip Technology Inc. DS70283H-page 311 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 TABLE A-6: MAJOR SECTION UPDATES (CONTINUED) Section Name Section 24.0 "Electrical Characteristics" Update Description Added the 28-pin SSOP Thermal Packaging Characteristics (see Table 24-3). Removed Note 4 from the DC Temperature and Voltage Specifications (see Table 24-4). Updated the maximum value for parameter DI19 and added parameters DI28, DI29, DI60a, DI60b, and DI60c to the I/O Pin Input Specifications (see Table 24-9). Updated Note 3 of the PLL Clock Timing Specifications (see Table 24-17). Removed Note 2 from the AC Characteristics: Internal RC Accuracy (see Table 24-18). Updated the characteristic description for parameter DI35 in the I/O Timing Requirements (see Table 24-20). Updated all SPI specifications (see Table 24-32 through Table 24-39 and Figure 24-14 through Figure 24-21). Added Note 4 to the 12-bit mode ADC Module Specifications (see Table 24-43). Added Note 4 to the 10-bit mode ADC Module Specifications (see Table 24-44). Section 25.0 "High Temperature Electrical Characteristics" Updated all ambient temperature and range values to +150C throughout the chapter. Updated the storage temperature and range to +160C. Updated the maximum junction temperature from +145C to +155C. Updated Note 1 in the PLL Clock Timing Specifications (see Table 25-10). Added Note 3 to the 12-bit Mode ADC Module Specifications (see Table 25-17). Added Note 3 to the 10-bit Mode ADC Module Specifications (see Table 25-18). Section 26.0 "Packaging Information" Added the 28-Lead SSOP package information (see Section 26.1 "Package Marking Information" and Section 26.2 "Package Details"). Added the "SS" definition for the SSOP package. "Product Identification System" DS70283H-page 312 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 INDEX A AC Characteristics .................................................... 242, 274 ADC Module.............................................................. 277 ADC Module (10-bit Mode) ....................................... 278 ADC Module (12-bit Mode) ....................................... 277 Internal RC Accuracy ................................................ 244 Load Conditions ................................................ 242, 274 ADC Initialization ............................................................... 199 Key Features............................................................. 199 ADC Module ADC1 Register Map for dsPIC33FJ32MC202 ............ 42 ADC1 Register Map for dsPIC33FJ32MC204 and dsPIC33FJ16MC304 .......................................... 43 Alternate Interrupt Vector Table (AIVT) .............................. 71 Analog-to-Digital Converter (ADC).................................... 199 Arithmetic Logic Unit (ALU)................................................. 25 Assembler MPASM Assembler................................................... 228 Configuration Register Map .............................................. 211 Configuring Analog Port Pins............................................ 120 CPU Control Register.......................................................... 22 CPU Clocking System ...................................................... 104 PLL Configuration..................................................... 104 Selection................................................................... 104 Sources .................................................................... 104 Customer Change Notification Service............................. 303 Customer Notification Service .......................................... 303 Customer Support............................................................. 303 D Data Accumulators and Adder/Subtracter .......................... 27 Data Space Write Saturation ...................................... 29 Overflow and Saturation ............................................. 27 Round Logic ............................................................... 28 Write Back .................................................................. 28 Data Address Space........................................................... 33 Alignment.................................................................... 33 Memory Map for dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Devices with 2 KBs RAM . 34 Near Data Space ........................................................ 33 Software Stack ........................................................... 48 Width .......................................................................... 33 DC Characteristics............................................................ 232 Doze Current (IDOZE)................................................ 273 High Temperature..................................................... 272 I/O Pin Input Specifications ...................................... 237 I/O Pin Output........................................................... 273 I/O Pin Output Specifications.................................... 240 Idle Current (IDOZE) .................................................. 236 Idle Current (IIDLE) .................................................... 235 Operating Current (IDD) ............................................ 234 Operating MIPS vs. Voltage ..................................... 272 Power-Down Current (IPD)........................................ 236 Power-down Current (IPD) ........................................ 272 Program Memory.............................................. 241, 273 Temperature and Voltage......................................... 272 Temperature and Voltage Specifications.................. 233 Thermal Operating Conditions.................................. 272 Development Support ....................................................... 227 Doze Mode ....................................................................... 114 DSP Engine ........................................................................ 25 Multiplier ..................................................................... 27 B Barrel Shifter ....................................................................... 29 Bit-Reversed Addressing .................................................... 51 Example ...................................................................... 52 Implementation ........................................................... 51 Sequence Table (16-Entry)......................................... 52 Block Diagrams 16-bit Timer1 Module ................................................ 145 A/D Module ....................................................... 200, 201 Connections for On-Chip Voltage Regulator............. 215 Device Clock ............................................................. 103 DSP Engine ................................................................ 26 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 .. 12 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 CPU Core ........................................................... 20 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 PLL 105 Input Capture ............................................................ 153 Output Compare ....................................................... 155 PLL............................................................................ 105 PWM Module .................................................... 160, 161 Quadrature Encoder Interface .................................. 173 Reset System.............................................................. 63 Shared Port Structure ............................................... 119 SPI ............................................................................ 179 Timer2 (16-bit) .......................................................... 149 Timer2/3 (32-bit) ....................................................... 148 UART ........................................................................ 193 Watchdog Timer (WDT) ............................................ 216 E Electrical Characteristics .................................................. 231 AC..................................................................... 242, 274 Equations Device Operating Frequency.................................... 104 Errata .................................................................................. 10 C C Compilers MPLAB C18 .............................................................. 228 Clock Switching................................................................. 111 Enabling .................................................................... 111 Sequence.................................................................. 111 Code Examples Erasing a Program Memory Page............................... 61 Initiating a Programming Sequence............................ 62 Loading Write Buffers ................................................. 62 Port Write/Read ........................................................ 120 PWRSAV Instruction Syntax..................................... 113 Code Protection ........................................................ 211, 218 Configuration Bits.............................................................. 211 F Fail-Safe Clock Monitor .................................................... 111 Flash Program Memory ...................................................... 57 Control Registers........................................................ 58 Operations .................................................................. 58 Programming Algorithm.............................................. 61 RTSP Operation ......................................................... 58 Table Instructions ....................................................... 57 Flexible Configuration ....................................................... 211 (c) 2011 Microchip Technology Inc. DS70283H-page 313 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 H High Temperature Electrical Characteristics..................... 271 6-Output Register Map for dsPIC33FJ12MC202........ 40 MPLAB ASM30 Assembler, Linker, Librarian ................... 228 MPLAB Integrated Development Environment Software.. 227 MPLAB PM3 Device Programmer .................................... 230 MPLAB REAL ICE In-Circuit Emulator System ................ 229 MPLINK Object Linker/MPLIB Object Librarian ................ 228 I I/O Ports ............................................................................ 119 Parallel I/O (PIO)....................................................... 119 Write/Read Timing .................................................... 120 I2 C Addresses ................................................................. 186 Operating Modes ...................................................... 185 Registers ................................................................... 185 Software Controlled Clock Stretching (STREN = 1).. 186 I2C Module I2C1 Register Map ...................................................... 41 In-Circuit Debugger ........................................................... 217 In-Circuit Emulation........................................................... 211 In-Circuit Serial Programming (ICSP) ....................... 211, 217 Input Capture .................................................................... 153 Registers ................................................................... 154 Input Change Notification.................................................. 120 Instruction Addressing Modes............................................. 48 File Register Instructions ............................................ 48 Fundamental Modes Supported.................................. 49 MAC Instructions......................................................... 49 MCU Instructions ........................................................ 48 Move and Accumulator Instructions ............................ 49 Other Instructions........................................................ 49 Instruction Set Overview ................................................................... 222 Summary................................................................... 219 Instruction-Based Power-Saving Modes ........................... 113 Idle ............................................................................ 114 Sleep ......................................................................... 113 Interfacing Program and Data Memory Spaces .................. 53 Internal RC Oscillator Use with WDT ........................................................... 216 Internet Address................................................................ 303 Interrupt Control and Status Registers................................ 75 IECx ............................................................................ 75 IFSx............................................................................. 75 INTCON1 .................................................................... 75 INTCON2 .................................................................... 75 IPCx ............................................................................ 75 Interrupt Setup Procedures ............................................... 101 Initialization ............................................................... 101 Interrupt Disable........................................................ 101 Interrupt Service Routine .......................................... 101 Trap Service Routine ................................................ 101 Interrupt Vector Table (IVT) ................................................ 71 Interrupts Coincident with Power Save Instructions.......... 114 N NVM Module Register Map .............................................................. 47 O Open-Drain Configuration................................................. 120 Oscillator Configuration .................................................... 103 Output Compare ............................................................... 155 P Packaging ......................................................................... 281 Details....................................................................... 282 Marking ..................................................................... 281 Peripheral Module Disable (PMD) .................................... 114 Pinout I/O Descriptions (table)............................................ 13 PMD Module Register Map .............................................................. 47 PORTA Register Map for dsPIC33FJ32MC202....................... 45 Register Map for dsPIC33FJ32MC204 and dsPIC33FJ16MC304 .......................................... 45 PORTB Register Map .............................................................. 46 PORTC Register Map dsPIC33FJ32MC204 and dsPIC33FJ16MC304 .......................................... 46 Power-on Reset (POR)....................................................... 68 Power-Saving Features .................................................... 113 Clock Frequency and Switching ............................... 113 Program Address Space..................................................... 31 Construction ............................................................... 53 Data Access from Program Memory Using Program Space Visibility..................................... 56 Data Access from Program Memory Using Table Instructions ..................................... 55 Data Access from, Address Generation ..................... 54 Memory Map............................................................... 31 Table Read Instructions TBLRDH ............................................................. 55 TBLRDL.............................................................. 55 Visibility Operation ...................................................... 56 Program Memory Interrupt Vector ........................................................... 32 Organization ............................................................... 32 Reset Vector ............................................................... 32 PWM Time Base............................................................... 162 J JTAG Boundary Scan Interface ........................................ 211 JTAG Interface .................................................................. 217 Q Quadrature Encoder Interface (QEI)................................. 173 Quadrature Encoder Interface (QEI) Module Register Map .............................................................. 41 M Memory Organization.......................................................... 31 Microchip Internet Web Site .............................................. 303 Modulo Addressing ............................................................. 50 Applicability ................................................................. 51 Operation Example ..................................................... 50 Start and End Address ................................................ 50 W Address Register Selection .................................... 50 Motor Control PWM........................................................... 159 Motor Control PWM Module 2-Output Register Map................................................ 40 R Reader Response............................................................. 304 Registers AD1CHS0 (ADC1 Input Channel 0 Select ................ 209 AD1CHS123 (ADC1 Input Channel 1, 2, 3 Select)... 207 AD1CON1 (ADC1 Control 1) .................................... 203 AD1CON2 (ADC1 Control 2) .................................... 205 AD1CON3 (ADC1 Control 3) .................................... 206 DS70283H-page 314 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 AD1CSSL (ADC1 Input Scan Select Low)................ 210 AD1PCFGL (ADC1 Port Configuration Low) ............ 210 CLKDIV (Clock Divisor)............................................. 108 CORCON (Core Control) ...................................... 24, 76 DFLTCON (QEI Control)........................................... 177 I2CxCON (I2Cx Control) ........................................... 187 I2CxMSK (I2Cx Slave Mode Address Mask) ............ 191 I2CxSTAT (I2Cx Status) ........................................... 189 ICxCON (Input Capture x Control) ............................ 154 IEC0 (Interrupt Enable Control 0) ............................... 85 IEC1 (Interrupt Enable Control 1) ............................... 87 IEC3 (Interrupt Enable Control 3) ............................... 88 IEC4 (Interrupt Enable Control 4) ............................... 89 IFS0 (Interrupt Flag Status 0) ..................................... 80 IFS1 (Interrupt Flag Status 1) ..................................... 82 IFS3 (Interrupt Flag Status 3) ..................................... 83 IFS4 (Interrupt Flag Status 4) ..................................... 84 INTCON1 (Interrupt Control 1).................................... 77 INTCON2 (Interrupt Control 2).................................... 79 INTTREG Interrupt Control and Status Register....... 100 IPC0 (Interrupt Priority Control 0) ............................... 90 IPC1 (Interrupt Priority Control 1) ............................... 91 IPC14 (Interrupt Priority Control 14) ........................... 97 IPC15 (Interrupt Priority Control 15) ........................... 98 IPC16 (Interrupt Priority Control 16) ........................... 98 IPC18 (Interrupt Priority Control 18) ........................... 99 IPC2 (Interrupt Priority Control 2) ............................... 92 IPC3 (Interrupt Priority Control 3) ............................... 93 IPC4 (Interrupt Priority Control 4) ............................... 94 IPC5 (Interrupt Priority Control 5) ............................... 95 IPC7 (Interrupt Priority Control 7) ............................... 96 NVMCON (Flash Memory Control) ............................. 59 NVMKEY (Nonvolatile Memory Key) .......................... 60 OCxCON (Output Compare x Control) ..................... 157 OSCCON (Oscillator Control) ................................... 106 OSCTUN (FRC Oscillator Tuning) ............................ 110 P1DC2 (PWM Duty Cycle 2)..................................... 171 P1DC3 (PWM Duty Cycle 3)..................................... 171 PDC1 (PWM Duty Cycle 1)....................................... 171 PLLFBD (PLL Feedback Divisor).............................. 109 PMD1 (Peripheral Module Disable Control Register 1) ........................................................ 115 PMD1 (Peripheral Module Disable Control Register 1) .. 115 PMD2 (Peripheral Module Disable Control Register 2) ........................................................ 116 PMD3 (Peripheral Module Disable Control Register 3) ........................................................ 117 PMD3 (Peripheral Module Disable Control Register 3) .. 117 PTCON (PWM Time Base Control) .......................... 162 PTMR (PWM Timer Count Value)............................. 163 PTPER (PWM Time Base Period) ............................ 163 PWMxCON1 (PWM Control 1).................................. 165 PWMxCON2 (PWM Control 2).................................. 166 PxDTCON1 (Dead-Time Control 1) .......................... 167 PxDTCON2 (Dead-Time Control 2) .......................... 168 PxFLTACON (Fault A Control).................................. 169 PxOVDCON (Override Control) ................................ 170 PxSECMP (Special Event Compare)........................ 164 QEICON (QEI Control).............................................. 175 RCON (Reset Control) ................................................ 64 SPIxCON1 (SPIx Control 1)...................................... 181 SPIxCON2 (SPIx Control 2)...................................... 183 SPIxSTAT (SPIx Status and Control) ....................... 180 SR (CPU Status)................................................... 22, 76 T1CON (Timer1 Control) .......................................... 146 T2CON Control)........................................................ 150 T3CON Control......................................................... 151 UxMODE (UARTx Mode) ......................................... 194 UxSTA (UARTx Status and Control) ........................ 196 Reset Illegal Opcode....................................................... 63, 70 Trap Conflict ......................................................... 69, 70 Uninitialized W Register ....................................... 63, 70 Reset Sequence ................................................................. 71 Resets ................................................................................ 63 S Serial Peripheral Interface (SPI) ....................................... 179 Software Reset Instruction (SWR)...................................... 69 Software Simulator (MPLAB SIM) .................................... 229 Software Stack Pointer, Frame Pointer CALLL Stack Frame ................................................... 48 Special Features of the CPU ............................................ 211 SPI Module SPI1 Register Map ..................................................... 41 Symbols Used in Opcode Descriptions ............................ 220 System Control Register Map .............................................................. 46 T Temperature and Voltage Specifications AC..................................................................... 242, 274 Timer1 .............................................................................. 145 Timer2/3 ........................................................................... 147 Timing Characteristics CLKO and I/O ........................................................... 245 Timing Diagrams 10-bit ADC Conversion (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)......................... 269 10-bit ADC Conversion (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)....................................... 269 12-bit ADC Conversion (ASAM = 0, SSRC<2:0> = 000) ........................................... 268 Brown-out Situations .................................................. 69 External Clock .......................................................... 243 I2Cx Bus Data (Master Mode) .................................. 261 I2Cx Bus Data (Slave Mode) .................................... 263 I2Cx Bus Start/Stop Bits (Master Mode)................... 261 I2Cx Bus Start/Stop Bits (Slave Mode)..................... 263 Input Capture (CAPx) ............................................... 251 Motor Control PWM .................................................. 253 Motor Control PWM Fault ......................................... 253 OC/PWM .................................................................. 252 Output Compare (OCx) ............................................ 251 QEA/QEB Input ........................................................ 254 QEI Module Index Pulse........................................... 255 Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer ......................................... 246 SPIx Master Mode (CKE = 0) ................................... 256 SPIx Master Mode (CKE = 1) ................................... 257 SPIx Slave Mode (CKE = 0) ..................................... 258 SPIx Slave Mode (CKE = 1) ..................................... 259 Timer1, 2, 3 External Clock ...................................... 248 TimerQ (QEI Module) External Clock ....................... 250 Timing Requirements ADC Conversion (10-bit mode) ................................ 279 ADC Conversion (12-bit Mode) ................................ 279 CLKO and I/O ........................................................... 245 External Clock .......................................................... 243 (c) 2011 Microchip Technology Inc. DS70283H-page 315 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Input Capture ............................................................ 251 SPIx Master Mode (CKE = 0).................................... 275 SPIx Module Master Mode (CKE = 1)....................... 275 SPIx Module Slave Mode (CKE = 0)......................... 276 SPIx Module Slave Mode (CKE = 1)......................... 276 Timing Specifications 10-bit ADC Conversion Requirements ...................... 270 12-bit ADC Conversion Requirements ...................... 268 I2Cx Bus Data Requirements (Master Mode) ........... 262 I2Cx Bus Data Requirements (Slave Mode) ............. 264 Motor Control PWM Requirements ........................... 253 Output Compare Requirements ................................ 251 PLL Clock.......................................................... 244, 274 QEI External Clock Requirements ............................ 250 QEI Index Pulse Requirements................................. 255 Quadrature Decoder Requirements .......................... 254 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements ......................................... 247 Simple OC/PWM Mode Requirements ..................... 252 SPIx Master Mode (CKE = 0) Requirements ............ 256 SPIx Master Mode (CKE = 1) Requirements ............ 257 SPIx Slave Mode (CKE = 0) Requirements.............. 258 SPIx Slave Mode (CKE = 1) Requirements.............. 260 Timer1 External Clock Requirements ....................... 248 Timer2 External Clock Requirements ....................... 249 Timer3 External Clock Requirements ....................... 249 U UART Module UART1 Register Map.................................................. 41 Universal Asynchronous Receiver Transmitter (UART) ... 193 Using the RCON Status Bits............................................... 70 V Voltage Regulator (On-Chip) ............................................ 215 W Watchdog Time-out Reset (WDTR).................................... 69 Watchdog Timer (WDT)............................................ 211, 216 Programming Considerations ................................... 216 WWW Address ................................................................. 303 WWW, On-Line Support ..................................................... 10 DS70283H-page 316 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. (c) 2011 Microchip Technology Inc. DS70283H-page 317 dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS70283H FAX: (______) _________ - _________ Device: dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70283H-page 318 (c) 2011 Microchip Technology Inc. dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. dsPIC 33 FJ 32 MC2 02 T E / SP - XXX Microchip Trademark Architecture Flash Memory Family Program Memory Size (KB) Product Group Pin Count Tape and Reel Flag (if applicable) Temperature Range Package Pattern Examples: a) dsPIC33FJ32MC202-E/SP: Motor Control dsPIC33, 32 KB program memory, 28-pin, Extended temp., SPDIP package. Architecture: 33 = 16-bit Digital Signal Controller Flash Memory Family: FJ = Flash program memory, 3.3V Product Group: MC2 MC3 = = Motor Control family Motor Control family Pin Count: 02 04 = = 28-pin 44-pin Temperature Range: I E H = = = -40 C to+85 C (Industrial) -40 C to+125 C (Extended) -40 C to+150 C (High) Package: SP SO SS ML PT MM = = = = = = Skinny Plastic Dual In-Line - 300 mil body (SPDIP) Plastic Small Outline - Wide - 300 mil body (SOIC) Plastic Shrink Small Outline - 5.3 mm body (SSOP) Plastic Quad, No Lead Package - 6x6 mm body (QFN) Plastic Thing Quad Flatpack - 10x10x1 mm body (TQFP) Plastic Quad, No Lead Package - 6x6 mm body (QFN-S) (c) 2011 Microchip Technology Inc. DS70283H-page 319 Worldwide Sales and Service AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-213-7830 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 08/04/10 DS70283H-page 320 (c) 2011 Microchip Technology Inc. |
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